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49 条记录 (耗时 0.057 秒)

    Quinone diazide compositions containing low metals p-cresol oligomers and process of producing the composition
    11.
    发明授权
    Quinone diazide compositions containing low metals p-cresol oligomers and process of producing the composition 失效
    含有低金属对甲酚低聚物的醌酮二氮化物组合物及其制备方法

    公开(公告)号：US5837417A

    公开(公告)日：1998-11-17

    申请号：US366635

    申请日：1994-12-30

    申请人： M. Dalil Rahman ,  Dinesh N. Khanna ,  Daniel Aubin ,  Douglas McKenzie

    发明人： M. Dalil Rahman ,  Dinesh N. Khanna ,  Daniel Aubin ,  Douglas McKenzie

    IPC分类号： G03F7/022 ,  G03F7/023 ,  H01L21/027

    CPC分类号： G03F7/023 ,  G03F7/0236

    摘要： Process for producing a photosensitizer comprising a diazo ester of a p-cresol oligomer where at least one of the hydroxy groups on the p-cresol ring has been esterified with diazo-sulfonyl chloride comprising from about 60 to 100 mole % 2,1,4 or 2,1,5-diazo sulfonyl chloride, or a mixture thereof; and a photoresist comprising an admixture of the photosensitizer, which is present in the photoresist composition in an amount sufficient to uniformly photosensitive the photoresist composition, a water insoluble, aqueous alkali soluble novolak resin, the novolak resin being present in the photoresist composition in an amount sufficient to form a substantially uniform photoresist composition, and a suitable solvent.

    摘要翻译： 制备包含对甲酚低聚物的重氮酯的光敏剂的方法，其中对甲酚环上的至少一个羟基已用重氮磺酰氯酯化，包括约60-100摩尔％2,1,4 或2,1,5-重氮磺酰氯，或其混合物; 以及光致抗蚀剂，其包含光致抗蚀剂组合物中以足以使光致抗蚀剂组合物均匀感光的量的光敏剂的混合物，水不溶性的碱溶性酚醛清漆树脂，酚醛清漆树脂以光致抗蚀剂组合物的量存在 足以形成基本均匀的光致抗蚀剂组合物和合适的溶剂。

    Composition for stripping photoresist and organic materials from substrate surfaces
    12.
    发明授权
    Composition for stripping photoresist and organic materials from substrate surfaces 失效
    用于从基材表面剥离光致抗蚀剂和有机材料的组合物

    公开(公告)号：US06368421B1

    公开(公告)日：2002-04-09

    申请号：US09113892

    申请日：1998-07-10

    申请人： Joseph E. Oberlander ,  Mark S. Slezak ,  Dinesh N. Khanna ,  Dana L. Durham ,  Lawrence F. Spinicelli

    发明人： Joseph E. Oberlander ,  Mark S. Slezak ,  Dinesh N. Khanna ,  Dana L. Durham ,  Lawrence F. Spinicelli

    IPC分类号： B08B304

    CPC分类号： G03F7/426

    摘要： The invention relates to the field of microelectronics, such as integrated circuits, and more particularly to compositions and methods of removing photoresists or other organic materials from the surfaces of substrates used in the fabrication of integrated circuits. In particular the present invention relates to amine-free stripping compositions comprising solvent and surfactant that can effectively remove organic materials without corroding the underlying substrate, and the invention also relates to methods for removing these organic materials with the novel stripping composition.

    摘要翻译： 本发明涉及微电子学领域，例如集成电路，更具体地涉及从用于制造集成电路的衬底表面去除光致抗蚀剂或其它有机材料的组合物和方法。 特别地，本发明涉及不含无溶剂和表面活性剂的无胺汽提组合物，其可有效去除有机材料而不腐蚀下面的基底，本发明还涉及用新的汽提组合物除去这些有机材料的方法。

    Process of making a stable solution of poly(hydroxystyrene) functionalized with t-butyloxycarbonyl groups
    13.
    发明授权
    Process of making a stable solution of poly(hydroxystyrene) functionalized with t-butyloxycarbonyl groups 失效
    制备用叔丁氧基羰基官能化的聚（羟基苯乙烯）稳定溶液的方法

