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公开(公告)号:US06299716B1
公开(公告)日:2001-10-09
申请号:US09292319
申请日:1999-04-15
申请人: David S. Bettinger
发明人: David S. Bettinger
IPC分类号: B32B3126
CPC分类号: H01Q17/00 , B29C63/40 , B29L2031/30 , C09D5/008 , Y10T428/25 , Y10T428/254 , Y10T428/28 , Y10T428/287
摘要: A conformable coating composite, comprising a heat-shrink polymeric matrix sheet embedded with low signature functional material and coated with an adhesive layer, is used for the permanent retrofit to the surface of a vehicle to reduce detection. The method of utilization comprises the steps of applying the matrix sheet, followed by thermally conforming the matrix sheet to the vehicle, and finally thermally activating the adhesive to achieve permanent coating attachment.
摘要翻译: 使用包含嵌入低签名功能材料并涂覆有粘合剂层的热收缩聚合物基质片的适形涂层复合材料,用于对车辆表面的永久性改装以减少检测。 使用方法包括以下步骤:施加基质片材,然后将基质片材热粘合到车辆上,最后热激活粘合剂以实现永久性涂层附着。
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公开(公告)号:US06287652B1
公开(公告)日:2001-09-11
申请号:US09207249
申请日:1998-12-09
IPC分类号: B32B3126
摘要: A sampler package for fluid cosmetics, creams, gels, and the like having a liquid solvent base includes a transparent composite laminate sealed with a composite laminate having a foil barrier layer. The sealed composite laminates form a pouch in which the cosmetic sample is contained. The transparent composite laminate is preferably adhesively laminated with either a biaxially oriented PVDC film or a polychlorotrifluoroethylene film as the moisture vapor barrier layer. The moisture permeability rate of the barrier film is at most 0.065 g/100 in2/24 hrs @100° F.,90% RH. Use of such transparent films as the barrier laminate permits the sampler package to be formed with a transparent window through which the color, texture, etc. of the sampler product may be viewed.
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公开(公告)号:US06280546B1
公开(公告)日:2001-08-28
申请号:US09428211
申请日:1999-10-27
IPC分类号: B32B3126
CPC分类号: B32B27/12 , B32B5/024 , B32B27/32 , B32B33/00 , B32B38/0036 , B32B2262/0253 , B32B2305/18 , B32B2305/188 , B32B2307/581 , B32B2307/7242 , B32B2307/7265 , B32B2309/02 , B32B2309/04 , B32B2309/12 , B32B2323/043 , B32B2323/046 , Y10T442/3854 , Y10T442/3886
摘要: A method for making a cut and puncture resistant laminated fabric under a laminating pressure including the steps of rolling a thermoplastic film and a fabric constructed with a substantial majority of a high performance fiber around a small diameter core to form a wound bundle. The wound bundle is heated at a temperature of between about 250 and about 285 degrees Fahrenheit for a sufficient length of time to laminate the thermoplastic film to the fabric.
摘要翻译: 一种在层压下制造抗切割和抗刺穿层压织物的方法,包括以下步骤:将围绕小直径芯的绝大多数高性能纤维构造的热塑性薄膜和织物卷起以形成缠绕束。 将伤口束在约250至约285华氏度的温度下加热足够长的时间以将热塑性膜层压到织物上。
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公开(公告)号:US06270599B1
公开(公告)日:2001-08-07
申请号:US09214246
申请日:1999-04-14
申请人: John Wood
发明人: John Wood
IPC分类号: B32B3126
CPC分类号: B29C65/5042 , B29C35/10 , B29C53/38 , B29C65/1412 , B29C65/1416 , B29C65/1419 , B29C65/1435 , B29C65/1441 , B29C65/1445 , B29C65/1464 , B29C65/1467 , B29C65/148 , B29C65/1483 , B29C65/1496 , B29C65/4815 , B29C65/5021 , B29C65/5092 , B29C65/62 , B29C66/1122 , B29C66/43 , B29C66/4322 , B29C66/71 , B29C66/73365 , B29C66/81267 , B29C66/83411 , B29C66/83417 , B29C66/91216 , B29C66/91221 , B29C66/91411 , B29C66/919 , B29C66/91935 , B29C66/92 , B29C66/934 , B29C66/939 , B29C66/952 , B29C66/9672 , B29C2035/0822 , B29K2909/08 , B29K2995/0027 , B29K2023/06 , B29K2075/00
摘要: Method and apparatus for heat-welding two members by applying radiation, such as infra-red radiation, through one of the members to enter layer(s) interposed between the two members. Method relies on inclusions through thickness of the layer(s) to be responsive to said radiation to raise temperature through thickness and promote bonds at inter-faces with surfaces of said members. The bonds are assessed using thermal imaging camera detecting a near visible radiation arising from the layer(s), which radiation is different from infra-red used for heating.
