公开(公告)号：US06791119B2

公开(公告)日：2004-09-14

申请号：US10057821

申请日：2002-01-25

申请人： David B. Slater, Jr. ,  Robert C. Glass ,  Charles M. Swoboda ,  Bernd Keller ,  James Ibbetson ,  Brian Thibeault ,  Eric J. Tarsa

发明人： David B. Slater, Jr. ,  Robert C. Glass ,  Charles M. Swoboda ,  Bernd Keller ,  James Ibbetson ,  Brian Thibeault ,  Eric J. Tarsa

IPC分类号： H01L3300

CPC分类号： H01L33/20 ,  H01L33/10 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： Light emitting diodes include a substrate having first and second opposing faces and that is transparent to optical radiation in a predetermined wavelength range and that is patterned to define, in cross-section, a plurality of pedestals that extend into the substrate from the first face towards the second face. A diode region on the second face is configured to emit light in the predetermined wavelength range, into the substrate upon application of voltage across the diode region. A mounting support on the diode region, opposite the substrate is configured to support the diode region, such that the light that is emitted from the diode region into the substrate, is emitted from the first face upon application of voltage across the diode region. The first face of the substrate may include therein a plurality of grooves that define the plurality of triangular pedestals in the substrate. The grooves may include tapered sidewalls and/or a beveled floor. The first face of the substrate also may include therein an array of via holes. The via holes may include tapered sidewalls and/or a floor.

摘要翻译： 发光二极管包括具有第一和第二相对面并且对于预定波长范围内的光辐射透明的衬底，其被图案化以在横截面中限定多个基座，其从第一面朝向 第二张脸。 第二面上的二极管区域被配置为在施加二极管区域上的电压时将预定波长范围内的光发射到衬底中。 配置在与衬底相对的二极管区域上的安装支撑件被配置为支撑二极管区域，使得从二极管区域发射到衬底中的光在施加二极管区域上的电压时从第一面发射。 衬底的第一面可以包括在衬底中限定多个三角形基座的多个凹槽。 凹槽可以包括锥形侧壁和/或斜面底板。 衬底的第一面也可以包括一组通孔。 通孔可以包括锥形侧壁和/或底板。

公开(公告)号：US20060255347A1

公开(公告)日：2006-11-16

申请号：US11484233

申请日：2006-07-10

申请人： Steven DenBaars ,  Eric Tarsa ,  Michael Mack ,  Bernd Keller ,  Brian Thibeault

发明人： Steven DenBaars ,  Eric Tarsa ,  Michael Mack ,  Bernd Keller ,  Brian Thibeault

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/30 ,  H01L25/0756 ,  H01L27/15 ,  H01L27/153 ,  H01L33/08 ,  H01L33/343 ,  H01L33/502 ,  H01L33/504 ,  H01L2924/0002 ,  H01S3/0627 ,  H01S3/0941 ,  H01S3/09415 ,  H01S3/1623 ,  H01S3/1628 ,  H01S5/0206 ,  H01S5/0287 ,  H01S5/1032 ,  H01S5/183 ,  H01S5/18361 ,  H01S5/32341 ,  H01L2924/00

摘要： A light emitting diode (LED) grown on a substrate doped with one or more rare earth or transition element. The dopant ions absorb some or all of the light from the LED's active layer, pumping the electrons on the dopant ion to a higher energy state. The electrons are naturally drawn to their equilibrium state and they emit light at a wavelength that depends on the type of dopant ion. The invention is particularly applicable to nitride based LEDs emitting UV light and grown on a sapphire substrate doped with chromium. The chromium ions absorb the UV light, exciting the electrons on ions to a higher energy state. When they return to their equilibrium state they emit red light and some of the red light will emit from the LED's surface. The LED can also have active layers that emit green and blue and UV light, such that the LED emits green, blue, red light and UV light which combines to create white light. Alternatively, it can have one active layer and grown on a sapphire substrate doped with Cr, Ti, and Co such that the substrate absorbs the UV light and emits blue, green, and red light. The invention is also capable of providing a tunable LED over a variety of color shades. The invention is also applicable to solid state laser having one or more active layers emitting UV light with the laser grown on a sapphire substrate doped with one or more rare earth or transition elements.

