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11.
公开(公告)号:US20250113596A1
公开(公告)日:2025-04-03
申请号:US18375593
申请日:2023-10-02
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Jui-Chien Huang , Cheng-Yin Wang , Wei-Cheng Lin , Kao-Cheng Lin , Szuya Liao
IPC: H01L27/088 , H01L29/08 , H01L29/417 , H01L29/66
Abstract: Embodiments include mixed complementary field effect and unipolar transistors and methods of forming the same. In an embodiment, a structure includes: a first semiconductor nanostructure; a second semiconductor nanostructure; a first isolation structure interposed between the first semiconductor nanostructure and the second semiconductor nanostructure; a first source/drain region extending laterally from an end of the first semiconductor nanostructure, the first source/drain region having a first conductivity type; a second source/drain region extending laterally from an end of the second semiconductor nanostructure, the second source/drain region having the first conductivity type, the second source/drain region aligned vertically with the first source/drain region; and a first gate structure surrounding the first semiconductor nanostructure and the second semiconductor nanostructure.
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公开(公告)号:US10705934B2
公开(公告)日:2020-07-07
申请号:US15700877
申请日:2017-09-11
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Ming-Hung Chang , Atul Katoch , Chia-En Huang , Ching-Wei Wu , Donald G. Mikan, Jr. , Hao-I Yang , Kao-Cheng Lin , Ming-Chien Tsai , Saman M. I. Adham , Tsung-Yung Chang , Uppu Sharath Chandra
IPC: G06F11/263 , G06F1/10 , G06F11/22 , G06F11/267 , G11C29/48 , G11C29/32 , G11C29/12
Abstract: An exemplary testing environment can operate in a testing mode of operation to test whether a memory device or other electronic devices communicatively coupled to the memory device operate as expected or unexpectedly as a result of one or more manufacturing faults. The testing mode of operation includes a shift mode of operation, a capture mode of operation, and/or a scan mode of operation. In the shift mode of operation and the scan mode of operation, the exemplary testing environment delivers a serial input sequence of data to the memory device. In the capture mode of operation, the exemplary testing environment delivers a parallel input sequence of data to the memory device. The memory device thereafter passes through the serial input sequence of data or the parallel input sequence of data to provide an output sequence of data in the shift mode of operation or the capture mode of operation or passes through the serial input sequence of data to provide a serial output sequence of scan data in the scan mode of operation.
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公开(公告)号:US10032490B2
公开(公告)日:2018-07-24
申请号:US15289351
申请日:2016-10-10
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yen-Huei Chen , Chien Chi Linus Tien , Kao-Cheng Lin , Jung-Hsuan Chen
IPC: G01R19/00 , G11C7/06 , H01L21/28 , G11C11/419 , H01L21/8234 , H01L23/528 , H01L23/552 , H01L27/02 , H01L27/088 , H01L27/11 , H01L29/06 , H01L21/20 , H01L27/092
Abstract: A sense amplifier (SA) comprises a semiconductor substrate having an oxide definition (OD) region, a pair of SA sensing devices, a SA enabling device, and a sense amplifier enabling signal (SAE) line for carrying an SAE signal. The pair of SA sensing devices have the same poly gate length Lg as the SA enabling device, and they all share the same OD region. When enabled, the SAE signal turns on the SA enabling device to discharge one of the pair of SA sensing devices for data read from the sense amplifier.
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公开(公告)号:US09997436B2
公开(公告)日:2018-06-12
申请号:US15379537
申请日:2016-12-15
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Chih-Yu Lin , Kao-Cheng Lin , Li-Wen Wang , Yen-Huei Chen
CPC classification number: H01L23/481 , G11C5/063 , G11C7/18 , H01L25/0657 , H01L27/0688 , H01L27/10 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
Abstract: An apparatus and method of three dimensional conductive lines comprising a first memory column segment in a first tier, a second memory column segment in a second tier, and conductive lines connecting the first memory column segment to the second memory column segment. In some embodiments a conductive line is disposed in the first tier on a first side of the memory column and in the second tier on a second side of the memory column.
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公开(公告)号:US20170098596A1
公开(公告)日:2017-04-06
申请号:US15379537
申请日:2016-12-15
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Chih-Yu Lin , Kao-Cheng Lin , Li-Wen Wang , Yen-Huei Chen
IPC: H01L23/48 , H01L27/10 , G11C5/06 , H01L25/065
CPC classification number: H01L23/481 , G11C5/063 , G11C7/18 , H01L25/0657 , H01L27/0688 , H01L27/10 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
Abstract: An apparatus and method of three dimensional conductive lines comprising a first memory column segment in a first tier, a second memory column segment in a second tier, and conductive lines connecting the first memory column segment to the second memory column segment. In some embodiments a conductive line is disposed in the first tier on a first side of the memory column and in the second tier on a second side of the memory column.
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16.
