Pattern forming method and method of manufacturing semiconductor device
    12.
    发明申请
    Pattern forming method and method of manufacturing semiconductor device 审中-公开
    图案形成方法和制造半导体器件的方法

    公开(公告)号:US20060127815A1

    公开(公告)日:2006-06-15

    申请号:US11296480

    申请日:2005-12-08

    IPC分类号: G03F7/00

    摘要: According to an aspect of the invention, there is provided a pattern forming method comprising forming a first resist film on a film to be worked formed on a semiconductor substrate, forming a second resist film on the first resist film, forming a resist pattern from the second resist film, forming an overcoat film containing a metal element or a semi-conducting element on the resist pattern, insolubilizing, in a predetermined solvent, a portion of the overcoat film at a predetermined distance from an interface between the overcoat film and the resist pattern, removing, with the solvent, a portion of the overcoat film soluble in the solvent to form an overcoat film pattern, transferring the overcoat film pattern to the first resist film to form a lower-layer resist film pattern, and transferring the lower-layer resist film pattern to the film to be worked to form a pattern on the film.

    摘要翻译: 根据本发明的一个方面,提供了一种图案形成方法,包括在半导体衬底上形成的待加工膜上形成第一抗蚀剂膜,在第一抗蚀剂膜上形成第二抗蚀剂膜,从第一抗蚀剂图案形成抗蚀剂图案 在抗蚀剂图案上形成含有金属元素或半导体元件的外涂膜,在规定的溶剂中不溶解从外涂膜与抗蚀剂之间的界面预定距离的一部分覆盖膜 用溶剂除去一部分可溶于溶剂的外涂膜形成外涂膜图案,将覆盖膜图案转印到第一抗蚀剂膜上以形成下层抗蚀剂膜图案, 层抗蚀剂膜图案到待加工的膜以在膜上形成图案。

    Method of forming a pattern
    14.
    发明授权
    Method of forming a pattern 失效
    形成图案的方法

    公开(公告)号:US06420271B2

    公开(公告)日:2002-07-16

    申请号:US09814839

    申请日:2001-03-23

    IPC分类号: H01L214763

    摘要: A method of forming a pattern comprising the steps of, forming a lower film on a substrate, the lower film being a film containing carbon atom at a ratio of 80 wt % or more, or a vapor phase deposition film, either applying an adhesion-promoting treatment to a surface of the lower film or forming an adhesion-promoting on the lower film, forming an intermediate film on a surface of the lower film, forming a resist film on the intermediate film, forming a resist pattern by conducting a patterning exposure of the resist film, forming an intermediate film pattern by transferring the resist pattern to the intermediate film, and forming a lower film pattern by transferring the intermediate film pattern to the lower film.

    摘要翻译: 一种形成图案的方法,包括以下步骤:在基底上形成下膜,下膜是含有80重量%以上的碳原子的膜或气相沉积膜, 促进对下膜的表面的处理或在下膜上形成粘合促进,在下膜的表面上形成中间膜,在中间膜上形成抗蚀剂膜,通过进行图案曝光形成抗蚀剂图案 的抗蚀剂膜,通过将抗蚀剂图案转印到中间膜而形成中间膜图案,并通过将中间膜图案转印到下膜来形成下膜图案。

    Alkali soluble phenol polymer photosensitive composition
    16.
    发明授权
    Alkali soluble phenol polymer photosensitive composition 失效
    ALKALI可溶性酚醛聚合物感光性组合物

    公开(公告)号:US5091282A

    公开(公告)日:1992-02-25

    申请号:US504300

    申请日:1990-04-03

    IPC分类号: G03F7/004 G03F7/038 G03F7/075

    摘要: This invention includes a photosensitive composition containing an alkali-soluble resin and a compound represented by formula (I), (II) or (III) described in the claims and the specification, a photosensitive composition containing an alkali-soluble polymer, a compound represented by formula (IV) described in the claims and the specification and a basic compound, and a photosensitive composition containing an alkali-soluble polymer, a compound represented by formula (VI) described in the claims and the specification and a compound which produces an acid upon radiation of light. A pattern formation method using these photosensitive compositions includes the steps of dissolving any one of the above photosensitive compositions in an organic solvent to prepare a photosensitive resin solution, coating the photosensitive resin solution on a substrate to form a photosensitive resin layer on the substrate, pattern-exposing the photosensitive resin layer, and developing the exposed resin layer with an aqueous alkaline solution. When the first or second photosensitive composition is used, a good pattern can also be formed by a method including the steps of dissolving either the first or second photosensitive composition in an organic solvent to prepare a photosensitive resin solution, coating the photosensitive resin solution on a substrate to form a photosensitive resin layer on the substrate, pattern-exposing the photosensitive resin layer, heating the pattern-exposed resin layer, exposing the entire surface of the heated resin layer, and developing the entirely exposed resin layer with an aqueous alkaline solution.

