公开(公告)号：US20060273249A1

公开(公告)日：2006-12-07

申请号：US11398023

申请日：2006-04-04

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Po-Chih Hsu ,  Kun-Hsieh Liu

IPC: H01J5/02

CPC classification number: H01L27/14618 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48992 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor chip package (200) includes a base (20), an image sensor chip (23), a plurality of wires (24), an adhesive means (26) and a cover (28). The base has a top surface (201) and a plurality of top pads (204) arranged on the top surface. The image sensor chip is mounted on the top surface of the base and includes a photosensitive area (231) and a plurality of chip pads (232) around the photosensitive area. The wires electrically connect the chip pads of image sensor chip and the top pads of the base. The adhesive means is applied on peripheral edge of the image sensor chip, over the wires and covers areas where the wires connecting with the chip pads. The cover is transparent and is mounted to the image sensor chip via the adhesive means. The cover seals the photosensitive area of the image sensor chip.

Abstract translation: 图像传感器芯片封装（200）包括基座（20），图像传感器芯片（23），多个导线（24），粘合装置（26）和盖子（28）。 底座具有顶表面（201）和布置在顶表面上的多个顶垫（204）。 图像传感器芯片安装在基座的顶表面上，并且在感光区域周围包括感光区域（231）和多个芯片焊盘（232）。 电线将图像传感器芯片的芯片焊盘与基座的顶部焊盘电连接。 粘合剂装置应用于图像传感器芯片的周边边缘，覆盖与芯片焊盘连接的导线和覆盖区域。 盖是透明的，并通过粘合装置安装到图像传感器芯片上。 盖子密封图像传感器芯片的感光区域。

公开(公告)号：US07051143B2

公开(公告)日：2006-05-23

申请号：US09888158

申请日：2001-06-25

Applicant: William A. White, III ,  Steven Webster ,  Randy Dircks ,  Ken Wester

Inventor： William A. White, III ,  Steven Webster ,  Randy Dircks ,  Ken Wester

IPC: G06F13/14

CPC classification number: G05B19/4185 ,  G05B2219/31121 ,  G05B2219/31122 ,  G05B2219/31369 ,  H04L12/4625 ,  H04L29/12849 ,  H04L49/90 ,  H04L61/6027 ,  H04L2012/40228 ,  H04L2012/4026 ,  Y02P90/18

Abstract: The present invention is directed to facilitating communication within an automation system having a plurality of networks and network protocols. Specifically, a Modbus network is operably connected to a network. A fieldbus coupler operably connected to both networks having a program facilitates communication within the automation system wherein devices connected to the network can be accessed for monitoring and/or controlling via Modbus commands. The fieldbus coupler (FBC) program accepts a Modbus function code containing one or more embedded message of varying types. The FBC program using additional information contained in the Modbus function code and the message type reads or writes only the required information to and from the field devices. This specific read or write request of the information and the embedding of more than one message type reduces overhead and bandwidth usage, thus improving bus response time and efficiency.

Abstract translation: 本发明旨在促进具有多个网络和网络协议的自动化系统内的通信。 具体来说，Modbus网络可操作地连接到网络。 可操作地连接到具有程序的两个网络的现场总线耦合器有助于自动化系统内的通信，其中连接到网络的设备可被访问以通过Modbus命令进行监视和/或控制。 现场总线耦合器（FBC）程序接受包含一个或多个不同类型的嵌入式消息的Modbus功能代码。 使用Modbus功能代码中包含的附加信息的FBC程序和消息类型只读取或写入现场设备所需的信息。 该信息的特定读或写请求和多个消息类型的嵌入减少了开销和带宽使用，从而提高了总线响应时间和效率。

公开(公告)号：US20050024752A1

公开(公告)日：2005-02-03

申请号：US10928475

申请日：2004-08-26

Applicant: Steven Webster

Inventor： Steven Webster

IPC: G02B7/02 ,  H01J3/14 ,  H01L27/00 ,  H01L27/14 ,  H01L27/146 ,  H04N5/225 ,  H04N5/335 ,  H01J40/14 ,  H01J5/02 ,  H01J5/16

CPC classification number: H01L27/14627 ,  G02B7/02 ,  G02B7/022 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H04N5/2251 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