公开(公告)号:US09275710B2
公开(公告)日:2016-03-01
申请号:US14014431
申请日:2013-08-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Wei Min Chan , Kao-Cheng Lin , Yen-Huei Chen
IPC: G11C8/16 , G11C11/41 , G11C8/14 , G11C8/08 , G11C11/412 , G11C11/413 , G11C11/417 , G11C5/06
CPC classification number: G11C8/16 , G11C5/06 , G11C5/063 , G11C8/08 , G11C8/14 , G11C11/41 , G11C11/412 , G11C11/413 , G11C11/417
Abstract: A semiconductor memory comprises a dual-port memory array having a plurality of cross-access dual-port bit cells arranged in a plurality of rows and a plurality of columns, wherein each of the plurality of cross-access dual-port bit cells has two cross-access ports for read and write of one or more bits of data to the cross-access dual port bit cell. The semiconductor memory further comprises a pair of word lines associated with at least one of the plurality of rows of the dual-port memory array, wherein the pair of word lines is configured to carry a pair of row selection signals for enabling one or more read and write operations on one or more cross-access dual-port bit cells in the row. The semiconductor memory further comprises a pair of column selection lines associated with at least one of the plurality of columns of the dual port memory array, wherein the pair of column selection lines is configured to carry a pair of column selection signals for enabling the cross-access dual-port bit cells in the column during the read and write operations.
Abstract translation: 半导体存储器包括双端口存储器阵列,其具有以多行和多列布置的多个交叉访问双端口位单元,其中多个交叉访问双端口位单元中的每一个具有两个 交叉访问端口用于读取和写入一个或多个位数据到交叉访问双端口位单元。 半导体存储器还包括与双端口存储器阵列的多行中的至少一个相关联的一对字线,其中该对字线被配置为携带一对行选择信号,以使一个或多个读取 并对行中的一个或多个交叉访问双端口位单元进行写入操作。 半导体存储器还包括与双端口存储器阵列的多个列中的至少一个相关联的一对列选择线,其中该列选择线被配置为承载一对列选择信号, 在读取和写入操作期间访问列中的双端口位单元。
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公开(公告)号:US10783954B2
公开(公告)日:2020-09-22
申请号:US15991739
申请日:2018-05-29
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Wei-Cheng Wu , Chih-Yu Lin , Kao-Cheng Lin , Wei-Min Chan , Yen-Huei Chen
IPC: G11C11/419 , H01L27/11 , G11C11/413 , G11C11/412
Abstract: A device is disclosed that includes a plurality of first memory cells, a plurality of second memory cells, a power circuit, and a header circuit. The power circuit is configured to provide the first power voltage for the plurality of first memory cells, and to provide the second power voltage, that is independent from the first power voltage, for the plurality of second memory cells. The header circuit is configured to provide, during the write operation, the first voltage smaller than the first power voltage, the second power voltage, or smaller than the first power voltage and the second power voltage, for corresponding memory cells of the plurality of first memory cells and the plurality of second memory cells.
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公开(公告)号:US10163759B2
公开(公告)日:2018-12-25
申请号:US15983786
申请日:2018-05-18
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chih-Yu Lin , Kao-Cheng Lin , Li-Wen Wang , Yen-Huei Chen
Abstract: An apparatus and method of three dimensional conductive lines comprising a first memory column segment in a first tier, a second memory column segment in a second tier, and conductive lines connecting the first memory column segment to the second memory column segment. In some embodiments a conductive line is disposed in the first tier on a first side of the memory column and in the second tier on a second side of the memory column.
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公开(公告)号:US09129707B2
公开(公告)日:2015-09-08
申请号:US14043869
申请日:2013-10-02
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Kao-Cheng Lin , Wei Min Chan , Yen-Huei Chen
IPC: G11C8/16 , G11C11/419 , G11C7/10 , G11C11/412
CPC classification number: G11C11/419 , G11C7/1075 , G11C8/16 , G11C11/412
Abstract: An integrated includes a dual port memory cell such as a SRAM cell. A first port dummy read recovery block couples the first port complementary bit line to a high voltage supply node during a write logic low operation to the data node through the second port bit line, and couples the first port bit line to a high voltage supply node during a write logic low operation to the complementary data node through the second port complementary bit line. A second port dummy read recovery block couples the second port complementary bit line to a high voltage supply node during a write logic low operation to the data node through the first port bit line, and couples the second port bit line to a high voltage supply node during a write logic low operation to the complementary data node through the first port complementary bit line.
Abstract translation: 集成的包括诸如SRAM单元的双端口存储单元。 第一端口虚拟读取恢复块在写入逻辑低操作期间通过第二端口位线将第一端口互补位线耦合到高电压供应节点到数据节点,并且将第一端口位线耦合到高电压供应节点 在通过第二端口互补位线到互补数据节点的写入逻辑低操作期间。 第二端口虚拟读恢复块在写逻辑低操作期间通过第一端口位线将第二端口互补位线耦合到高电压电源节点,并将第二端口位线耦合到高电压电源节点 在通过第一端口互补位线到互补数据节点的写入逻辑低操作期间。
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