Light-emitting semiconductor device using group III nitrogen compound
    11.
    发明授权
    Light-emitting semiconductor device using group III nitrogen compound 有权
    使用III族氮化合物的发光半导体器件

    公开(公告)号:US07867800B2

    公开(公告)日:2011-01-11

    申请号:US12003173

    申请日:2007-12-20

    IPC分类号: H01L21/00

    摘要: A light-emitting semiconductor device (10) consecutively includes a sapphire substrate (1), an AlN buffer layer (2), a silicon (Si) doped GaN n+-layer (3) of high carrier (n-type) concentration, a Si-doped (Alx3Ga1−x3)y3In1−y3N n+-layer (4) of high carrier (n-type) concentration, a zinc (Zn) and Si-doped (Alx2Ga1−x2)y2In1−y2N emission layer (5), and a Mg-doped (Alx1Ga1−x1)y1In1−y1N p-layer (6). The AlN layer (2) has a 500 Å thickness. The GaN n+-layer (3) has about a 2.0 μm thickness and a 2×1018/cm3 electron concentration. The n+-layer (4) has about a 2.0 μm thickness and a 2×1018/cm3 electron concentration. The emission layer (5) has about a 0.5 μm thickness. The p-layer 6 has about a 1.0 μm thickness and a 2×1017/cm3 hole concentration. Nickel electrodes (7, 8) are connected to the p-layer (6) and n+-layer (4), respectively. A groove (9) electrically insulates the electrodes (7, 8). The composition ratio of Al, Ga, and In in each of the layers (4, 5, 6) is selected to meet the lattice constant of GaN in the n+-layer (3). The LED (10) is designed to improve luminous intensity and to obtain purer blue color.

    摘要翻译: 发光半导体器件(10)连续地包括蓝宝石衬底(1),AlN缓冲层(2),高载流子(n型)掺杂的硅(Si)掺杂的GaN n +层(3), 具有高载流子(n型)浓度的Si掺杂(Al x Ga 1-x 3)y 3 In 1-y 3 N n +层(4),锌(Zn)和Si掺杂(Alx2Ga1-x2)y2In1-y2N发射层(5) 和Mg掺杂(Al x Ga 1-x 1)y 1 In 1-y 1 N p层(6)。 AlN层(2)的厚度为500埃。 GaN n +层(3)的厚度约为2.0μm,电子浓度为2×1018 / cm3。 n +层(4)的厚度约为2.0μm,电子浓度为2×1018 / cm3。 发射层(5)的厚度约为0.5μm。 p层6的厚度约为1.0μm,空穴浓度为2×1017 / cm3。 镍电极(7,8)分别连接到p层(6)和n +层(4)。 一个凹槽(9)使电极(7,8)电绝缘。 选择各层(4,5,6)中的Al,Ga和In的组成比以满足n +层(3)中的GaN的晶格常数。 LED(10)被设计为提高发光强度并获得更纯的蓝色。

    Light-emitting semiconductor device using group III Nitrogen compound
having emission layer doped with donor and acceptor impurities
    13.
    发明授权
    Light-emitting semiconductor device using group III Nitrogen compound having emission layer doped with donor and acceptor impurities 失效
    使用III族氮化合物的发光半导体器件具有掺杂有供体和受主杂质的发射层

