Method for determining a parameter of a processing process and processing machine

    公开(公告)号:US12053840B2

    公开(公告)日:2024-08-06

    申请号:US17226094

    申请日:2021-04-09

    IPC分类号: B23K26/70 B23K26/38

    CPC分类号: B23K26/705 B23K26/38

    摘要: A method determines at least one parameter for a process quality during a processing process. The method includes: processing a workpiece while moving a processing tool and the workpiece relative to one another; monitoring a region on the workpiece; determining the at least one parameter for the process quality based on the monitored region; and determining at least one position-dependent parameter for the process quality based on a plurality of measured values of the at least one parameter at a same processing position, or determining at least one direction-dependent parameter for the process quality based on the plurality of measured values of the at least one parameter in a same processing direction.

    SYSTEM AND METHODS FOR IMPROVED SHEET METAL CUTTING

    公开(公告)号:US20240227056A1

    公开(公告)日:2024-07-11

    申请号:US18408378

    申请日:2024-01-09

    摘要: A plasma cutting system for measuring or monitoring the voltage between a plasma torch and the material being cut to determine a voltage or voltage signature and comparing that measurement against predetermined values to indicate that an initial pierce of the material is complete, and based on the measurement, moving the torch or the material to a different location for additional cutting. The system further provides a Fix Drawing Tool, which will automatically detect and fix gaps or overlaps in a drawing that are very difficult to find visually. These gaps and overlaps become a problem when trying to make a proper toolpath because a CAM program requires a clean, closed shape. The system also provides a Dynamic Corner Looping system, which automatically adjusts with the feed-rate and accelerations of the toolpath and plasma machine, eliminates unwanted dross, sharpens corners and minimizes material loss. A pendant tethering system is also disclosed for managing control of a CNC machine remotely. Additional disclosed functionality includes a data collection system, a manual hand wheel with 3D simulation and a multiple fabrication head management system.

    MESHING STRUCTURE FOR PLATE WELDING AND TACK-FREE WELDING DEVICE AND METHOD

    公开(公告)号:US20240217037A1

    公开(公告)日:2024-07-04

    申请号:US17802005

    申请日:2021-10-28

    IPC分类号: B23K37/00 B23K26/38 B23K28/02

    CPC分类号: B23K37/00 B23K26/38 B23K28/02

    摘要: A meshing structure for plate welding, and a tack-free welding device and method are provided. The device comprises a connecting frame, a welding gun, and a cutting mechanism, the welding gun is fixed on the connecting frame, and the cutting mechanism is connected to the connecting frame. The meshing structures are disposed on welded plates, and after being assembled, the two plates can be restrained by the meshing structures in multiple dimensions. Before welding, edges of the plates are cut according to the form of the meshing structures, then the plates are assembled and meshed; after the position of the welding gun is adjusted, the cutting mechanism and the welding gun are driven by a welding robot or a special welding machine to move along a weld; and the meshing structures are removed by the cutting mechanism, and then normal welding is performed by the welding gun.

    LASER PROCESSING METHOD
    18.
    发明公开

    公开(公告)号:US20240213439A1

    公开(公告)日:2024-06-27

    申请号:US18500112

    申请日:2023-11-02

    发明人: Haruhiko YAMAMOTO

    IPC分类号: H01M4/04 B23K26/142 B23K26/38

    摘要: A laser processing method for an electrode is provided that can suppress reduction in a light condensing property for a laser due to a dust, such as fume, while suppressing vibration at a laser processing time. By the present disclosure, a method for performing a laser processing on a strip-like shaped electrode is provided. The herein disclosed method includes carrying the strip-like shaped electrode to a previously set processing area in a longitudinal direction, and includes performing laser radiation on a surface of the electrode in the processing area under a state where a first air flow configured to flow on one surface of the electrode and a second air flow configured to flow on the other surface of the electrode are formed.

    System and method for cutting film
    19.
    发明授权

    公开(公告)号:US11999015B2

    公开(公告)日:2024-06-04

    申请号:US17099073

    申请日:2020-11-16

    申请人: NPS CO., LTD.

    发明人: Seong Ho Bae

    摘要: Disclosed herein is a film cutting system for dividing and forming a film sheet having a predetermined unit width and unit length from a raw film by laser cutting of the raw film. The film cutting system includes: a supply unit configured to intermittently supply the raw film by a predetermined unit supply length in a length direction of the raw film; a first laser unit including first and second laser nozzles each configured to radiate a laser beam onto the raw film, and a first head driver configured to convey the first laser nozzle and the second laser nozzle in a width direction of the raw film perpendicular to the length direction in a reciprocating manner; and a second laser unit including a laser nozzle disposed spaced apart from the first laser unit by the unit length in the length direction and configured to radiate a laser beam onto the raw film, and a second head driver configured to convey the laser nozzle in the width direction in a reciprocating manner, wherein, when the raw film is supplied by the supply unit, the first head driver dispose the first laser nozzle and the second laser nozzle so as to be spaced apart from each other by the unit width, and each of the first laser nozzle and the second laser nozzle radiates, in the length direction, the laser beam onto the raw film supplied by the supply unit to slit the raw film, and wherein, when the slitting of the raw film is completed, the supply unit stops supplying the raw film; the first head driver conveys one of the first laser nozzle and the second laser nozzle in the width direction; the second head driver conveys the laser nozzle in the width direction; and the one of the first laser nozzle and the second laser nozzle and the laser nozzle respectively radiate the laser beam onto the raw film in the width direction to cut the raw film to divide and form the film sheet from the raw film.