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公开(公告)号:US20200016827A1
公开(公告)日:2020-01-16
申请号:US16495327
申请日:2018-03-07
申请人: Yasuyuki YAMASHITA , Akira SAITO , Sohichiroh IIDA , Hitoshi IWATSUKI , Yasuo SUZUKI , Nozomu TAMOTO , Kiichi KAMODA , Shigenori YAGUCHI , Shinzo HIGUCHI , Toshiyuki ISEKI , Yasutomo AMAN , Toshiyuki MUTOH , Mitsuru NARUSE
发明人: Yasuyuki YAMASHITA , Akira SAITO , Sohichiroh IIDA , Hitoshi IWATSUKI , Yasuo SUZUKI , Nozomu TAMOTO , Kiichi KAMODA , Shigenori YAGUCHI , Shinzo HIGUCHI , Toshiyuki ISEKI , Yasutomo AMAN , Toshiyuki MUTOH , Mitsuru NARUSE
IPC分类号: B29C64/153 , B33Y10/00 , B33Y30/00 , B33Y70/00 , C08J3/12
摘要: Provided is a resin powder for producing a three-dimensional object, wherein the resin powder has a number-average equivalent circle diameter of 10 micrometers or greater but 150 micrometers or less, and wherein a median in an equivalent circle diameter-based particle size distribution of the resin powder is higher than the average equivalent circle diameter.
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12.
公开(公告)号:US20180147780A1
公开(公告)日:2018-05-31
申请号:US15822775
申请日:2017-11-27
申请人: Kiichi KAMODA , Yasuyuki YAMASHITA , Akira SAITO , Sohichiroh IIDA , Shinzo HIGUCHI , Hitoshi IWATSUKI , Nozomu TAMOTO , Yasuo SUZUKI
发明人: Kiichi KAMODA , Yasuyuki YAMASHITA , Akira SAITO , Sohichiroh IIDA , Shinzo HIGUCHI , Hitoshi IWATSUKI , Nozomu TAMOTO , Yasuo SUZUKI
IPC分类号: B29C64/153 , B33Y10/00 , B33Y30/00
CPC分类号: B29C64/153 , B29C64/268 , B29K2995/0094 , B33Y10/00 , B33Y30/00 , B33Y70/00
摘要: A method of manufacturing a solid freeform fabrication object includes forming a layer of resin powder for solid freeform fabrication including particles having a pillar-like form and solidifying a particular area of the layer with irradiation of laser beams, wherein the laser beams have an energy intensity distribution having a top hat-like form.
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公开(公告)号:US20180023219A1
公开(公告)日:2018-01-25
申请号:US15656214
申请日:2017-07-21
申请人: Akira SAITO , Shigenori YAGUCHI , Yasuyuki YAMASHITA , Kiichi KAMODA , Yasuo SUZUKI , Nozomu TAMOTO , Hitoshi IWATSUKI , Shinzo HIGUCHI , Sohichiroh IIDA
发明人: Akira SAITO , Shigenori YAGUCHI , Yasuyuki YAMASHITA , Kiichi KAMODA , Yasuo SUZUKI , Nozomu TAMOTO , Hitoshi IWATSUKI , Shinzo HIGUCHI , Sohichiroh IIDA
IPC分类号: D01F6/66 , C08K5/1575 , D01F6/84 , D01F1/10 , D01F1/07 , B05D3/06 , D01F6/06 , C08K3/16 , C08K3/22 , C08K3/04 , C08K7/14 , C08K7/20 , C08K5/527 , D01F6/80
CPC分类号: D01F6/665 , B05D3/06 , B33Y70/00 , C08J3/12 , C08J2323/12 , C08J2329/14 , C08J2367/02 , C08J2371/00 , C08J2377/06 , C08K3/046 , C08K3/16 , C08K3/2279 , C08K5/1575 , C08K5/527 , C08K7/14 , C08K7/20 , D01F1/07 , D01F1/10 , D01F6/06 , D01F6/66 , D01F6/80 , D01F6/84
摘要: A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.