    公开(公告)号:US6005258A

    公开(公告)日:1999-12-21

    申请号:US806646

    申请日:1997-02-26

    摘要: A light-emitting semiconductor device (10) consecutively includes a sapphire substrate (1), an AlN buffer layer (2), a silicon (Si) doped GaN n.sup.+ -layer (3) of high carrier (n-type) concentration, a Si-doped (Al.sub.x3 Ga.sub.1-x3).sub.y3 In.sub.1-y3 N n.sup.+ -layer (4) of high carrier (n-type) concentration, a zinc (Zn) and Si-doped (Al.sub.x2 Ga.sub.1-x2).sub.y2 In.sub.1-y2 N emission layer (5), and a Mg-doped (Al.sub.x1 Ga.sub.1-x1).sub.y1 In.sub.1-y1 N p-layer (6). The AlN layer (2)--is 500 .ANG. in thickness. The GaN N.sup.+ -layer (3) is about 2.0 .mu.m in thickness and has an electron concentration of about 2.times.10.sup.18 /cm.sup.3. The n.sup.+ -layer (4) is about 2.0 .mu.m in thickness and has an electron concentration of about 2.times.10.sup.18 /cn.sup.3. The emission layer (5) is about 0.5 .mu.m in thickness. The p-layer 6 is about 1.0 .mu.m in thickness and has a hole concentration of about 2.times.10.sup.17 /cm.sup.3. Nickel electrodes (7, 8) are connected to the p-layer (6) and n.sup.+ -layer (4), respectively. A groove (9) electrically insulates the electrodes (7, 8) from each other. The composition ration of Al, Ga, and In in each of the layers (4, 5, 6) is selected to meet the lattice constant of GaN in the n.sup.+ -layer (3). The LED (10) is designed to improve luminous intensity and to obtain a purer blue color.

    摘要翻译: 发光半导体器件(10)连续地包括蓝宝石衬底(1),AlN缓冲层(2),高载流子(n型)掺杂的硅(Si)掺杂的GaN n +层(3), 具有高载流子(n型)浓度的Si掺杂(Al x Ga 1-x 3)y 3 In 1-y 3 N n +层(4),锌(Zn)和Si掺杂(Alx2Ga1-x2)y2In1-y2N发射层(5) 和Mg掺杂(Al x Ga 1-x 1)y 1 In 1-y 1 N p层(6)。 AlN层(2) - 厚度为500 ANGSTROM。 GaN N +层(3)的厚度约为2.0μm,电子浓度约为2×1018 / cm3。 n +层(4)的厚度约为2.0μm,电子浓度约为2×10 18 / cn 3。 发射层(5)的厚度约为0.5μm。 p层6的厚度为约1.0μm,并且具有约2×10 17 / cm 3的空穴浓度。 镍电极(7,8)分别连接到p层(6)和n +层(4)。 沟槽(9)将电极(7,8)彼此电绝缘。 选择各层(4,5,6)中的Al,Ga和In的组成比来满足n +层(3)中的GaN的晶格常数。 LED(10)被设计成改善发光强度并获得更纯的蓝色。

    Method for producing Group III nitride compound semiconductor
    14.
    发明授权
    Method for producing Group III nitride compound semiconductor 有权
    生产III族氮化物化合物半导体的方法

    公开(公告)号:US07112243B2

    公开(公告)日:2006-09-26

    申请号:US10200586

    申请日:2002-07-23

    IPC分类号: C30B29/38 H01L21/36

    摘要: The present invention provides a method for producing a Group III nitride compound semiconductor, which method permits only minimal reaction of the semiconductor with a hetero-substrate during epitaxial growth and induces no cracks in the Group III nitride compound semiconductor even when the semiconductor is cooled to room temperature. The method includes a buffer layer formation step for forming a gas-etchable buffer layer on the hetero-substrate, and a semiconductor formation step for epitaxially growing the Group III nitride compound semiconductor on the buffer layer through a vapor phase growth method, wherein at least a portion of the buffer layer is gas-etched during or after the semiconductor formation step.

    摘要翻译: 本发明提供了一种制造III族氮化物化合物半导体的方法,该方法在外延生长期间仅允许半导体与异质衬底的反应最小,并且即使当半导体被冷却到第三族氮化物半导体时也不引起裂纹 室内温度。 该方法包括用于在异质衬底上形成气体可蚀刻缓冲层的缓冲层形成步骤,以及用于通过气相生长法在缓冲层上外延生长III族氮化物半导体的半导体形成步骤,其中至少 在半导体形成步骤期间或之后,缓冲层的一部分被气蚀刻。

    Light-emitting device using group III nitride group compound semiconductor
    15.
    发明授权
    Light-emitting device using group III nitride group compound semiconductor 失效
    使用III族氮化物类化合物半导体的发光装置

