公开(公告)号：US09866099B1

公开(公告)日：2018-01-09

申请号：US15395165

申请日：2016-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rida Shawky Assaad ,  Ming Sun ,  Jeffrey Morroni

IPC: H02M1/08 ,  H02M1/00 ,  H02M3/158 ,  H02M1/088

CPC classification number: H02M1/00 ,  H02M1/08 ,  H02M1/088 ,  H02M3/158 ,  H02M3/1588 ,  H02M2001/0003 ,  H02M2001/0029 ,  H02M2001/0048 ,  H03K17/167

Abstract: A power converter includes a high side device, a low side device connected to the high side device at a switch node, an inductor connected to the high side device and the low side device at the switch node, and a high side driver. The high side driver is configured to drive a gate of the high side device at a first current for a first period of time. In response to the first period of time ending, the high side driver is configured to step down the first current for a second period of time. In response to the second period of time ending, the high side driver is configured to drive the gate of the high side device at the first current.

公开(公告)号：US09726697B2

公开(公告)日：2017-08-08

申请号：US14588394

申请日：2014-12-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dina Reda El-Damak ,  Jeffrey Morroni ,  Steven Mark Mercer

IPC: G01R1/20 ,  G01R19/10 ,  G01R19/00 ,  G01R31/40

CPC classification number: G01R19/10 ,  G01R1/203 ,  G01R19/0092 ,  G01R31/40

Abstract: A voltage proportional to a sum of currents flowing though first and second coupled inductors is developed across a first capacitor common to first and second series RC networks if the RC networks are time constant-matched to the inductors. The first and second inductors are coupled between a first and second switched drive phase input terminal, respectively, and an apparatus output terminal. The first and second RC networks are coupled in parallel with the first and second inductor, respectively. Inverting and non-inverting inputs of an amplifier are coupled to junctions of third and fourth time constant-matched series RC networks coupled in parallel with the first and second inductors, respectively. The amplifier subtracts voltages sensed at the junctions to generate a difference signal proportional to a magnitude difference of the currents flowing through the inductors.

公开(公告)号：US11869855B2

公开(公告)日：2024-01-09

申请号：US17953162

申请日：2022-09-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin Zhang ,  Kenji Otake ,  Yi Yan ,  Jeffrey Morroni ,  Yuki Sato ,  Takafumi Ando

IPC: H01L23/64 ,  H01F27/28 ,  H01F41/06 ,  H01F41/02 ,  H01F17/04 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L49/02 ,  H01F27/02

CPC classification number: H01L23/645 ,  H01F17/04 ,  H01F27/022 ,  H01F27/28 ,  H01F41/0206 ,  H01F41/06 ,  H01L21/4842 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49503 ,  H01L28/10

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

公开(公告)号：US20240006392A1

公开(公告)日：2024-01-04

申请号：US17852925

申请日：2022-06-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Anton Winkler ,  Christopher Manack ,  Jeffrey Morroni ,  Hidetoshi Inoue ,  Yuki Sato ,  Kenji Otake

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L49/02 ,  H01L21/54 ,  H01F27/29 ,  H01F27/32

CPC classification number: H01L25/165 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/3128 ,  H01L23/295 ,  H01L28/10 ,  H01L28/40 ,  H01L24/29 ,  H01L24/81 ,  H01L24/94 ,  H01L21/54 ,  H01F27/292 ,  H01F27/327 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/2919 ,  H01L2224/29186 ,  H01L2224/81447 ,  H01F41/005

Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects coupled between the semiconductor die and the substrate; an insulation layer coupled between the semiconductor die and the substrate, the insulation layer surrounding the metal interconnects; an inductor coupled to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, the metal interconnects and the insulation layer, the magnetic material having a different material from the insulation layer.

公开(公告)号：US20240006259A1

公开(公告)日：2024-01-04

申请号：US17852979

申请日：2022-06-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hidetoshi Inoue ,  Kenji Otake ,  Yuki Sato ,  Takafumi Ando ,  Jeffrey Morroni ,  Anton Winkler ,  Yi Yan

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L49/02 ,  H01L21/56 ,  H01F27/32 ,  H01F41/00

CPC classification number: H01L23/295 ,  H01L24/16 ,  H01L23/3128 ,  H01L25/165 ,  H01L28/10 ,  H01L2224/81447 ,  H01L24/81 ,  H01L21/561 ,  H01F27/327 ,  H01F41/005 ,  H01L2224/16227 ,  H01L28/40

Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects, the semiconductor die being mounted to the substrate via the metal interconnects; an inductor mounted to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, and the metal interconnects, the magnetic material including: coated metal particles, which are coated with a first insulation material; and a second insulation material, in which the coated metal particles are suspended.

公开(公告)号：US20230013938A1

公开(公告)日：2023-01-19

申请号：US17947288

申请日：2022-09-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, JR. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

Abstract: An integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate. The coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the coil and the electronic component.

公开(公告)号：US11488914B2

公开(公告)日：2022-11-01

申请号：US16581033

申请日：2019-09-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin Zhang ,  Kenji Otake ,  Yi Yan ,  Jeffrey Morroni ,  Yuki Sato ,  Takafumi Ando

IPC: H01L23/64 ,  H01F41/06 ,  H01F41/02 ,  H01F17/04 ,  H01F27/28 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L49/02 ,  H01F27/02

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

公开(公告)号：US11456262B2

公开(公告)日：2022-09-27

申请号：US17138150

申请日：2020-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, Jr. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.

公开(公告)号：US11081955B2

公开(公告)日：2021-08-03

申请号：US15716647

申请日：2017-09-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sujan K. Manohar ,  Shailendra Baranwal ,  Jeffrey Morroni ,  Michael Lueders ,  Yogesh Ramadass

IPC: H02M1/14 ,  H02M3/06 ,  H02M3/158 ,  H02M3/155

Abstract: A system includes a high side transistor switch coupled to a first voltage node and a low side transistor switch coupled to the high side transistor switch at a switch node. The system further includes a unidirectional decoupling capacitor circuit including a capacitive component. The unidirectional decoupling capacitor circuit is coupled between the first voltage node and a common potential. Responsive to a voltage on the first voltage node being more than a threshold greater than an input voltage to the first voltage node, the unidirectional decoupling capacitor circuit is configured to sink current from the first voltage node to the capacitive component. The capacitive component can therefore be charged, with the charge used to subsequently power a load.

公开(公告)号：US20210066909A1

公开(公告)日：2021-03-04

申请号：US17011522

申请日：2020-09-03

Applicant: Texas Instruments Incorporated

Inventor： Yogesh Kumar Ramadass ,  Ujwal Radhakrishna ,  Jeffrey Morroni

IPC: H02H7/20 ,  H01L23/525 ,  H03K17/687

Abstract: An example integrated circuit includes: a substrate and a first metal fuse layer on the substrate, the first metal fuse layer having first and second electrical contacts, the first electrical contact adapted to be coupled to an input terminal, the second electrical contact adapted to be coupled to a diode. The example integrated circuit further includes a second metal fuse layer on the substrate, the second metal fuse layer having third and fourth electrical contacts, the third electrical contact coupled to the second electrical contact and adapted to be coupled to the diode, the fourth electrical contact coupled to a shunt circuit.