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公开(公告)号:US20180022024A1
公开(公告)日:2018-01-25
申请号:US15656248
申请日:2017-07-21
申请人: Akira SAITO , Yasuyuki YAMASHITA , Kiichi KAMODA , Shigenori YAGUCHI , Nozomu TAMOTO , Hitoshi IWATSUKI , Shinzo HIGUCHI , Sohichiroh llDA , Yasuo SUZUKI
发明人: Akira SAITO , Yasuyuki YAMASHITA , Kiichi KAMODA , Shigenori YAGUCHI , Nozomu TAMOTO , Hitoshi IWATSUKI , Shinzo HIGUCHI , Sohichiroh llDA , Yasuo SUZUKI
IPC分类号: B29C64/153 , C08G69/26 , C08F110/06 , B33Y70/00 , C08G67/00 , C08K3/00 , C08K5/00 , C08G63/183 , C08G8/02
CPC分类号: B29C64/153 , B29K2101/12 , B29K2105/251 , B29K2995/0041 , B33Y10/00 , B33Y70/00 , C08F110/06 , C08G8/02 , C08G63/183 , C08G67/00 , C08G69/26 , C08J3/12 , C08J2361/00 , C08J2361/16 , C08J2367/02 , C08J2367/04 , C08J2377/02 , C08J2377/08 , C08J2377/10 , C08K3/016 , C08K5/0066
摘要: A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 μm and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1−Tmf2)≧3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1−Cd2)≧3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): C×1>C×2 and (C1−C2)≧3 percent.
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公开(公告)号:US20170217087A1
公开(公告)日:2017-08-03
申请号:US15412427
申请日:2017-01-23
申请人: Nozomu TAMOTO , Yasuo SUZUKI , Akira SAITO , Mitsuru NARUSE , Shinzo HIGUCHI
发明人: Nozomu TAMOTO , Yasuo SUZUKI , Akira SAITO , Mitsuru NARUSE , Shinzo HIGUCHI
CPC分类号: B33Y10/00 , B29B7/002 , B29B9/02 , B29B9/06 , B29B9/16 , B29B2009/163 , B29C64/106 , B29K2029/04 , B29K2105/251 , B29K2995/0062 , B33Y70/00 , B33Y80/00
摘要: A solid freeform fabrication material includes a water-soluble core material and a water-insoluble coating material formed on the surface of the water-soluble core material.
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16.
公开(公告)号:US20090209503A1
公开(公告)日:2009-08-20
申请号:US12430597
申请日:2009-04-27
IPC分类号: A61K31/56 , A61K31/198 , A61P1/00
CPC分类号: A61K31/19 , A61K31/198 , A61K31/56
摘要: The present invention discloses a therapeutic agent for inflammatory bowel disease, which is in the from of delivering 1 to 5 g of glutamine to the large intestine per one administration; and the therapeutic agent for inflammatory bowel disease with which an anti-inflammatory agent(s) is combined. This therapeutic agent for inflammatory bowel disease can safely and effectively treat inflammatory bowel disease including ulcerative colitis without increasing the frequency of bowel movements.
摘要翻译: 本发明公开了一种用于炎症性肠病的治疗剂,其是每次给药向大肠递送1至5g谷氨酰胺; 和抗炎剂组合的炎症性肠病治疗剂。 这种炎症性肠病治疗剂可以安全有效地治疗包括溃疡性结肠炎在内的炎性肠病,而不增加排便的频率。
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公开(公告)号:US20090022968A1
公开(公告)日:2009-01-22
申请号:US12174766
申请日:2008-07-17
申请人: Yasuo SUZUKI , Naohiro MOROZUMI
发明人: Yasuo SUZUKI , Naohiro MOROZUMI
CPC分类号: B29C51/16 , B29C51/08 , B29C51/14 , B29C2035/0822 , B29C2791/006 , B29C2791/007 , B29L2031/30 , C09J7/29 , C09J2201/36 , Y10T428/24959 , Y10T428/265 , Y10T428/266 , Y10T428/2848
摘要: A decorative sheet is designed for use to decorate a formed product. The sheet includes a decoration layer, a base member that supports the decoration layer, and an adhesive layer arranged to adhere the decoration layer and the base member onto the body of the formed product. The adhesive layer includes a first adhesive layer and a second adhesive layer, which is arranged between the first adhesive layer and the base member and which has a melting point that is higher than that of the first adhesive layer by about 18° C. to about 40° C.