    公开(公告)号:US07084421B2

    公开(公告)日:2006-08-01

    申请号:US09725496

    申请日:2000-11-30

    IPC分类号: H01L29/06

    摘要: A light-emitting semiconductor device provides an active layer which comprises thirteen (13) layers that includes six (6) pairs of quantum barrier layers made of Al0.95In0.05N and quantum well layers made of Al0.70In0.30N, which are laminated together alternately. The semiconductor device may also comprise a quantum well layer having a high composition ratio of indium (In). Forming the quantum barrier layer and the quantum well layer to have a high composition ratio of indium (In) increases the lattice constant of the active layer of the semiconductor device.

    摘要翻译: 一种发光半导体器件提供了一种有源层,其包括十三(13)层,其包括六(6)对量子阻挡层,所述量子势垒层由Al 0.95 N和N N N制成, 交替地层叠在一起的由Al 0.70 N 3 O 3 N制成的量子阱层。 半导体器件还可以包括具有高的铟(In)组成比的量子阱层。 形成量子势垒层和量子阱层以具有高的铟(In)组成比增加了半导体器件的有源层的晶格常数。

    Semiconductor device having group III nitride compound and enabling
control of emission color, and flat display comprising such device
    16.
    发明授权
    Semiconductor device having group III nitride compound and enabling control of emission color, and flat display comprising such device 失效
    具有III族氮化物化合物并且能够控制发光颜色的半导体器件,以及包括这种器件的平面显示器

    公开(公告)号:US5650641A

    公开(公告)日:1997-07-22

    申请号:US522110

    申请日:1995-08-31

    IPC分类号: H01L33/02 H01L33/32 H01L33/00

    CPC分类号: H01L33/325 H01L33/025

    摘要: A light-emitting semiconductor device (100) suitable for use in multi-color flat panel displays includes a sapphire substrate (1), an AlN buffer layer (2), a silicon (Si) doped GaN n.sup.+ -layer (3) of high carrier (n-type) concentration, a Si-doped (Al.sub.x2 Ga.sub.1 -x.sub.2).sub.y2 In.sub.1-2 N n.sup.+ -layer (4) of high carrier (n-type) concentration, a zinc (Zn) and Si-doped p-type (Al.sub.x1 Ga.sub.1-x1).sub.y1 In.sub.1-y1 N emission layer (5), and a Mg-doped (Al.sub.x2 Ga.sub.1-x2).sub.y2 In.sub.1-y2 N p-layer (6). The AlN layer (2) has a 500 .ANG. thickness. The GaN n.sup.+ -layer (3) is about a 2.0 .mu.m thick and has a 2.times.10.sup.18 /cm.sup.3 electron concentration. The n.sup.+ -layer (4) is about a 2.0 .mu.m in thickness and has a 2.times.10.sup.18 /cm.sup.3 electron concentration. The emission layer (5) is about 0.5 .mu.m thick. The p-layer 6 is about 1.0 .mu.m thick and has a 2.times.10.sup.17 /cm.sup.3 hole concentration. Nickel electrodes (7, 8) are connected to the p-layer (6) and n.sup.+ -layer (4), respectively. A groove (9) electrically insulates the electrodes (7, 8). Green light emission is obtained by this constitution. Further, only doping Zn of 5.times.10.sup.19 /cm.sup.3 into the emission layer (5) enables red light emission.