公开(公告)号：US20070120129A1

公开(公告)日：2007-05-31

申请号：US11353647

申请日：2006-02-13

申请人： Steven DenBaars ,  Eric Tarsa ,  Michael Mack ,  Bernd Keller ,  Brian Thibeault ,  Adam Saxler

发明人： Steven DenBaars ,  Eric Tarsa ,  Michael Mack ,  Bernd Keller ,  Brian Thibeault ,  Adam Saxler

IPC分类号： H01L33/00

CPC分类号： H01L33/08 ,  H01L25/0756 ,  H01L27/15 ,  H01L33/025 ,  H01L33/30 ,  H01L33/343 ,  H01L33/465 ,  H01L33/502 ,  H01L2224/8592 ,  H01L2924/0002 ,  H01S5/405 ,  H01S5/4087 ,  H01L2924/00

摘要： A solid state light emitting device comprising an emitter structure having an active region of semiconductor material and a pair of oppositely doped layers of semiconductor material on opposite sides of the active region. The active region emits light at a predetermined wavelength in response to an electrical bias across the doped layers. An absorption layer of semiconductor material is included that is integral to said emitter structure and doped with at least one rare earth or transition element. The absorption layer absorbs at least some of the light emitted from the active region and re-emits at least one different wavelength of light. A substrate is included with the emitter structure and absorption layer disposed on the substrate.

摘要翻译： 一种固态发光器件，包括具有半导体材料的有源区的发射极结构和在该有源区的相对侧上的一对相对掺杂的半导体材料层。 响应于穿过掺杂层的电偏压，有源区域以预定波长发光。 包括与所述发射极结构成一体并掺杂有至少一种稀土或过渡元素的半导体材料的吸收层。 吸收层吸收从有源区域发射的至少一些光并且再发射至少一个不同波长的光。 发射体结构和衬底上设置的吸收层包括衬底。

公开(公告)号：US20080173884A1

公开(公告)日：2008-07-24

申请号：US11656759

申请日：2007-01-22

申请人： Ashay Chitnis ,  James Ibbetson ,  Arpan Chakraborty ,  Eric J. Tarsa ,  Bernd Keller ,  James Seruto ,  Yankun Fu

发明人： Ashay Chitnis ,  James Ibbetson ,  Arpan Chakraborty ,  Eric J. Tarsa ,  Bernd Keller ,  James Seruto ,  Yankun Fu

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L23/3114 ,  H01L33/38 ,  H01L33/387 ,  H01L33/44 ,  H01L33/501 ,  H01L33/507 ,  H01L33/508 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

公开(公告)号：USD725613S1

公开(公告)日：2015-03-31

申请号：US29424861

申请日：2012-06-15

申请人： Theodore Lowes ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  John A. Edmond ,  Jesse Reiherzer ,  Hormoz Benjamin

设计人： Theodore Lowes ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  John A. Edmond ,  Jesse Reiherzer ,  Hormoz Benjamin

公开(公告)号：USD718258S1

公开(公告)日：2014-11-25

申请号：US29431064

申请日：2012-09-02

申请人： Theodore Lowes ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  John A. Edmond ,  Jesse Reiherzer ,  Hormoz Benjamin ,  Christopher P. Hussell

设计人： Theodore Lowes ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  John A. Edmond ,  Jesse Reiherzer ,  Hormoz Benjamin ,  Christopher P. Hussell

公开(公告)号：USD711840S1

公开(公告)日：2014-08-26

申请号：US29424353

申请日：2012-06-11

申请人： Theodore Lowes ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  John A. Edmond ,  Jesse Reiherzer ,  Hormoz Benjamin

设计人： Theodore Lowes ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  John A. Edmond ,  Jesse Reiherzer ,  Hormoz Benjamin

公开(公告)号：US08563339B2

公开(公告)日：2013-10-22

申请号：US11473089

申请日：2006-06-21

申请人： Eric J. Tarsa ,  Michael Leung ,  Bernd Keller ,  Robert Underwood ,  Mark Youmans

发明人： Eric J. Tarsa ,  Michael Leung ,  Bernd Keller ,  Robert Underwood ,  Mark Youmans