摘要翻译: 装饰板被设计用于装饰成形的产品。 该片材包括装饰层,支撑装饰层的基底构件和布置成将装饰层和基底构件粘附到成形制品的主体上的粘合剂层。 粘合剂层包括第一粘合剂层和第二粘合剂层,其被布置在第一粘合剂层和基材之间,并且其熔点比第一粘合剂层的熔点高约18℃至约 40°C
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公开(公告)号:US20080254223A1
公开(公告)日:2008-10-16
申请号:US12046963
申请日:2008-03-12
申请人: Kenji GOTO , Takuya KAWASHIMA , Nobuo TANABE , Yasuo SUZUKI
发明人: Kenji GOTO , Takuya KAWASHIMA , Nobuo TANABE , Yasuo SUZUKI
CPC分类号: C23C18/02 , C03C17/001 , C03C17/002 , C03C17/25 , C03C17/253 , C03C2217/231 , C03C2217/24 , C03C2218/112 , C23C18/1216 , C23C18/1258 , H01L31/1884 , Y02E10/50
摘要: A film forming apparatus is provided which includes a device A that generates liquid fine particles having controlled particle diameters; a device B including a via for guiding the generated liquid fine particles while controlling a temperature thereof; a device C that sprays the guided liquid fine particles; and a device D including a space for forming a transparent conductive film by coating the sprayed liquid fine particles onto a subject to be processed.
摘要翻译: 提供一种成膜装置,其包括产生具有受控粒径的液体微粒的装置A; 装置B,其包括用于在控制其温度的同时引导所产生的液体微粒的通孔; 喷射引导液体微粒的装置C; 以及通过将被喷射的液体微粒涂覆到待处理对象上而具有用于形成透明导电膜的空间的装置D.
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公开(公告)号:US20240003844A1
公开(公告)日:2024-01-04
申请号:US18368179
申请日:2023-09-14
发明人: Yasuo SUZUKI , Shota USHIBA , Naruto MIYAKAWA , Takao ONO , Kazuhiko MATSUMOTO
IPC分类号: G01N27/414
CPC分类号: G01N27/4145 , G01N27/4146
摘要: A biosensor is a field-effect transistor-based biosensor including an insulating substrate, and a measurement sensor and a reference sensor on the insulating substrate. A probe molecule is in the measurement sensor. The probe molecule has a first basic moiety in the measurement sensor, and a recognition moiety with a first end bound to the first basic moiety and a second end defining a distal end of the probe molecule. A second basic moiety is in the reference sensor and has a same structure as that of the first basic moiety of the probe molecule in the measurement sensor. The recognition moiety of the probe molecule in the measurement sensor is absent at the distal end of the second basic moiety.
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公开(公告)号:US20180273756A1
公开(公告)日:2018-09-27
申请号:US15991595
申请日:2018-05-29
申请人: Akira SAITO , Yasuo SUZUKI , Mitsuru NARUSE , Nozomu TAMOTO , Shinzo HIGUCHI
发明人: Akira SAITO , Yasuo SUZUKI , Mitsuru NARUSE , Nozomu TAMOTO , Shinzo HIGUCHI
IPC分类号: C08L101/14 , C08L1/08 , C08L3/04 , C08L29/04 , C08L33/02 , C08L39/06 , C08L71/02 , C08K5/09 , C08K5/1545 , B29C64/40
CPC分类号: C08L101/14 , B29C64/118 , B29C64/40 , B33Y10/00 , B33Y40/00 , B33Y70/00 , C08K5/09 , C08K5/092 , C08K5/1545 , C08K13/02 , C08L1/08 , C08L3/04 , C08L29/04 , C08L33/02 , C08L39/06 , C08L71/02 , C08K5/04 , C08L1/02
摘要: Provided is a water-disintegrable resin composition including at least a water-soluble resin (A) and an acidic substance (B).
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