公开(公告)号：US20180022024A1

公开(公告)日：2018-01-25

申请号：US15656248

申请日：2017-07-21

申请人： Akira SAITO ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Shigenori YAGUCHI ,  Nozomu TAMOTO ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Sohichiroh llDA ,  Yasuo SUZUKI

发明人： Akira SAITO ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Shigenori YAGUCHI ,  Nozomu TAMOTO ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Sohichiroh llDA ,  Yasuo SUZUKI

IPC分类号： B29C64/153 ,  C08G69/26 ,  C08F110/06 ,  B33Y70/00 ,  C08G67/00 ,  C08K3/00 ,  C08K5/00 ,  C08G63/183 ,  C08G8/02

CPC分类号： B29C64/153 ,  B29K2101/12 ,  B29K2105/251 ,  B29K2995/0041 ,  B33Y10/00 ,  B33Y70/00 ,  C08F110/06 ,  C08G8/02 ,  C08G63/183 ,  C08G67/00 ,  C08G69/26 ,  C08J3/12 ,  C08J2361/00 ,  C08J2361/16 ,  C08J2367/02 ,  C08J2367/04 ,  C08J2377/02 ,  C08J2377/08 ,  C08J2377/10 ,  C08K3/016 ,  C08K5/0066

摘要： A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 μm and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1−Tmf2)≧3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1−Cd2)≧3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): C×1>C×2 and (C1−C2)≧3 percent.

公开(公告)号：US20200016827A1

公开(公告)日：2020-01-16

申请号：US16495327

申请日：2018-03-07

申请人： Yasuyuki YAMASHITA ,  Akira SAITO ,  Sohichiroh IIDA ,  Hitoshi IWATSUKI ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Kiichi KAMODA ,  Shigenori YAGUCHI ,  Shinzo HIGUCHI ,  Toshiyuki ISEKI ,  Yasutomo AMAN ,  Toshiyuki MUTOH ,  Mitsuru NARUSE

发明人： Yasuyuki YAMASHITA ,  Akira SAITO ,  Sohichiroh IIDA ,  Hitoshi IWATSUKI ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Kiichi KAMODA ,  Shigenori YAGUCHI ,  Shinzo HIGUCHI ,  Toshiyuki ISEKI ,  Yasutomo AMAN ,  Toshiyuki MUTOH ,  Mitsuru NARUSE

IPC分类号： B29C64/153 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08J3/12

摘要： Provided is a resin powder for producing a three-dimensional object, wherein the resin powder has a number-average equivalent circle diameter of 10 micrometers or greater but 150 micrometers or less, and wherein a median in an equivalent circle diameter-based particle size distribution of the resin powder is higher than the average equivalent circle diameter.

公开(公告)号：US20180023219A1

公开(公告)日：2018-01-25

申请号：US15656214

申请日：2017-07-21

申请人： Akira SAITO ,  Shigenori YAGUCHI ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Sohichiroh IIDA

发明人： Akira SAITO ,  Shigenori YAGUCHI ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Sohichiroh IIDA

IPC分类号： D01F6/66 ,  C08K5/1575 ,  D01F6/84 ,  D01F1/10 ,  D01F1/07 ,  B05D3/06 ,  D01F6/06 ,  C08K3/16 ,  C08K3/22 ,  C08K3/04 ,  C08K7/14 ,  C08K7/20 ,  C08K5/527 ,  D01F6/80

CPC分类号： D01F6/665 ,  B05D3/06 ,  B33Y70/00 ,  C08J3/12 ,  C08J2323/12 ,  C08J2329/14 ,  C08J2367/02 ,  C08J2371/00 ,  C08J2377/06 ,  C08K3/046 ,  C08K3/16 ,  C08K3/2279 ,  C08K5/1575 ,  C08K5/527 ,  C08K7/14 ,  C08K7/20 ,  D01F1/07 ,  D01F1/10 ,  D01F6/06 ,  D01F6/66 ,  D01F6/80 ,  D01F6/84

摘要： A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

公开(公告)号：US20180147780A1

公开(公告)日：2018-05-31

申请号：US15822775

申请日：2017-11-27

申请人： Kiichi KAMODA ,  Yasuyuki YAMASHITA ,  Akira SAITO ,  Sohichiroh IIDA ,  Shinzo HIGUCHI ,  Hitoshi IWATSUKI ,  Nozomu TAMOTO ,  Yasuo SUZUKI

