LIGHT EMITTING DEVICE PACKAGE AND DISPLAY DEVICE USING THE SAME

    公开(公告)号:US20190189876A1

    公开(公告)日:2019-06-20

    申请号:US15995546

    申请日:2018-06-01

    Abstract: A light emitting device package including a cell array including first, second and third light emitting devices each including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, the cell array having a first surface and a second surface opposing the first surface, a light-transmissive substrate including a first wavelength conversion portion and a second wavelength conversion portion corresponding to the first light emitting device and the second light emitting device, respectively, and bonded to the first surface, and a eutectic bonding layer including a first light emitting window, a second light emitting window and a third light emitting window corresponding to the first light emitting device, the second light emitting device and the third light emitting device, respectively, and bonding the light-transmissive substrate and the first to third light emitting devices to each other may be provided.

    Semiconductor light emitting device and manufacturing method thereof
    15.
    发明授权
    Semiconductor light emitting device and manufacturing method thereof 有权
    半导体发光器件及其制造方法

    公开(公告)号:US09553235B2

    公开(公告)日:2017-01-24

    申请号:US14627721

    申请日:2015-02-20

    Abstract: A method for manufacturing a semiconductor light emitting device may include steps of forming a mask layer and a mold layer having a plurality of openings exposing portions of a base layer, forming a plurality of first conductivity-type semiconductor cores each including a body portion extending through each of the openings from the base layer and a tip portion disposed on the body portion and having a conical shape, and forming an active layer and a second conductivity-type semiconductor layer on each of the plurality of first conductivity-type semiconductor cores. The step of forming the plurality of first conductivity-type semiconductor cores may include forming a first region such that a vertex of the tip portion is positioned on a central vertical axis of the body portion, removing the mold layer, and forming an additional growth region on the first region such that the body portion has a hexagonal prism shape.

    Abstract translation: 半导体发光器件的制造方法可以包括以下步骤:形成掩模层和模具层,所述模具层具有暴露基底层的部分的多个开口,形成多个第一导电型半导体芯,每个第一导电型半导体芯包括主体部分延伸穿过 从底层开口的每个开口和设置在主体部分上的具有圆锥形状的尖端部分,并且在多个第一导电型半导体芯中的每一个上形成有源层和第二导电类型半导体层。 形成多个第一导电型半导体芯的步骤可以包括形成第一区域,使得尖端部分的顶点位于主体部分的中心垂直轴线上,去除模具层,并形成附加生长区域 在第一区域上使得主体部分具有六棱柱形状。

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