    公开(公告)号：US5395871A

    公开(公告)日：1995-03-07

    申请号：US239096

    申请日：1994-05-06

    申请人： Dinesh N. Khanna

    发明人： Dinesh N. Khanna

    IPC分类号： C08F12/22 ,  C08J3/09 ,  C08L25/08 ,  C08L25/18 ,  C08K5/06 ,  C08F18/24 ,  C08K5/10 ,  C08L69/00

    CPC分类号： C08J3/09 ,  C08F12/22 ,  C08J2325/18

    摘要： Poly(hydroxystyrene) resins in which a portion of the hydroxyl groups are functionalized with t-butyloxycarbonyl groups ("t-Boc") tend to decompose during drying of the wet solid and on storage in the solid state. Solutions that are more stable than the solid material can be made from the wet freshly synthesized solid by dissolving the wet solid in a solvent that forms an azeotrope with water and then distilling the azeotrope of water and solvent from the solution until the solution contains less than about 1% by weight of water.

    摘要翻译： 其中一部分羟基被叔丁氧基羰基（“t-Boc”）官能化的聚（羟基苯乙烯）树脂在湿固体的干燥期间倾向于分解并在固体状态下储存。 比固体材料更稳定的溶液可以通过将湿固体溶解在与水形成共沸物的溶剂中，然后从溶液中蒸馏出水和溶剂的共沸物，直到溶液含有少于 约1重量％的水。

    Diazo ester of a benzolactone ring compound and positive photoresist composition and element utilizing the diazo ester
    14.
    发明授权
    Diazo ester of a benzolactone ring compound and positive photoresist composition and element utilizing the diazo ester 失效
    苯并内酯环化合物的重氮酯和使用重氮酯的正性光致抗蚀剂组合物和元素

    公开(公告)号：US5221592A

    公开(公告)日：1993-06-22

    申请号：US847527

    申请日：1992-03-06

    申请人： Dinesh N. Khanna ,  Douglas McKenzie ,  Chester J. Sobodacha ,  Ralph R. Dammel

    发明人： Dinesh N. Khanna ,  Douglas McKenzie ,  Chester J. Sobodacha ,  Ralph R. Dammel

    IPC分类号： G03F7/022

    CPC分类号： G03F7/022 ,  Y10S430/168

    摘要： A photosensitizer comprising a diazo ester of benzolactone ring compound, such as phenolphthalein or cresolphthalein as the backbone, where at least one of the hydroxy groups on the benzolactone ring compound has been esterified with diazo-sulfonyl chloride consisting of 60 to 100 mole % 2,1,4 or 2,1,5-diazo sulfonyl chloride or a mixture thereof, and a photoresist comprising an admixture of the photosensitizer, which is present in the photoresist composition in an amount sufficient to uniformly photosensitize the photoresist composition; a water insoluble, aqueous alkali soluble novolak resin, the novolak resin being present in the photoresist composition in an amount sufficient to form a substantially uniform photoresist composition and a suitable solvent.

    摘要翻译： 一种光敏剂，其包含苯并内酯环化合物的重氮酯，例如酚酞或甲酚酞作为主链，其中苯并内酯环化合物上的至少一个羟基已用由60至100摩尔％2的重氮磺酰氯酯化， 1,4或2,1,5-重氮磺酰氯或其混合物，以及光致抗蚀剂，其包含光致抗蚀剂组合物中以足以使光致抗蚀剂组合物均匀光敏的量的光敏剂的混合物; 水不溶性的碱溶性酚醛清漆树脂，酚醛清漆树脂以足以形成基本均匀的光致抗蚀剂组合物和合适溶剂的量存在于光致抗蚀剂组合物中。

    Photoresist compositions containing polyamides polybenzoxa from bis((aminohydroxyphenyl)hexafluoroisopropyl)diphenyl ethers
    16.
    发明授权
    Photoresist compositions containing polyamides polybenzoxa from bis((aminohydroxyphenyl)hexafluoroisopropyl)diphenyl ethers 失效
    含有二（（氨基羟基苯基）六氟异丙基）二苯基醚的聚酰胺聚苯并恶唑的光致抗蚀剂组合物