公开(公告)号：US06777789B1

公开(公告)日：2004-08-17

申请号：US10340256

申请日：2003-01-10

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy D. Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy D. Hollaway

IPC: H01L23495

CPC classification number: H05K1/182 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, such as a leadframe or a laminate sheet, and input/output terminals. A chip is on a first side of the base and is electrically connected (directly or indirectly) to the input/output terminals. A cap, which may be a molded encapsulant, is provided on the first side of the base over the chip. The package is mounted on the substrate so that the cap is in the aperture, and a peripheral portion of the first side of the base is over the mounting surface so as to support the package in the aperture and allow the input/output terminals of the package to be juxtaposed with to the circuit patterns of the mounting surface. Because the cap is within the aperture, a height of the package above the mounting surface is minimized.

Abstract translation: 公开了一种用于包含半导体芯片的封装的安装件，以及制造这种安装的方法。 安装件包括具有其上具有导电迹线的安装表面的基板和延伸穿过基板的孔。 该包装包括底座，例如引线框或层压板，以及输入/输出端子。 芯片位于基座的第一侧，并与输入/输出端子电连接（直接或间接）。 在芯片上的基座的第一侧上提供可以是模制密封剂的盖。 封装被安装在基板上，使得帽位于孔中，并且基座的第一侧的周边部分在安装表面上方，以便将封装支撑在孔中，并且允许端子的输入/输出端子 包装与安装表面的电路图案并列。 因为盖在孔内，所以在安装表面上方的包装的高度被最小化。

公开(公告)号：US06686580B1

公开(公告)日：2004-02-03

申请号：US09906992

申请日：2001-07-16

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2700

CPC classification number: H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/3025 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00

Abstract: An image sensor package includes a substrate and an image sensor coupled to the substrate. The image sensor includes an upper surface having an active area. A reflector lid is coupled to the substrate. The reflector lid has a first panel having a planar surface. The planar surface is at least partially reflective and is angled relative to the upper surface of the image sensor to reflect electromagnetic radiation to the active area of image sensor.

Abstract translation: 图像传感器封装包括衬底和耦合到衬底的图像传感器。 图像传感器包括具有有效区域的上表面。 反射器盖连接到基板。 反射器盖具有具有平坦表面的第一面板。 平坦表面至少部分地是反射性的并且相对于图像传感器的上表面成角度，以将电磁辐射反射到图像传感器的有效区域。

公开(公告)号：US06627864B1

公开(公告)日：2003-09-30

申请号：US09447202

申请日：1999-11-22

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2700

CPC classification number: H01L24/97 ,  H01L27/14618 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2224/81

Abstract: A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture.

Abstract translation: 薄图像传感器封装包括具有响应于辐射的有效区域的图像传感器。 图像传感器安装在对辐射透明的基板上。 图像传感器被安装成使得图像传感器的有效区域面向基板。 重要的是，衬底具有双重功能。 特别地，衬底是覆盖图像传感器的有效区域的窗口。 此外，基板是制造图像传感器封装的平台。 因此，图像传感器封装薄，重量轻且制造成本低廉。

公开(公告)号：US06586824B1

公开(公告)日：2003-07-01

申请号：US09916716

申请日：2001-07-26

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2302

CPC classification number: H01L27/14618 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L27/14625 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/18 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: An electronic device, such as a sensor die, is packaged by first forming a hole through a substrate. The hole is made large enough to position the entire electronic device within the hole. A tape is then applied to the second surface of the substrate to cover a second side of the hole, thereby creating a tape surface at the bottom of the hole. The electronic device is then positioned within the hole such that the electronic device is in contact with, and adhered to, the tape surface at the bottom of the hole. Electronic connections are made between the electronic device and the substrate and a layer of encapsulant is applied. In one embodiment, the electronic device is a sensor die and an optical element is positioned over an active region of the sensor die before the encapsulant is applied. The encapsulant then surrounds and holds the optical element in position over the active region of the sensor die.