摘要翻译: 通过其中一个部件施加诸如红外辐射的辐射来对两个部件进行热焊接以进入夹在两个部件之间的层的方法和装置。 方法依赖于穿过层的厚度的夹杂物以响应于所述辐射,以通过厚度升高温度并促进与所述构件的表面的接合处的键。 使用热成像摄像机来检测粘结层,该摄影摄像机检测从层产生的近似可见的辐射,该辐射与用于加热的红外线不同。
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15.
公开(公告)号:US06258191B1
公开(公告)日:2001-07-10
申请号:US09153988
申请日:1998-09-16
申请人: Benjamin V. Fasano , Lewis S. Goldmann , Richard F. Indyk , Sundar M. Kamath , Scott I. Langenthal , Srinivasa S. Reddy
发明人: Benjamin V. Fasano , Lewis S. Goldmann , Richard F. Indyk , Sundar M. Kamath , Scott I. Langenthal , Srinivasa S. Reddy
IPC分类号: B32B3126
CPC分类号: H01L23/15 , H01L21/481 , H01L2924/0002 , H01L2924/09701 , Y10S428/901 , H01L2924/00
摘要: Multilayer glass ceramic substrate electronic components having enhanced flexibility and strength are prepared using greensheets as a top and/or bottom layer, which greensheets are made from a glass-ceramic greensheet casting composition comprising crystallizable glass, a binder resin and a solvent system, and preferably a plasticizer. The top and/or bottom greensheets have a lower coefficient of thermal expansion (CTE) than the greensheets used to make the internal layers of the MLC and both greensheets are characterized by having, after sintering, a microstructure which is greater than 99% crystalline. A crystalline matrix forming material such as P2O5 is preferably used in the composition. This type structure, in combination with the lower CTE, has been found to provide an MLC having enhanced strength and flexibility.
摘要翻译: 具有增强的柔韧性和强度的多层玻璃陶瓷基片电子元件是使用绿叶作为顶层和/或底层制备的,所述毛坯由包含可结晶玻璃,粘合剂树脂和溶剂体系的玻璃陶瓷毛坯流延组合物制成, 增塑剂。 顶部和/或底部毛坯的热膨胀系数(CTE)比用于制造MLC的内层的毛坯厚度都要小,并且在烧结后具有大于99%结晶度的微观结构。 在组合物中优选使用诸如P 2 O 5的结晶基质形成材料。 已经发现这种类型结构与较低CTE组合提供了具有增强的强度和柔性的MLC。
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16.
公开(公告)号:US06231707B1
公开(公告)日:2001-05-15
申请号:US09158615
申请日:1998-09-22
申请人: Dinesh Gupta , L. Wynn Herron , John U. Knickerbocker , David C. Long , Jawahar P. Nayak , Robert A. Rita
发明人: Dinesh Gupta , L. Wynn Herron , John U. Knickerbocker , David C. Long , Jawahar P. Nayak , Robert A. Rita
IPC分类号: B32B3126
CPC分类号: H05K3/4061 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/4611 , H05K3/4629 , H05K2201/09063 , H05K2201/096 , H05K2201/09609 , H05K2203/308 , Y10T156/1056 , H01L2924/00
摘要: In the formation of multilayer ceramic substrates, greensheets are utilized which have the same pattern and number of vias punched in each greensheet. Then, selected vias may be filled with metallic paste to form the internal connections of the multilayer ceramic substrate. The remaining vias may be filled with a fugitive material or left totally unfilled. Also disclosed is the multilayer ceramic substrate produced by this method.
摘要翻译: 在多层陶瓷基板的形成中,使用具有与每个毛坯中冲孔相同的图案和数量的通孔的刮板。 然后,可以用金属浆料填充所选择的通孔,以形成多层陶瓷基板的内部连接。 其余的通孔可能充满了一种逃逸材料,或者完全没有填充。 还公开了通过该方法制造的多层陶瓷基板。
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公开(公告)号:US06193834B1
公开(公告)日:2001-02-27
申请号:US09117237
申请日:1999-04-23
申请人: Cin Lee Smith
发明人: Cin Lee Smith
IPC分类号: B32B3126
CPC分类号: B29C66/52298 , B29C65/3612 , B29C65/362 , B29C65/364 , B29C65/3644 , B29C65/3668 , B29C65/368 , B29C66/112 , B29C66/1222 , B29C66/1224 , B29C66/131 , B29C66/5221 , B29C66/52241 , B29C66/52292 , B29C66/52297 , B29C66/80 , F16L47/02 , Y10S285/921
摘要: An apparatus for fusing a pipe to a fitting includes an induction heating element wholly encased or coated with a flusible thermoplastic polymeric material, a fitting having a socket or a flange. The induction heating element is adapted to be inserted into said socket or mounted on said flange, the fitting and the element together defining a throughbore, a portion of a pipe adapted to be inserted into the throughbore or mountable on said flange. The apparatus also includes a locating and maintaining member on the induction heating element with one or more projections adapted to be snap-fitted on the fitting, the pipe or both, and capable of locating and maintaining the position of the heating element relative to the fitting or the member portion. The induction fusion element is capable of fusing the fitting and the pipe portion.