    公开(公告)号：US5011753A

    公开(公告)日：1991-04-30

    申请号：US476332

    申请日：1990-02-07

    申请人： Werner H. Mueller ,  Dinesh N. Khanna

    发明人： Werner H. Mueller ,  Dinesh N. Khanna

    IPC分类号： C08G69/26 ,  C08G69/32 ,  C08G73/22 ,  G02F1/1337 ,  G03F7/023 ,  G03F7/037 ,  H01B3/30

    CPC分类号： H01B3/303 ,  C08G69/26 ,  C08G69/32 ,  C08G73/22 ,  G02F1/133723 ,  G03F7/0233 ,  G03F7/037

    摘要： Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.

    摘要翻译： 衍生自至少一种选自未取代的和取代的4,4'-双[2-（4-氨基-3-羟基苯基）六氟异丙基）]二苯基醚4,4'-二胺的二胺的耐热，可成形的羟基和/或烷氧基取代的聚酰胺 ' - 双 - [2-（3-氨基-4-羟基苯基）六氟异丙基]二苯醚和二羧酸或其衍生物例如 其酸卤素或酯。 本发明的聚酰胺可以被热固化以形成对于水解，化学和辐射攻击是稳定的较高耐热性的聚苯并恶唑。 本发明的聚酰胺可以通过模制，挤出和溶剂浇铸方法形成成型制品，优选在溶剂或稀释剂的存在下，然后任选地转化成耐热不溶性聚苯并恶唑。 这些成型制品在飞机，电子和其他商业应用中是有用的，其中需要耐热，耐化学性和耐辐射性以及良好的机械和电学性能。

    Polyamide-polyamide-polyimide and polybenzoxazole-polyamide-polyimide polymer having at least one fluorine-containing linking group
    17.
    发明授权
    Polyamide-polyamide-polyimide and polybenzoxazole-polyamide-polyimide polymer having at least one fluorine-containing linking group 失效
    具有至少一个含氟连接基团的聚酰胺 - 聚酰胺 - 聚酰亚胺和聚苯并恶唑 - 聚酰胺 - 聚酰亚胺聚合物

    公开(公告)号：US4978733A

    公开(公告)日：1990-12-18

    申请号：US321024

    申请日：1989-03-09

    申请人： Dinesh N. Khanna

    发明人： Dinesh N. Khanna

    IPC分类号： C08G73/14 ,  C08G73/22 ,  C08J3/09

    CPC分类号： C08J3/091 ,  C08G73/14 ,  C08G73/22 ,  C08J2379/08

    摘要： The present invention provides polyamide-polyamide-polyimide and polybenzoxazole-polyamide-polyimide polymers derived therefrom with improved processing and film characteristics having incorporated into the polymeric backbone the polymeric condensation residuum of novel aromatic diamino compounds having the formula: ##STR1## wherein A is selected from the group consisting of SO.sub.2, O, S, CO, C.sub.1 to C.sub.6 alkylene, perfluoroalkylene or perfluoroarylalkylene having from 1 to 10 carbon atoms and a bond directly linking the two aromatic groups, and R is selected from the group consisting of hydrogen, hydroxy and C.sub.1 to C.sub.4 alkoxy.The PA-PA-PI polymers of this invention are prepared by reacting compounds of the above formula alone or admixed with other aromatic diamines, with carboxyphenyl trimellitimide or the acid halide or ester derivatives thereof, alone or admixed with one or more aromatic diacid chlorides and/or one or more aromatic tetracarboxylic acids or anhydrides thereof. Polybenzoxazole-polyamide-polyimide derivatives of such polymers are prepared utilizing compounds of the above formula wherein R is hydroxy or C.sub.1 to C.sub.4 alkoxy, and by subjecting the resulting alkoxy or hydroxy-substituted polyamide-polyamide-polyimide to a dehydrating and cyclizing reaction to form the oxazole linkage which gives rise to polybenzoxazole-polyamide-polyimide polymers.