Abstract translation: 通过首先通过基板形成孔来封装诸如传感器管芯的电子装置。 孔足够大以将整个电子设备定位在孔内。 然后将带施加到基板的第二表面以覆盖孔的第二侧，从而在孔的底部形成带表面。 然后将电子设备定位在孔内，使得电子设备与孔的底部接触并粘附到带表面。 在电子设备和基板之间形成电子连接，并且施加一层密封剂。在一个实施例中，电子设备是传感器管芯，并且在施加密封剂之前，光学元件位于传感器管芯的有源区域之上。 然后，密封剂围绕并将光学元件保持在传感器管芯的有源区域上的适当位置。

公开(公告)号：US06580153B1

公开(公告)日：2003-06-17

申请号：US09811183

申请日：2001-03-14

Applicant: Thomas P. Glenn ,  Roy Dale Hollaway ,  Steven Webster

Inventor： Thomas P. Glenn ,  Roy Dale Hollaway ,  Steven Webster

IPC: H01L21304

CPC classification number: H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54453 ,  H01L2224/48463 ,  H01L2924/3025

Abstract: A protective layer includes a polymerized region, which forms a cavity in an interior surface of the protective layer. The protective layer is mounted to a micromachine chip such that an active area of the micromachine chip is located within the cavity of the protective layer. The protective layer protects the active area during front-side or back-side singulation of the micromachine chip from a micromachine substrate.

Abstract translation: 保护层包括在保护层的内表面中形成空腔的聚合区域。 保护层安装到微机械芯片，使得微机械芯片的有效区域位于保护层的空腔内。 保护层在微机械基片的前侧或后侧分割期间保护有源区域。

公开(公告)号：US06528875B1

公开(公告)日：2003-03-04

申请号：US09839305

申请日：2001-04-20

Applicant: Thomas P. Glenn ,  Roy D. Hollaway ,  Steven Webster

Inventor： Thomas P. Glenn ,  Roy D. Hollaway ,  Steven Webster

IPC: H01L2312

CPC classification number: B81B7/007 ,  B81B2207/096 ,  H01L23/10 ,  H01L23/13 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A vacuum sealed package for a semiconductor chip, such as a micro-electromechanical (MEM) chip, is disclosed, along with a method of making such a package. In an exemplary embodiment, the package includes a ceramic substrate and a lid that together define a cavity wherein the chip is mounted. The substrate includes a conductive (e.g., metal) interconnect pattern that extends, at least in part, vertically through the substrate. I/O terminals are provided on an external surface of the substrate. A vent hole, at least partially lined with a metal coating, extends through the substrate into the cavity. A metal plug seals the vent hole. The vent hole is sealed by placing the package in a vacuum chamber, evacuating the chamber, and heating the chamber so as to cause a metal preform on the substrate to flow into the vent hole and form the plug.

Abstract translation: 公开了一种用于诸如微机电（MEM）芯片的半导体芯片的真空密封封装以及制造这种封装的方法。 在示例性实施例中，封装包括陶瓷基板和盖，其一起限定其中安装芯片的空腔。 衬底包括至少部分地垂直延伸穿过衬底的导电（例如，金属）互连图案。 I / O端子设置在基板的外表面上。 至少部分衬有金属涂层的排气孔延伸穿过衬底进入空腔。 金属插头密封通气孔。 通过将包装物放置在真空室中，排空室并加热室以使基板上的金属预成型件流入通气孔并形成插塞来密封通气孔。

公开(公告)号：US06512219B1

公开(公告)日：2003-01-28

申请号：US09491112

申请日：2000-01-25

Applicant: Steven Webster ,  Tony Arellano ,  Roy Dale Hollaway

Inventor： Steven Webster ,  Tony Arellano ,  Roy Dale Hollaway

IPC: H01L2700

CPC classification number: H01L27/14618 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A drop is applied to an active area of an image sensor. A window is pressed into the drop to form a window support. The window support is then cured, or otherwise set-up, to form an image sensor package. During use, radiation is directed at the image sensor package. This radiation passes through the window, passes through the window support, and strikes the active area, which responds to the radiation. The window and the window support are transparent to the radiation.

Abstract translation: 一个液滴被应用到图像传感器的有效区域。 一个窗口被压入滴液以形成窗户支撑。 然后将窗户支撑件固化或以其它方式安装，以形成图像传感器封装。 在使用期间，辐射被引导到图像传感器封装。 该辐射通过窗户，穿过窗户支撑件，并且撞击响应辐射的有效区域。 窗户和窗户支架对辐射是透明的。