利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

28 条记录 (耗时 0.019 秒)

    OPTIMIZED THERMALLY CONDUCTIVE PLATE AND ATTACHMENT METHOD FOR ENHANCED THERMAL PERFORMANCE AND RELIABILITY OF FLIP CHIP ORGANIC PACKAGES
    12.
    发明申请
    OPTIMIZED THERMALLY CONDUCTIVE PLATE AND ATTACHMENT METHOD FOR ENHANCED THERMAL PERFORMANCE AND RELIABILITY OF FLIP CHIP ORGANIC PACKAGES 失效
    优化的导热板和附件方法，用于提高散热片有机包装的热性能和可靠性

    公开(公告)号：US20070236890A1

    公开(公告)日：2007-10-11

    申请号：US11758128

    申请日：2007-06-05

    申请人： Jeffrey Coffin ,  Michael Gaynes ,  David Questad ,  Kamal Sikka ,  Hilton Toy ,  Jamil Wakil

    发明人： Jeffrey Coffin ,  Michael Gaynes ,  David Questad ,  Kamal Sikka ,  Hilton Toy ,  Jamil Wakil

    IPC分类号： H05K7/20 ,  B21D53/02

    CPC分类号： H01L23/34 ,  H01L23/3735 ,  H01L23/42 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/3511 ,  Y10T29/49004 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4935

    摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

    摘要翻译： 披露的是导热板。 每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙 经。 另外，本公开提供了形成板并将板结合到发热结构的相关方法。 在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。 在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。 因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。

    Electrically stable copper filled electrically conductive adhesive
    17.
    发明申请
    Electrically stable copper filled electrically conductive adhesive 有权
    电稳定铜填充导电胶

    公开(公告)号：US20060197065A1

    公开(公告)日：2006-09-07

    申请号：US11072193

    申请日：2005-03-04

    申请人： Michael Gaynes ,  Jeffrey Gelorme ,  Luis Matienzo ,  Rebecca Northey ,  Michael Vincent

    发明人： Michael Gaynes ,  Jeffrey Gelorme ,  Luis Matienzo ,  Rebecca Northey ,  Michael Vincent

    IPC分类号： B32B3/00

    CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J9/02 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4069 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24917

    摘要： An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader quickly to ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the appended issued claims. 37 CFR §1.72(b).

    摘要翻译： 具有低且稳定的接触电阻的导电粘合剂（ECA）包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，铜颗粒，至少一种固化剂和至少一种有机酸催化剂 。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。 要强调的是，该摘要被提供以符合要求抽象的规则，这将允许搜索者或其他读者快速地确定技术公开的主题。 提交它的理解是，它不会用于解释或限制所附权利要求的范围或含义。 37 CFR§1.72（b）。

    Method for bonding heat sinks to overmold material and resulting structure
    18.
    发明授权
    Method for bonding heat sinks to overmold material and resulting structure 失效
    将散热片粘结到包覆成型材料和结构上的方法

    公开(公告)号：US07078802B2

    公开(公告)日：2006-07-18

    申请号：US10983563

    申请日：2004-11-08

    申请人： Michael Gaynes ,  William R. Hill

    发明人： Michael Gaynes ,  William R. Hill

    IPC分类号： H01L23/34 ,  H05H1/00 ,  B29C65/00

    CPC分类号： B29C59/14 ,  H01L21/56 ,  H01L2224/48472 ,  H01L2924/15311

    摘要： A method and resulting electronic package in which a heat sink is secured to the package's dielectric material (e.g., overmold). The surface of the dielectric is roughened (e.g., using an abrasive paper or pad) to enhance the subsequent dielectric-heat sink bond in which an adhesive is used. The dielectric material's roughened external surface(s), typically containing silicone material (e.g., silicone residue) which is an inherent by-product of many dielectric materials of the type used in such packaging, is (are) able to still be securely attached to the heat sink, despite the presence of said silicone. In another embodiment, the roughened surface enhances the marking of dielectric material of this type (e.g., using ink).

    摘要翻译： 一种方法和产生的电子封装，其中散热器固定到封装的电介质材料（例如，包覆成型）上。 电介质的表面被粗糙化（例如，使用研磨纸或垫）以增强随后的使用粘合剂的介电散热器接合。 电介质材料的粗糙化的外表面通常含有作为这种包装中使用的许多介电材料的固有副产品的有机硅材料（例如，硅氧烷残余物），其能够仍然可靠地连接到 散热器，尽管存在所述硅树脂。 在另一个实施方案中，粗糙化表面增强了这种类型的介电材料的标记（例如使用油墨）。