IPC分类号： H01L21/00 ,  H01L21/326 ,  H01L21/479 ,  H01L21/20 ,  H01L21/36 ,  H01L21/31 ,  H01L21/469

CPC分类号： C25D13/12 ,  C25D5/003 ,  C25D7/123 ,  C25D13/02 ,  C25D13/22 ,  C25D15/00 ,  C25D17/02 ,  C25D21/00 ,  H01L2933/0041

摘要： One close loop system and method for electrophoretic deposition (EPD) of phosphor material on light emitting diodes (LEDs). The system comprises a deposition chamber sealed from ambient air. A mixture of phosphor material and solution is provided to the chamber with the mixture also being sealed from ambient air. A carrier holds a batch of LEDs in the chamber with the mixture contacting the areas of the LEDs for phosphor deposition. A voltage supply applies a voltage to the LEDs and the mixture to cause the phosphor material to deposit on the LEDs at the mixture contacting areas.

摘要翻译： 一种用于发光二极管（LED）上的磷光体材料的电泳沉积（EPD）的闭环系统和方法。 该系统包括由环境空气密封的沉积室。 将荧光体材料和溶液的混合物提供到室，混合物也与环境空气密封。 载体在室中保持一批LED，其中混合物与LED的区域接触以进行磷光体沉积。 电压源向LED和混合物施加电压，以使荧光体材料沉积在混合物接触区域的LED上。

公开(公告)号：US09024349B2

公开(公告)日：2015-05-05

申请号：US11656759

申请日：2007-01-22

申请人： Ashay Chitnis ,  James Ibbetson ,  Arpan Chakraborty ,  Eric J. Tarsa ,  Bernd Keller ,  James Seruto ,  Yankun Fu

发明人： Ashay Chitnis ,  James Ibbetson ,  Arpan Chakraborty ,  Eric J. Tarsa ,  Bernd Keller ,  James Seruto ,  Yankun Fu

IPC分类号： H01L33/38 ,  H01L33/62 ,  H01L33/44 ,  H01L33/50 ,  H01L23/31

CPC分类号： H01L33/62 ,  H01L23/3114 ,  H01L33/38 ,  H01L33/387 ,  H01L33/44 ,  H01L33/501 ,  H01L33/507 ,  H01L33/508 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

公开(公告)号：US20060131599A1

公开(公告)日：2006-06-22

申请号：US11338918

申请日：2006-01-25

申请人： David Slater ,  Robert Glass ,  Charles Swoboda ,  Bernd Keller ,  James Ibbetson ,  Brian Thibeault ,  Eric Tarsa

发明人： David Slater ,  Robert Glass ,  Charles Swoboda ,  Bernd Keller ,  James Ibbetson ,  Brian Thibeault ,  Eric Tarsa

IPC分类号： H01L33/00

CPC分类号： H01L33/20 ,  H01L33/10 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： Light emitting diodes include a substrate having first and second opposing faces and that is transparent to optical radiation in a predetermined wavelength range and that is patterned to define, in cross-section, a plurality of pedestals that extend into the substrate from the first face towards the second face. A diode region on the second face is configured to emit light in the predetermined wavelength range, into the substrate upon application of voltage across the diode region. A mounting support on the diode region, opposite the substrate is configured to support the diode region, such that the light that is emitted from the diode region into the substrate, is emitted from the first face upon application of voltage across the diode region. The first face of the substrate may include therein a plurality of grooves that define the plurality of triangular pedestals in the substrate. The grooves may include tapered sidewalls and/or a beveled floor. The first face of the substrate also may include therein an array of via holes. The via holes may include tapered sidewalls and/or a floor.

摘要翻译： 发光二极管包括具有第一和第二相对面并且对于预定波长范围内的光辐射透明的衬底，其被图案化以在横截面中限定多个基座，其从第一面朝向 第二张脸。 第二面上的二极管区域被配置为在施加二极管区域上的电压时将预定波长范围内的光发射到衬底中。 配置在与衬底相对的二极管区域上的安装支撑件被配置为支撑二极管区域，使得从二极管区域发射到衬底中的光在施加二极管区域上的电压时从第一面发射。 衬底的第一面可以包括在衬底中限定多个三角形基座的多个凹槽。 凹槽可以包括锥形侧壁和/或斜面底板。 衬底的第一面也可以包括一组通孔。 通孔可以包括锥形侧壁和/或底板。