    摘要翻译: 适用于多色平板显示器的发光半导体器件(100)包括蓝宝石衬底(1),AlN缓冲层(2),掺杂硅(Si)的GaN n +层(3) 载流子(n型)浓度,高载流子(n型)浓度的Si掺杂(Alx2Ga1-x2)y2In1-2Nn +层(4),锌(Zn)和掺杂Si的p型(Al x Ga 1 -x1)y1In1-y1N发射层(5)和Mg掺杂(Alx2Ga1-x2)y2In1-y2N p层(6)。 AlN层(2)具有500厚度。 GaN n +层(3)的厚度约为2.0μm,电子浓度为2×10 18 / cm 3。 n +层(4)的厚度约为2.0μm,电子浓度为2×10 18 / cm 3。 发射层(5)厚约0.5μm。 p层6的厚度约为1.0μm,空穴浓度为2×10 17 / cm 3。 镍电极(7,8)分别连接到p层(6)和n +层(4)。 一个凹槽(9)使电极(7,8)电绝缘。 通过这种结构获得绿色发光。 此外,仅向发射层(5)掺杂5×10 19 / cm 3的Zn使得能够发红光。

    Light-emitting semiconductor device using a Group III nitride compound
and having a contact layer upon which an electrode is formed
    17.
    发明授权
    Light-emitting semiconductor device using a Group III nitride compound and having a contact layer upon which an electrode is formed 失效
    使用III族氮化物化合物并具有形成电极的接触层的发光半导体器件

    公开(公告)号:US5753939A

    公开(公告)日:1998-05-19

    申请号:US813393

    申请日:1997-03-07

    摘要: A light-emitting semiconductor device having an improved metal electrode and semiconductor structure that lowers the driving voltage of the device. The device has a hetero p-n junction structure. This structure includes: (1) an n-layer having n-type conduction and a Group III nitride compound semiconductor satisfying the formula Al.sub.x Ga.sub.y In.sub.1-x-y N, inclusive of x=0, y=0, and x=y=0; (2) a p-layer having p-type conduction and a Group III nitride compound semiconductor satisfying the formula Al.sub.x Ga.sub.y In.sub.1-x-y N, inclusive of x=0, y=0, and x=y=0; and (3) an emission layer disposed between the n-layer and the p-layer. The device also has a metal electrode and a contact layer that is disposed between the p-layer and the metal electrode. The contact layer is doped with an acceptor impurity more heavily that is the p-layer. The acceptor impurity may be magnesium (Mg). The contact layer may be doped within the range of 1.times.10.sup.20 /cm.sup.3 to 1.times.10.sup.2l /cm.sup.3 and may comprise a first and a second contact layer.

    摘要翻译: 一种具有改善的金属电极和半导体结构的发光半导体器件,其降低了器件的驱动电压。 该器件具有异质p-n结结构。 该结构包括:(1)具有n型导电的n层和满足式Al x Ga y In 1-x-y N的III族氮化物半导体,包括x = 0,y = 0,x = y = 0; (2)具有p型导电的p层和满足式Al x Ga y In 1-x-y N的III族氮化物半导体,包括x = 0,y = 0,x = y = 0; 和(3)设置在n层和p层之间的发射层。 该器件还具有设置在p层和金属电极之间的金属电极和接触层。 接触层掺杂较多的受体杂质,即p层。 受主杂质可以是镁(Mg)。 接触层可以掺杂在1×10 20 / cm 3至1×102l / cm 3的范围内,并且可以包括第一和第二接触层。

    Light-emitting semiconductor device using group III nitride compound
    18.
    发明授权
    Light-emitting semiconductor device using group III nitride compound 失效
    使用III族氮化物化合物的发光半导体器件

