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28 条记录 (耗时 0.028 秒)

    Wafer cassette used in high temperature baking process
    12.
    发明申请
    Wafer cassette used in high temperature baking process 审中-公开
    晶圆盒用于高温烘烤过程

    公开(公告)号：US20070029268A1

    公开(公告)日：2007-02-08

    申请号：US11196880

    申请日：2005-08-04

    申请人： Johnny Dai

    发明人： Johnny Dai

    IPC分类号： A47G19/08

    CPC分类号： H01L21/67326 ,  H01L21/6733

    摘要： A wafer cassette for consolidation in process of high temperature baking is provided. The wafer cassette includes one front end member, two sidewall plates, one back end member, a plurality of fixture slots, two resilient sheets and two supporting rods. By using this wafer cassette in high temperature baking process, the chance of having the wafer damage is minimized.

    摘要翻译： 提供了用于在高温烘烤过程中固结的晶片盒。 晶片盒包括一个前端构件，两个侧壁板，一个后端构件，多个固定槽，两个弹性片和两个支撑杆。 通过在高温烘烤工艺中使用该晶片盒，可以使晶片损坏的机会最小化。

    Semiconductor component handling device having an electrostatic dissipating film
    13.
    发明申请
    Semiconductor component handling device having an electrostatic dissipating film 审中-公开
    具有静电消散膜的半导体元件处理装置

    公开(公告)号：US20050056601A1

    公开(公告)日：2005-03-17

    申请号：US10496679

    申请日：2002-11-26

    申请人： Sanjiv Bhatt ,  Shawn Eggum

    发明人： Sanjiv Bhatt ,  Shawn Eggum

    IPC分类号： B65D21/02 ,  A47G19/08 ,  B65D1/00 ,  B65D1/24 ,  B65D25/04 ,  B65D25/10 ,  B65D85/57 ,  B65D85/86 ,  H01L21/673

    CPC分类号： H01L21/67323 ,  H01L21/6733 ,  H01L21/67366 ,  H01L21/67396

    摘要： The present invention relates generally to a system and method for including a thin conductive polymer film, such carbon-filled PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The conductive film of predetermined size and shape is selectively placed along a shaping surface in a mold cavity for alignment with a desired target surface of a moldable material. The molding process causes a surface of the film to bond to a contact surface of the moldable material such that the film is permanently adhered to the moldable material. As a result, a compatible conductive polymer can be selectively bonded only to those target surfaces where ESD is needed.

    摘要翻译： 本发明一般涉及一种用于在半导体加工工业中使用的处理机，运输机，载体，托盘等器件的成型工艺中包含薄导电聚合物膜，这种填充碳的PEEK的系统和方法。 预定尺寸和形状的导电膜选择性地沿着模腔中的成形表面放置，以与可模制材料的期望目标表面对准。 成型工艺使得膜的表面粘合到可模制材料的接触表面，使得膜永久地粘附到可模制材料上。 结果，可以将兼容的导电聚合物选择性地结合到需要ESD的那些目标表面上。

    Silicon carbide carrier for wafer processing
    18.
    发明授权
    Silicon carbide carrier for wafer processing 失效
    用于晶圆加工的碳化硅载体

    公开(公告)号：US5538230A

    公开(公告)日：1996-07-23

    申请号：US286942

    申请日：1994-08-08

    申请人： Thomas Sibley

    发明人： Thomas Sibley

    IPC分类号： A47F7/00 ,  B24C1/04 ,  B24C3/32 ,  C30B25/12 ,  C30B31/14 ,  H01L21/673 ,  B23Q3/00

    CPC分类号： H01L21/67326 ,  A47F7/0014 ,  B24C1/04 ,  B24C3/322 ,  C30B25/12 ,  C30B31/14 ,  H01L21/6733

    摘要： A single piece, high purity, full density semiconductor wafer holding fixture for holding a multiplicity of wafers and consisting essentially of chemical vapor deposited silicon carbide (CVD SiC). The wafer carrier is advantageous for the fabrication of electronic integrated circuits where high temperatures and/or corrosive chemicals present, where dimensional stability of the holder is advantageous to the process or where introduction of contaminating elements is deleterious to the process. The method for making such an article comprises shaping a substrate, e.g. graphite, which on one surface has the form of the desired shape, said form comprising raised longitudinal sections to support the silicon wafers at the edges of the wafers, chemically vapor depositing a layer of silicon carbide onto the substrate, removing the substrate intact or by burning, machining, grinding, gritblasting and/or dissolving, and grinding the silicon carbide in any areas where a more precise dimension is required.