发明人： Kiichi KAMODA ,  Yasuyuki YAMASHITA ,  Akira SAITO ,  Sohichiroh IIDA ,  Shinzo HIGUCHI ,  Hitoshi IWATSUKI ,  Nozomu TAMOTO ,  Yasuo SUZUKI

IPC分类号： B29C64/153 ,  B33Y10/00 ,  B33Y30/00

CPC分类号： B29C64/153 ,  B29C64/268 ,  B29K2995/0094 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00

摘要： A method of manufacturing a solid freeform fabrication object includes forming a layer of resin powder for solid freeform fabrication including particles having a pillar-like form and solidifying a particular area of the layer with irradiation of laser beams, wherein the laser beams have an energy intensity distribution having a top hat-like form.

公开(公告)号：US20180264720A1

公开(公告)日：2018-09-20

申请号：US15917993

申请日：2018-03-12

申请人： Nozomu TAMOTO ,  Sohichiroh IIDA ,  Akira SAITO ,  Yasuyuki YAMASHITA ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Kiichi KAMODA

发明人： Nozomu TAMOTO ,  Sohichiroh IIDA ,  Akira SAITO ,  Yasuyuki YAMASHITA ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Kiichi KAMODA

IPC分类号： B29C64/153 ,  B33Y70/00 ,  B33Y30/00 ,  B29B9/06 ,  B29B9/12 ,  B29C64/165 ,  B29C64/205 ,  B29C64/268 ,  C08K5/13 ,  C08K5/524 ,  C08K3/36 ,  C08G69/26 ,  C08F110/06 ,  C08G65/40 ,  C08G63/183

CPC分类号： B29C64/153 ,  B29B9/06 ,  B29B9/12 ,  B29B9/16 ,  B29B2009/125 ,  B29C64/10 ,  B29C64/165 ,  B29C64/205 ,  B29C64/268 ,  B29K2023/12 ,  B29K2059/00 ,  B29K2067/006 ,  B29K2071/00 ,  B29K2077/00 ,  B29K2995/0077 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08F110/06 ,  C08G63/183 ,  C08G65/40 ,  C08G69/26 ,  C08K3/36 ,  C08K5/13 ,  C08K5/524

摘要： A resin powder for solid freeform fabrication contains pillar-like form particles having an average circularity of 0.83 or greater in a particle diameter range of from 0.5 to 200 μm.

公开(公告)号：US20180355144A1

公开(公告)日：2018-12-13

申请号：US16007064

申请日：2018-06-13

申请人： Akira SAITO ,  Shigenori YAGUCHI ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Shinzo HIGUCHI ,  Hitoshi IWATSUKI

发明人： Akira SAITO ,  Shigenori YAGUCHI ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Shinzo HIGUCHI ,  Hitoshi IWATSUKI

IPC分类号： C08K5/05 ,  B29C64/153 ,  B33Y70/00 ,  C08K5/52 ,  C08K5/09 ,  C08K5/1575 ,  C08K5/372 ,  C08K5/521

CPC分类号： C08K5/05 ,  B29C64/153 ,  B29K2023/12 ,  B29K2067/006 ,  B29K2071/00 ,  B29K2071/02 ,  B29K2077/00 ,  B29K2105/0017 ,  B29K2105/0094 ,  B29K2105/251 ,  B29K2995/0077 ,  B29K2995/0094 ,  B29K2995/0098 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08K5/09 ,  C08K5/1575 ,  C08K5/372 ,  C08K5/52 ,  C08K5/521 ,  C08L23/12 ,  C08L59/00 ,  C08L67/02 ,  C08L71/00 ,  C08L77/06 ,  C08K5/005 ,  C08K13/02

摘要： A resin powder for solid freeform fabrication, having a melting point of 100 degrees C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.

