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11.发明申请公开(公告)号：US20160025944A1
公开(公告)日：2016-01-28
申请号：US14337248
申请日：2014-07-22
Applicant: Unimicron Technology Corp.
Inventor： Yin-Ju Chen , Cheng-Po Yu , Pei-Chang Huang
IPC: G02B6/43 , H01L31/0232 , G02B6/42
CPC classification number: G02B6/428 , G02B6/12004 , G02B6/32 , G02B6/4206 , G02B6/4244 , G02B6/4245 , G02B6/4274 , G02B6/43 , H01L31/0232 , H01L31/02327 , H01L31/167
Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.
Abstract translation: 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。
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公开(公告)号：US09883598B2
公开(公告)日：2018-01-30
申请号：US15289950
申请日：2016-10-10
Applicant: Unimicron Technology Corp.
Inventor： Yin-Ju Chen , Ming-Hao Wu , Cheng-Po Yu
IPC: H01L35/30 , H05K3/46 , H05K1/18 , H05K1/02 , G06F1/20 , H01L23/498 , H05K1/11 , H05K1/14 , H05K3/36 , H01L23/12
CPC classification number: H05K3/4647 , G06F1/206 , H01L23/12 , H01L23/13 , H01L23/4275 , H01L23/49827 , H01L35/30 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/15153 , H01L2924/15313 , H05K1/0203 , H05K1/0206 , H05K1/113 , H05K1/14 , H05K1/181 , H05K1/185 , H05K1/187 , H05K3/36 , H05K3/4697 , H05K2201/048 , H05K2201/10219 , H05K2201/10378 , H05K2201/10515 , H05K2201/10734
Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.
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Patent Agency Ranking
13.发明申请公开(公告)号：US20160300473A1
公开(公告)日：2016-10-13
申请号：US14680075
申请日：2015-04-07
Applicant: Unimicron Technology Corp.
Inventor： Yin-Ju Chen , Cheng-Po Yu
Abstract: A vehicle door opening warning system including a control unit, a projection unit and a detection unit is provided. The control unit is disposed at a door of a vehicle. The projection unit is disposed at the door and is electrically coupled to the control unit. The detection unit is disposed outside of the vehicle and is electrically coupled to the control unit. When the detection unit detects a moving object existing within 5 to 30 meters of the vehicle, the detection unit produces a signal. The control unit receives the signal and controls the projection unit to project a warning message according to the signal. A vehicle door opening warning method is also provided.
Abstract translation: 提供了包括控制单元，投影单元和检测单元的车门打开警告系统。 控制单元设置在车辆的门上。 投影单元设置在门上并且电耦合到控制单元。 检测单元设置在车辆外部并且电耦合到控制单元。 当检测单元检测到存在于车辆5至30米范围内的运动物体时，检测单元产生信号。 控制单元接收信号并根据信号控制投影单元投射警告消息。 还提供车门打开警告方法。
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公开(公告)号：US20160266334A1
公开(公告)日：2016-09-15
申请号：US15164878
申请日：2016-05-26
Applicant: Unimicron Technology Corp.
Inventor： Yin-Ju Chen , Cheng-Po Yu , Pei-Chang Huang
CPC classification number: G02B6/428 , G02B6/12004 , G02B6/32 , G02B6/4206 , G02B6/4244 , G02B6/4245 , G02B6/4274 , G02B6/43 , H01L31/0232 , H01L31/02327 , H01L31/167
Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.
Abstract translation: 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。
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公开(公告)号：US20160252689A1
公开(公告)日：2016-09-01
申请号：US15152569
申请日：2016-05-12
Applicant: Unimicron Technology Corp.
Inventor： Yin-Ju Chen , Cheng-Po Yu , Pei-Chang Huang
CPC classification number: G02B6/428 , G02B6/12004 , G02B6/32 , G02B6/4206 , G02B6/4244 , G02B6/4245 , G02B6/4274 , G02B6/43 , H01L31/0232 , H01L31/02327 , H01L31/167
Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.
Abstract translation: 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。
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公开(公告)号：US09335470B2
公开(公告)日：2016-05-10
申请号：US14490688
申请日：2014-09-19
Applicant: Unimicron Technology Corp.
Inventor： Yin-Ju Chen , Cheng-Po Yu , Pei-Chang Huang
CPC classification number: G02B6/122 , G02B6/13 , G02B6/4203 , G02B6/4231 , G02B6/428 , Y10T29/49131
Abstract: A method for assembling an opto-electronic circuit board is described as follows. A bottom cladding layer, a core layer and a top cladding layer are formed on the base orderly such that a waveguide is completed. A first light-guide hole is formed in a base material, and a light source is disposed on the base material thereby forming an emission component. A second light-guide hole is formed in another base material, and then an optic receiver is disposed on another base material thereby forming a receiver component. A circuit substrate is processed in order to form a first cavity, a second cavity and a third cavity on a first circuit layer of the substrate. The waveguide, the emission component and the receiver component are disposed respectively in the first cavity, the second cavity and the third cavity.
Abstract translation: 光电路基板的组装方法如下所述。 在基底上有序地形成底部包层，芯层和顶部覆层，使得波导完成。 在基材中形成第一导光孔，在基材上设置光源，形成发光成分。 在另一个基材中形成第二导光孔，然后将光接收器设置在另一个基材上，从而形成接收器部件。 处理电路基板以在基板的第一电路层上形成第一空腔，第二空腔和第三空腔。 波导，发射部件和接收器部件分别设置在第一腔体，第二腔体和第三腔体中。
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公开(公告)号：US09159713B1
公开(公告)日：2015-10-13
申请号：US14493336
申请日：2014-09-22
Applicant: Unimicron Technology Corp.
Inventor： Yin-Ju Chen , Cheng-Po Yu , Pei-Chang Huang
CPC classification number: H01L25/167 , G02B6/12004 , H01L2924/0002 , H01L2924/00
Abstract: An opto-electronic circuit board includes a substrate, a cavity, blind vias, metal layers, a first chip, a second chip, and the optical component. The substrate includes a first circuit layer, a second circuit layer, and a dielectric layer disposed between the first circuit layer and the second circuit layer. The cavity is disposed on the dielectric layer, in which the cavity extends from the first circuit layer to the second circuit layer. The blind vias are disposed at opposite sides of the cavity. The first chip is disposed on the second circuit layer with corresponding to one of the blind vias. The second chip is disposed on the second circuit layer with corresponding to the other one of the blind vias. The optical component is disposed in the cavity, in which the second surface of the optical component is connected to the first circuit layer.
Abstract translation: 光电子电路板包括基板，空腔，盲孔，金属层，第一芯片，第二芯片和光学部件。 衬底包括第一电路层，第二电路层和布置在第一电路层和第二电路层之间的电介质层。 空腔设置在电介质层上，空腔从第一电路层延伸到第二电路层。 盲孔设置在空腔的相对侧。 第一芯片设置在与其中一个盲孔相对应的第二电路层上。 第二芯片设置在第二电路层上，对应于盲孔中的另一个。 光学部件设置在空腔中，光学部件的第二表面连接到第一电路层。
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