摘要翻译: 用于将管道熔合到配件的装置包括完全包裹或涂覆有易燃热塑性聚合材料的感应加热元件,具有插座或凸缘的配件。 感应加热元件适于插入所述插座或安装在所述凸缘上,所述配件和所述元件一起限定出通孔,适于插入所述通孔中的管的一部分或可安装在所述凸缘上。 该装置还包括位于感应加热元件上的定位和保持构件,其具有一个或多个凸起,该凸起适于卡扣配合在配件,管或两者上,并且能够定位和保持加热元件相对于配件的位置 或构件部分。 感应熔合元件能够使配件和管道部分熔合。
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公开(公告)号:US06833043B1
公开(公告)日:2004-12-21
申请号:US09479575
申请日:2000-01-07
IPC分类号: B32B3126
CPC分类号: B32B27/08 , B32B25/04 , C08J5/12 , C08L19/003 , Y10T156/1089 , Y10T428/1352 , Y10T428/3154 , Y10T428/31544
摘要: A method for increasing the adhesion of a first layer comprising a fluoropolymer substantially free of interpolymerized units derived from vinylidene fluoride to a second layer comprising a curable elastomer is described. The method comprises adding a dehydrofluorinating composition to the curable elastomer, contacting the layers and curing the layered article so formed. The resulting multilayer compositions and articles are also disclosed.
摘要翻译: 描述了一种用于增加包含基本上不含衍生自偏二氟乙烯的共聚单元的含氟聚合物的第一层与包含可固化弹性体的第二层的粘合力的方法。 该方法包括向可固化弹性体中加入脱氟化氢组合物,使层接触并固化如此形成的层状制品。 还公开了所得的多层组合物和制品。
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公开(公告)号:US06780267B1
公开(公告)日:2004-08-24
申请号:US09830493
申请日:2001-09-04
申请人: Hideki Kuramitsu , Atsuo Nagai , Yoshiya Sakaguchi
发明人: Hideki Kuramitsu , Atsuo Nagai , Yoshiya Sakaguchi
IPC分类号: B32B3126
CPC分类号: H01L21/4857 , H01G4/206 , H01G4/30 , H01L21/481 , H05K1/0306 , H05K3/0011 , H05K3/1283 , H05K3/4629 , H05K2203/0143 , H05K2203/0278
摘要: A method of manufacturing ceramic includes a first step of compressing a ceramic sheet (10a) containing ceramic powder and organic to reduce porosity, a second step of forming a conductor layer (2) of metallic paste on the ceramic sheet (10b), a third step of stacking a plurality of ceramic sheets (10b) into a laminate such that each ceramic sheet (10b) is sandwiched between conductor layers (2), and a fourth step of sintering the laminate. Since the conductor layer (2) is formed on the ceramic sheet (10b) with its porosity reduced, metallic components are hindered from passing into the ceramic sheet (10b). The conductor layer can be formed by transferring onto a ceramic sheet to suppress the diffusion of the metallic components of the conductor layer. This method reduces short circuits of ceramic devices and increases the yield rate.
摘要翻译: 制造陶瓷的方法包括:压缩含有陶瓷粉末和有机物的陶瓷片(10a)以降低孔隙率的第一步骤,在陶瓷片(10b)上形成金属膏的导体层(2)的第二步骤,第三步骤 将多个陶瓷片(10b)堆叠成层叠体,使得每个陶瓷片(10b)夹在导体层(2)之间的步骤,以及烧结层压体的第四步骤。 由于导电体层(2)形成在其孔隙率降低的陶瓷片(10b)上,金属成分被阻碍进入陶瓷片(10b)。 可以通过转印到陶瓷片上来抑制导体层的金属成分的扩散而形成导体层。 这种方法可以减少陶瓷器件的短路并提高产量。
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公开(公告)号:US06758926B2
公开(公告)日:2004-07-06
申请号:US10096874
申请日:2002-03-14
申请人: Hideyuki Harada , Hirofumi Sunahara
发明人: Hideyuki Harada , Hirofumi Sunahara
IPC分类号: B32B3126
CPC分类号: H01L21/4807 , B32B3/266 , B32B38/14
摘要: A method for fabricating a multilayer ceramic substrate having a cavity with multi-steps therein for mounting an electronic component is provided. A block is inserted into a lower cavity segment of the cavity formed in a green sheet laminate to be the multilayer ceramic substrate, wherein the block has substantially the same three-dimensional shape as that of the cavity segment and has a height equal to or larger than the depth of the cavity segment. Thus, the pressing step is performed in a state such that the cavity has an apparent single step.
摘要翻译: 提供了一种制造多层陶瓷基板的方法,该多层陶瓷基板具有用于安装电子部件的多级的空腔。 将一个块插入到形成于生片层压板中的作为多层陶瓷基板的空腔的下腔段中,其中该块具有与空腔段基本相同的三维形状,并且具有等于或大于其的高度 比腔段的深度。 因此,按照这样的状态进行压制步骤,使得空腔具有明显的单一步骤。
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