    公开(公告)号:US5652438A

    公开(公告)日:1997-07-29

    申请号:US504340

    申请日:1995-07-19

    摘要: A light-emitting semiconductor device (10) consecutively has a sapphire substrate (1), an AlN buffer layer (2), a silicon (Si) doped GaN n.sup.+ -layer (3) of high carrier (n-type) concentration, a Si-doped (Al.sub.X2 Ga.sub.1-x2).sub.y2 In.sub.1-y2 N n.sup.+ -layer (4) of high carrier (n-type) concentration, a zinc (Zn) and Si-doped (Al.sub.x1 Ga.sub.1-x1).sub.y1 In.sub.1-y1 N emission layer (5), and a Mg-doped (Al.sub.x2 Ga.sub.1-x2).sub.y2 In.sub.1-y2 N p-layer (6). The AlN buffer layer (2) has a 500 .ANG. thickness. The GaN n.sup.+ -layer (3) is about 2.0 .mu.m thick and has a 2.times.10.sup.18 /cm.sup.3 electron concentration. The n.sup.+ -layer (4) is about 2.0 .mu.m thick and has a 2.times.10.sup.18 /cm.sup.3 electron concentration. The emission layer (5) is about 0.5 .mu.m thick. The p-layer 6 is about 1.0 .mu.m thick and has a 2.times.10.sup.17 /cm.sup.3 hole concentration. Nickel electrodes (7, 8) are connected to the p-layer (6) and n.sup.+ -layer (4), respectively. A groove (9) electrically insulates the electrodes (7, 8). Lead lines (21, 22) are connected with the electrodes (7, 8) by a wedge bonding method to desirably reduce the surface area of the electrodes on the light-emitting side of the device upon which the electrodes are situated to thereby increase light emission from the device.

    摘要翻译: 发光半导体器件(10)连续地具有蓝宝石衬底(1),AlN缓冲层(2),高载流子(n型)掺杂的硅(Si)掺杂的GaN n +层(3), 锌(Zn)和Si掺杂(Al x Ga 1-x 1)y 1 In 1-y 1 N发射层(5)的Si掺杂(AlX2Ga1-x2)y2In1-y2N n +层(4) 和掺杂Mg的(Alx2Ga1-x2)y2In1-y2N p层(6)。 AlN缓冲层(2)具有500厚度。 GaN n +层(3)的厚度约为2.0μm,电子浓度为2×10 18 / cm 3。 n +层(4)的厚度约为2.0μm,电子浓度为2×10 18 / cm 3。 发射层(5)厚约0.5μm。 p层6的厚度约为1.0μm,空穴浓度为2×10 17 / cm 3。 镍电极(7,8)分别连接到p层(6)和n +层(4)。 一个凹槽(9)使电极(7,8)电绝缘。 引线(21,22)通过楔形接合方法与电极(7,8)连接,以期望减少电极位于其上的器件的发光侧的电极的表面积,从而增加光 从设备发射。

    WHITE LIGHT EMITTING DEVICE
    19.
    发明申请
    WHITE LIGHT EMITTING DEVICE 失效
    白光发光装置

    公开(公告)号:US20120223660A1

    公开(公告)日:2012-09-06

    申请号:US13474240

    申请日:2012-05-17

    IPC分类号: H05B33/14

    摘要: A white light emitting device includes a structure for emitting white light having at least four wavelengths by using two or less LEDs, where the LEDs include a blue/green LED emitting blue and green wavelengths of light. The device also includes means for emitting red wavelength of light.

    摘要翻译: 白色发光器件包括通过使用两个或更少的LED发射具有至少四个波长的白光的结构,其中LED包括发射蓝色和绿色波长的光的蓝/绿LED。 该装置还包括用于发射红色波长的光的装置。

    Method for manufacturing a facet extraction LED
    20.
    发明授权
    Method for manufacturing a facet extraction LED 有权
    制造小面提取LED的方法

    公开(公告)号:US07998767B2

    公开(公告)日:2011-08-16

    申请号:US12704570

    申请日:2010-02-12

    IPC分类号: H01L21/00

    CPC分类号: H01L33/20

    摘要: A facet extraction LED improved in light extraction efficiency and a manufacturing method thereof. A substrate is provided. A light emitting part includes an n-type semiconductor layer, an active layer and a p-type semiconductor layer sequentially stacked on the substrate. A p-electrode and an n-electrode are connected to the p-type semiconductor layer and the n-type semiconductor layer, respectively. The p- and n-electrodes are formed on the same side of the LED. The light emitting part is structured as a ring.

    摘要翻译: 提取光提取效率的小面提取LED及其制造方法。 提供基板。 发光部包括依次层叠在基板上的n型半导体层,有源层和p型半导体层。 p电极和n电极分别连接到p型半导体层和n型半导体层。 p电极和n电极形成在LED的同一侧。 发光部分被构造为环。