TECHNIQUES AND CONFIGURATIONS TO IMPART STRAIN TO INTEGRATED CIRCUIT DEVICES
    194.
    发明申请
    TECHNIQUES AND CONFIGURATIONS TO IMPART STRAIN TO INTEGRATED CIRCUIT DEVICES 审中-公开
    对集成电路设备进行驱动的技术和配置

    公开(公告)号:US20140103294A1

    公开(公告)日:2014-04-17

    申请号:US14106556

    申请日:2013-12-13

    Abstract: Embodiments of the present disclosure describe techniques and configurations to impart strain to integrated circuit devices such as horizontal field effect transistors. An integrated circuit device includes a semiconductor substrate, a quantum well channel coupled with the semiconductor substrate, a source structure coupled with the quantum well channel, a drain structure coupled with the quantum well channel and a strain-inducing film disposed on and in direct contact with material of the source structure and the drain structure to reduce resistance of the quantum well channel by imparting a tensile or compressive strain on the quantum well channel, wherein the quantum well channel is disposed between the strain-inducing film and the semiconductor substrate. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例描述了为诸如水平场效应晶体管等集成电路器件施加应变的技术和配置。 集成电路器件包括半导体衬底,与半导体衬底耦合的量子阱沟道,与量子阱沟道耦合的源极结构,与量子阱沟道耦合的漏极结构以及直接接触的应变诱导膜 其中源结构和漏极结构的材料通过在量子阱沟道上施加拉伸或压缩应变来降低量子阱沟道的电阻,其中量子阱沟道设置在应变诱导膜和半导体衬底之间。 可以描述和/或要求保护其他实施例。

    INCREASING CARRIER INJECTION VELOCITY FOR INTEGRATED CIRCUIT DEVICES
    198.
    发明申请
    INCREASING CARRIER INJECTION VELOCITY FOR INTEGRATED CIRCUIT DEVICES 有权
    增加集成电路设备的载波速度

    公开(公告)号:US20130240838A1

    公开(公告)日:2013-09-19

    申请号:US13872966

    申请日:2013-04-29

    Abstract: Embodiments of the present disclosure describe structures and techniques to increase carrier injection velocity for integrated circuit devices. An integrated circuit device includes a semiconductor substrate, a first barrier film coupled with the semiconductor substrate, a quantum well channel coupled to the first barrier film, the quantum well channel comprising a first material having a first bandgap energy, and a source structure coupled to launch mobile charge carriers into the quantum well channel, the source structure comprising a second material having a second bandgap energy, wherein the second bandgap energy is greater than the first bandgap energy. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例描述了用于增加集成电路器件的载流子注入速度的结构和技术。 集成电路器件包括半导体衬底,与半导体衬底耦合的第一阻挡膜,耦合到第一阻挡膜的量子阱沟道,该量子阱沟道包括具有第一带隙能量的第一材料和耦合到 将移动电荷载流子发射到量子阱沟道中,源结构包括具有第二带隙能量的第二材料,其中第二带隙能量大于第一带隙能量。 可以描述和/或要求保护其他实施例。

    Increasing carrier injection velocity for integrated circuit devices
    200.
    发明授权
    Increasing carrier injection velocity for integrated circuit devices 有权
    增加集成电路器件的载流子注入速度

    公开(公告)号:US08440998B2

    公开(公告)日:2013-05-14

    申请号:US12643848

    申请日:2009-12-21

    Abstract: Embodiments of the present disclosure describe structures and techniques to increase carrier injection velocity for integrated circuit devices. An integrated circuit device includes a semiconductor substrate, a first barrier film coupled with the semiconductor substrate, a quantum well channel coupled to the first barrier film, the quantum well channel comprising a first material having a first bandgap energy, and a source structure coupled to launch mobile charge carriers into the quantum well channel, the source structure comprising a second material having a second bandgap energy, wherein the second bandgap energy is greater than the first bandgap energy. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例描述了用于增加集成电路器件的载流子注入速度的结构和技术。 集成电路器件包括半导体衬底,与半导体衬底耦合的第一阻挡膜,耦合到第一阻挡膜的量子阱沟道,该量子阱沟道包括具有第一带隙能量的第一材料和耦合到 将移动电荷载流子发射到量子阱沟道中,源结构包括具有第二带隙能量的第二材料,其中第二带隙能量大于第一带隙能量。 可以描述和/或要求保护其他实施例。

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