    摘要翻译： 用于保持多个晶片并且基本上由化学气相沉积的碳化硅（CVD SiC）组成的单片，高纯度，全密度的半导体晶片保持夹具。 晶片载体有利于制造存在高温和/或腐蚀性化学品的电子集成电路，其中保持器的尺寸稳定性对于该方法是有利的或者其中引入污染元素对该方法是有害的。 制造这种制品的方法包括使基底成形，例如 石墨，其在一个表面上具有所需形状的形状，所述形式包括凸起的纵向部分，以在晶片的边缘处支撑硅晶片，将碳化硅层化学气相沉积到衬底上，完整地或通过 燃烧，加工，研磨，喷砂和/或溶解，以及在需要更精确尺寸的任何区域中研磨碳化硅。

    Method and apparatus for mounting slice base on wafer of semiconductor
    19.
    发明授权
    Method and apparatus for mounting slice base on wafer of semiconductor 失效
    用于安装半导体晶片上基片的方法和装置

    公开(公告)号：US5154873A

    公开(公告)日：1992-10-13

    申请号：US590806

    申请日：1990-10-01

    申请人： Tsutomu Sato ,  Yasushi Yoshimura

    发明人： Tsutomu Sato ,  Yasushi Yoshimura

    IPC分类号： H01L21/304 ,  B28D1/00 ,  B28D5/00 ,  H01L21/673 ,  H01L21/687

    CPC分类号： H01L21/67326 ,  B28D1/005 ,  B28D5/0082 ,  H01L21/6733

    摘要： It is known that it is advantageous in semiconductor wafer production to re-slice a semiconductor wafer having impurity diffusion layers on both sides which are processed or doped in advance of the re-slicing process. In the re-slicing process, a thin slice base is mounted on the periphery of a semiconductor wafer prior to the re-slicing process for protecting the periphery of the wafer from chipping off damage during the re-slicing process by an ID saw or the like. The present invention provides several examples of methods and apparatus for mounting a slice base prepared in advance on the periphery of a semiconductor wafer by utilizing the method and apparatus of the present invention. In addition, another method and apparatus for simultaneously molding and mounting a molded type slice base by using a thermosetting type resin on the periphery of the semiconductor, whereby the re-slicing process of a semiconductor wafer is extremely improved in production and labor cost.

    Wafer carrier
    20.
    发明授权
    Wafer carrier 失效
    晶圆载体

    公开(公告)号：US5154301A

    公开(公告)日：1992-10-13

    申请号：US758604

    申请日：1991-09-12

    申请人： Robert D. Kos

    发明人： Robert D. Kos

    IPC分类号： B65D85/00 ,  B65D85/86 ,  B65G49/07 ,  H01L21/673

    CPC分类号： H01L21/67326 ,  H01L21/6733

    摘要： A moldable plastic, distortion and warp resistant wafer carrier with forked end wall portions that tie into the sidewalls of the carrier. The forked end wall portions from triangular column like supports between an end wall and sidewalls of the carrier such that the carrier maintains structural integrity even when its temperature fluctuates between ambient and 180.degree. C. temperatures in a relatively short time period. The structural integrity of the carrier is further enhanced by the end wall having an integrally formed bend which is disposed at a right angle relative to the forked end wall portions.

    摘要翻译： 一种可模制塑料，变形和经向的晶片载体，其具有连接到载体的侧壁的分叉端壁部分。 在端壁和载体的侧壁之间的三角柱状支撑件的分叉端壁部分使得即使当其温度在相对短的时间段内在环境温度和180℃之间波动时，载体也保持结构完整性。 通过具有一体形成的弯曲部的端壁，相对于分叉端壁部分成直角设置，进一步增强了载体的结构完整性。