摘要:
An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.
摘要:
An oil passage structure of a chain-driven oil pump includes three lines of oil passages for supplying oil from the center support to the torque converter, a first oil passage for supplying oil to the torque converter through the inside of an input shaft of the torque converter, a second oil passage for supplying oil to the torque converter through a space defined by the outer periphery surface of the input shaft and the inner periphery surface of a stator shaft, and a third oil passage for supplying oil to the torque converter by bypassing the drive sprocket. The third oil passage is provided on the outer periphery side of the drive sprocket and in a position where it does not interfere with the operation of a chain. Accordingly, it is possible to utilize the flex lock-up to a maximum extent, and to reduce the diameter of the sprocket.
摘要:
A micro movable device includes: a micro movable substrate in which a micro movable unit is formed, the micro movable unit including a frame, a movable part, and a coupling part for coupling the frame and the movable part to define an axial center of rotation of the movable part; a supporting substrate; and a reinforced fixed part provided between the frame and the supporting substrate, and including a first spacer that joins the frame to the supporting substrate and an adhesive part that covers the first spacer and joins the frame to the supporting substrate, wherein the frame includes a first area facing the movable part in a direction of extent of the axial center, and a second area different from the first area, and the reinforced fixed part is bonded to the second area of the frame.
摘要:
A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip.
摘要:
A micro mirror unit includes a moving part carrying a mirror portion, a frame and torsion bars connecting the moving part to the frame. The moving part, the frame and the torsion bars are formed integral from a material substrate. The frame includes a portion thicker than the moving part.
摘要:
An inductor element and an integrated electronic component that facilitate achieving a higher Q value are provided. The inductor element includes a substrate, a coil unit spaced from the substrate, and a plurality of conductive columns. The coil unit includes a plurality of spiral coils each constituted of a spiral-shaped coil lead. The spiral coils are disposed such that their winding directions are the same, and that the coil lead of each spiral coil includes a portion extending between the coil lead of at least one of the other spiral coils. End portions of the spiral coils are fixed to the substrate via the conductive columns. The integrated electronic component of the invention includes such inductor element.
摘要:
An electronic component includes a substrate, a capacitor, and a wiring. The capacitor has a multilayer structure including a first electrode film provided on the substrate, a second electrode film of 2 to 4 μm in thickness disposed to face the first electrode film, and a dielectric film interposed between the first and the second electrode film. The wiring includes a joint portion connected to the second electrode film, on the opposite side of the dielectric film.
摘要:
A history concerning circumstances surrounding each item during distribution is obtained from a reusable measuring apparatus attached to the item or measuring apparatuses placed in locations such as rooms. Information about items of products in a distribution channel are managed by associating position information indicating the locations at both ends of a place where circumstance information is measured with measuring apparatuses with the information indicating the measuring apparatuses. When items are moved during distribution, information contained in a tag attached to the items is read at the locations at both ends of the place and is managed. To obtain information about circumstances surrounding an item at a particular place in the distribution channel, values measured with the measuring apparatuses during a relevant period are obtained on the basis of the position information indicating the locations at both ends of the particular place and on the read dates and times.
摘要:
The micro-actuation element (X1) includes a movable unit (111), a frame (112) and a coupler (113) for connecting these, where the unit, the frame and the coupler are integrally formed in a material substrate having a multi-layer structure that consists of electroconductive layers (110a-110c), such as a core conduction layer (110b), and insulation layers (110d, 110e) intervening between the electroconductive layers (110a-110c). The movable unit (111) includes a first structure originating in the core conduction layer (110b). The frame (112) includes a second structure originating in the core conduction layer (110b). The coupler (113) includes a plurality of electrically separated torsion bars (113a, 113b) that originate in the core conduction layer (110b) and are connected continuously to the first structure and the second structure.
摘要:
A plurality of micromirror chips are collectively made from a common substrate. Each of the micromirror chips is formed with a micromirror unit including a frame, a mirror-forming portion separate from the frame via spaces, and torsion bars connecting the mirror-forming portion to the frame. The common substrate is subjected to etching to provide the spaces and make division grooves for dividing the common substrate into the individual micromirror chips. The etching for the spaces and the etching for the division grooves are performed in parallel with each other.