公开(公告)号：US20210283895A1

公开(公告)日：2021-09-16

申请号：US17335536

申请日：2021-06-01

申请人： Akira SAITO ,  Shigenori YAGUCHI ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Shinzo HIGUCHI ,  Hitoshi IWATSUKI

发明人： Akira SAITO ,  Shigenori YAGUCHI ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Shinzo HIGUCHI ,  Hitoshi IWATSUKI

IPC分类号： B33Y70/00 ,  C08K5/52 ,  C08K5/09 ,  C08K5/1575 ,  C08K5/372 ,  C08K5/521 ,  B29C64/153 ,  C08L71/00 ,  C08L77/06 ,  C08L59/00 ,  B33Y10/00 ,  C08L77/02 ,  C08K5/00

摘要： A resin powder for solid freeform fabrication, having a ratio (Mv/Mn) of 2.00 or less, where Mv represents a volume average particle diameter and Mn represents a number average particle diameter and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.

公开(公告)号：US20190126538A1

公开(公告)日：2019-05-02

申请号：US16056855

申请日：2018-08-07

申请人： Takashi FUJITA ,  Akira SAITO ,  Kiichi KAMODA ,  Yasutada SHITARA ,  Kazuhiko WATANABE ,  Hitoshi IWATSUKI ,  Yuuya ENDOH ,  Kazufumi KIMURA ,  Yasuyuki YAMASHITA ,  Shinnosuke KOSHIZUKA ,  Yuuki KAMON ,  Nozomu TAMOTO

发明人： Takashi FUJITA ,  Akira SAITO ,  Kiichi KAMODA ,  Yasutada SHITARA ,  Kazuhiko WATANABE ,  Hitoshi IWATSUKI ,  Yuuya ENDOH ,  Kazufumi KIMURA ,  Yasuyuki YAMASHITA ,  Shinnosuke KOSHIZUKA ,  Yuuki KAMON ,  Nozomu TAMOTO

IPC分类号： B29C64/147 ,  B29C64/218 ,  B29C64/40

摘要： A fabrication method includes laminating a fabrication material to form an object, and applying a release material on a surface of the object to form a release layer on the surface of the object. A surface free energy of the release material is equal to or smaller than 25 mN/m.

公开(公告)号：US20190134853A1

公开(公告)日：2019-05-09

申请号：US16184244

申请日：2018-11-08

申请人： Hitoshi IWATSUKI ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Toshiyuki MUTOH ,  Yasutomo AMAN ,  Toshiyuki ISEKI ,  Mitsuru NARUSE ,  Akira SAITO ,  Shinzo HIGUCHI ,  Sohichiroh IIDA

发明人： Hitoshi IWATSUKI ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Toshiyuki MUTOH ,  Yasutomo AMAN ,  Toshiyuki ISEKI ,  Mitsuru NARUSE ,  Akira SAITO ,  Shinzo HIGUCHI ,  Sohichiroh IIDA

IPC分类号： B29B9/12 ,  B29C64/153 ,  B33Y70/00

摘要： A particle for solid freeform fabrication having a columnar form has end surfaces and a side surface, wherein one of the end surfaces partially covers the side surface.

公开(公告)号：US20160271879A1

公开(公告)日：2016-09-22

申请号：US15065161

申请日：2016-03-09

申请人： Yasuyuki YAMASHITA ,  Yasuo SUZUKI ,  Mitsuru NARUSE ,  Nozomu TAMOTO ,  Shigenori YAGUCHI ,  Hitoshi IWATSUKI ,  Kazumi OHTAKI

发明人： Yasuyuki YAMASHITA ,  Yasuo SUZUKI ,  Mitsuru NARUSE ,  Nozomu TAMOTO ,  Shigenori YAGUCHI ,  Hitoshi IWATSUKI ,  Kazumi OHTAKI

IPC分类号： B29C67/00

CPC分类号： B29C64/165 ,  B22F1/0062 ,  B22F3/003 ,  B22F3/008 ,  B29C64/20 ,  B29K2029/04 ,  B29L2031/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C04B35/00 ,  C09D129/04

摘要： A powder material for three-dimensional modeling includes a base particle and a coverage film including an organic material. The coverage film covers the base particle. The powder material is used for three dimensional modeling and when the coverage film is dissolved in a solvent to prepare a solution and the solution is formed into a coated film on a smooth surface, the coated film has a wetting tension of from 22 mN/m to 28 mN/m.

摘要翻译： 用于三维建模的粉末材料包括基础颗粒和包括有机材料的覆盖膜。 覆盖膜覆盖基础颗粒。 粉末材料用于三维建模，当覆盖膜溶解在溶剂中以制备溶液并将溶液形成为光滑表面上的涂膜时，涂膜的润湿张力为22mN / m 至28 mN / m。