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公开(公告)号：US12020867B2
公开(公告)日：2024-06-25
申请号：US18110396
申请日：2023-02-16
发明人： Daiki Fukunaga , Hideaki Tanaka , Masahiro Wakashima , Daisuke Hamada , Hironori Tsutsumi , Satoshi Maeno , Ryota Aso , Koji Moriyama , Akihiro Tsuru
CPC分类号： H01G4/1227 , H01G4/0085 , H01G4/012 , H01G4/224 , H01G4/2325 , H01G4/30
摘要： An electronic component includes a laminate in which a plurality of dielectric layers and a plurality of internal electrodes are alternately laminated and external electrodes electrically connected to the internal electrodes. A side margin portion as a region in which the plurality of internal electrodes is not provided when a section of the laminate having the length direction and the width direction is viewed from the laminating direction includes a plurality of side margin layers laminated in the width direction. An outer layer portion as a region in which the plurality of internal electrodes is not provided except for the side margin portion when a section of the laminate including the laminating direction and the width direction is viewed from the length direction includes a plurality of layer-margin layers laminated in the laminating direction.
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公开(公告)号：US20240203661A1
公开(公告)日：2024-06-20
申请号：US18384784
申请日：2023-10-27
发明人： Sim Chung KANG , Jong Ho LEE , Eun Jung LEE , Hyun Sik CHAE , Sun Mi KIM , Dae Jin SHIM
CPC分类号： H01G4/30 , H01G4/005 , H01G4/1227 , H01G4/224
摘要： A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction; external electrodes disposed on the body; and side margin portions disposed on the body, wherein an average content of Sn included in the side margin portion is 0.1 mol % or more and 4.0 mol % or less, wherein a Ba/Ti ratio of the side margin portion is greater than 1.040 and less than 1.070, and wherein an average size of a plurality of dielectric grains included in the side margin portion satisfies 100 nm or more and 290 nm or less.
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公开(公告)号：US12002629B2
公开(公告)日：2024-06-04
申请号：US17856452
申请日：2022-07-01
发明人： Chae Min Park
摘要： A multilayer electronic component includes a body including a dielectric layer and an internal electrode, an external electrode disposed outside the body, and sealing portions disposed on outer surfaces of the body, wherein the external electrodes and the sealing portions include glass, the sealing portions include first sealing portions that are disposed between the body and the external electrodes, and second sealing portions that extend from the first sealing portions in the second direction and are not in contact with the external electrodes, and an average length of the second sealing portion is 20 μm or more.
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公开(公告)号：US11978593B2
公开(公告)日：2024-05-07
申请号：US17554541
申请日：2021-12-17
发明人： Satoru Jogan , Kimiaki Kikuchi
摘要： A film capacitor 1 that includes: a capacitor element including a metallized film with a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein the outer case includes a resin composition that contains a liquid crystal polymer and an inorganic filler, and an amount of exposure of the inorganic filler from an outer surface of the outer case is 5% to 90%.
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公开(公告)号：US20240105389A1
公开(公告)日：2024-03-28
申请号：US18079977
申请日：2022-12-13
发明人： MING-TSUNG LIANG , HSUAN-YI LIN
摘要： A wound capacitor package structure and a method of manufacturing the same are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly, a package casing and a protruding sealing element. The conductive assembly includes a first conductive pin and a second conductive pin. The package casing is configured to receive the wound assembly. The protruding sealing element is arranged inside and cooperates with the package casing. The package casing is configured to receive the wound assembly. The protruding sealing element is disposed inside the package casing and cooperating with the package casing. The package casing has a surrounding concave position-limiting portion recessed inward, and a surrounding convex end portion protruding from the surrounding concave position-limiting portion. The protruding sealing element has a main sealing portion pressed by the surrounding concave position-limiting portion, and an auxiliary sealing portion protruding from the main sealing portion.