    Polysilanes, Polysiloxanes and silicone resist materials containing
these compounds
    18.
    发明授权
    Polysilanes, Polysiloxanes and silicone resist materials containing these compounds 失效
    聚硅烷,聚硅氧烷和含有这些化合物的硅氧烷抗蚀材料

    公开(公告)号:US4822716A

    公开(公告)日:1989-04-18

    申请号:US938874

    申请日:1986-12-08

    摘要: The polysilanes and polysiloxanes of the present invention are polymers that contain silicon in the principal chain, and contain in the side chains alkaline soluble groups such as phenol-based hydroxy group and carboxyl group.One silicone resist material of the present invention comprises the polysilane or the polysiloxane in the above.Another silicone resist material of the present invention contains the above polysilane or polysiloxane, and an appropriate photosensitive agent.Still another silicone resist material of the present invention does not contain the above photosensitive agent, and in its stead, it contains a group that possesses photosensitive to ultraviolet rays or the like, via a siloxane bonding in the principal chain. As a substance with such photosensitivity, one may mention, for example, o-nitrobenzylsilyl groups that presents alkaline solubility when it is irradiated by ultraviolet rays.Accordingly, the silicone resist materials of the present invention, especially the second and third silicone resist materials, are alkaline developable, and also possess a superior resistance to oxygen plasma. Therefore, they can be used as a top layer film in the two-layered resist system, making it possible to form very fine resist patterns, fast and with a minimum number of processing steps.

    摘要翻译: 本发明的聚硅烷和聚硅氧烷是在主链中含有硅并且在侧链中含有碱性可溶性基团如苯酚基羟基和羧基的聚合物。 本发明的一种硅氧烷抗蚀剂材料包含上述聚硅烷或聚硅氧烷。 本发明的另一种硅氧烷抗蚀剂材料含有上述聚硅烷或聚硅氧烷和适当的感光剂。 本发明的另一种硅氧烷抗蚀剂材料不含上述光敏剂,代替其中含有通过主链中的硅氧烷键具有紫外线等感光性的基团。 作为具有这种光敏性的物质,可以提及例如当用紫外线照射时呈现碱溶性的邻硝基苄基甲硅烷基。 因此,本发明的有机硅抗蚀剂材料,特别是第二和第三有机硅抗蚀剂材料是碱显影的,并且还具有优异的耐氧等离子体性。 因此,它们可以用作双层抗蚀剂系统中的顶层膜,使得可以形成非常精细的抗蚀剂图案,并且具有最少数量的加工步骤。

    Pattern Forming Method and Method of Manufacturing Semiconductor Device
    20.
    发明申请
    Pattern Forming Method and Method of Manufacturing Semiconductor Device 审中-公开
    图案形成方法及制造半导体器件的方法

    公开(公告)号:US20110039214A1

    公开(公告)日:2011-02-17

    申请号:US12857710

    申请日:2010-08-17

    IPC分类号: G03F7/20 H01L21/308

    摘要: A pattern forming method includes forming a photo resist film on a film to be processed, forming a protective film for protecting the photo resist film from an immersion liquid on the photo resist film by coating method, performing immersion exposure selectively to a region of part of the photo resist film via the immersion liquid, the immersion liquid being supplied onto the photo resist film, removing a residual substance including an affinitive part for the immersion liquid from the protective film after the forming the protective film and before the performing immersion exposure selectively to the region of part of the photo resist film, removing the protective film, and forming a pattern comprising the photo resist film by selectively removing an exposed region or a non-exposed region of the photo resist film.

    摘要翻译: 图案形成方法包括在被处理膜上形成光致抗蚀剂膜,通过涂布法在光致抗蚀剂膜上形成用于保护光致抗蚀剂膜的浸渍液的保护膜,选择性地进行部分浸渍曝光 通过浸渍液将该光致抗蚀剂膜,浸渍液体供给到光致抗蚀剂膜上,在形成保护膜之后,在进行浸渍曝光前,选择性地除去包含浸渍液的残留物质的残留物质, 通过选择性地去除光致抗蚀剂膜的曝光区域或未曝光区域,去除保护膜,以及形成包括光致抗蚀剂膜的图案。