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公开(公告)号：US11935696B2
公开(公告)日：2024-03-19
申请号：US17788816
申请日：2021-06-29
申请人： NUINTEK CO LTD
发明人： Dae-Jin Park , Ying-Won Jeon , Jin-A Park , Hyeon-Jin Kim , Taek-Hyeon Lee
摘要： A capacitor includes a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device and having a first lead terminal on an exposed side, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor device and having a second lead terminal on an exposed side, and an insulating sheet disposed between the first busbar and the second busbar to insulate an overlap region; a plastic case having a 3D space formed by four sides and a bottom to accommodate the capacitor module and having an open top; a metallic external wall is formed outside one side of the four sides or the bottom of the plastic case; and a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case.
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公开(公告)号：US20240071691A1
公开(公告)日：2024-02-29
申请号：US18502440
申请日：2023-11-06
发明人： Takeshi KAGAWA , Masaki TSUKIDA
摘要： A capacitor that includes: a substrate having a first principal surface and a second principal surface opposed to each other in a thickness direction, wherein the first principal surfaces includes a step in a plan view from the thickness direction; an insulating film on the first principal surface of the substrate; a first electrode layer on the insulating film and positioned within a boundary defined by the step in the plan view; a dielectric film on the first electrode layer; a second electrode layer on the dielectric film; a moisture-resistant film on the dielectric film and the second electrode layer; a protective layer on the moisture-resistant film; and an outer electrode penetrating through the protective layer.
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18.发明授权公开(公告)号：US11904073B2
公开(公告)日：2024-02-20
申请号：US17975245
申请日：2022-10-27
发明人： Alexander Loo , Damiano Patron , Matthew Page
IPC分类号： A61N1/02 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , H05K1/02 , H05K1/18 , H05K3/00 , H01G4/005 , H01G4/018 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01G4/224 , H01G4/228 , H01G4/236 , A61L31/02 , H01R4/02 , H01R4/60 , H01R43/02 , H05K3/32 , H01R4/04 , H01Q1/27 , H01Q23/00 , H01R12/53
CPC分类号： A61L31/026 , H01Q1/273 , H01Q23/00 , H01R4/029 , H01R4/04 , H01R4/60 , H01R12/53 , H01R43/0256 , H05K1/18 , H05K3/0047 , H05K3/321 , H05K3/328 , H05K2201/10257 , H05K2201/10295 , H05K2203/049
摘要： A biocompatible electrical connection includes a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate. The second adhesive fills an annular space between a hole in the substrate and the ferrule. The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate.
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公开(公告)号：US11901129B2
公开(公告)日：2024-02-13
申请号：US17784741
申请日：2021-03-11
申请人： NICHICON CORPORATION
发明人： Takashi Mori , Yasuyuki Murakami
摘要： The insulating member is integrated with only one of the busbars by insert molding in which one of opposing plate members in either one of the busbars is used as an insert target. The insulating member includes an insulation active portion, a reinforcing portion and a connecting portion. The insulation active portion is disposed on a back-surface side of one of the opposing plate portions and is interposed between the back-surface side and the other one of the opposing plate portions. The reinforcing portion is disposed on the front-surface side of the one of the opposing plate portions. The connecting portion serves to connect the insulation active portion and the reinforcing portion into an integral unit. In the insulating member, lower end regions of the insulation active portion, reinforcing portion and connecting portion, which are close to the capacitor element and extending from an upper-surface side to a lower-surface side of a side plate portion, are embedded in a mold resin that covers the side plate portion.
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公开(公告)号：US20240029957A1
公开(公告)日：2024-01-25
申请号：US18362132
申请日：2023-07-31
发明人： Yuuta HOSHINO
摘要： An electronic component that includes: a ceramic body; an external electrode on a first part of a surface of the ceramic body; and a glass layer covering at least a second part of the surface of the ceramic body, wherein the glass layer contains silicon atoms, titanium atoms, and zirconium atoms, and the glass layer has a titanium dispersion proportion of 90% or more and a zirconium dispersion proportion of 60% or more.
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