公开(公告)号：US09435763B2

公开(公告)日：2016-09-06

申请号：US13929515

申请日：2013-06-27

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Suman Cherian

IPC: G01N27/327

CPC classification number: G01N27/3274 ,  G01N27/327

Abstract: A bio-fluid test strip includes a fluid receiving area and a contact pad area for interfacing with a fluid sensing device. The test strip includes a fluid sensing electrodes and a first temperature sensing resistor in the fluid receiving area. The test strip further includes a second temperature sensing resistor in the contact pad area. The first and second temperature sensing resistors together provide an indication of the temperature difference between the fluid sensing area and ambience.

Abstract translation: 生物流体测试条包括用于与流体感测装置接口的流体接收区域和接触焊盘区域。 测试条在流体接收区域中包括流体感测电极和第一温度感测电阻器。 测试条还包括接触焊盘区域中的第二温度感测电阻器。 第一和第二温度感测电阻器一起提供流体感测区域和环境之间的温度差的指示。

公开(公告)号：US20160197030A1

公开(公告)日：2016-07-07

申请号：US14589094

申请日：2015-01-05

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq WONG

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/32245 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/17738 ,  H01L2924/17763 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) package includes a die pad and an IC die secured on the die pad. The IC die had outer edges aligned with outer edges of the die pad. An encapsulating material body surrounds the die pad and IC die. Leads extend outwardly from the encapsulating material body and are coupled to the IC die. Each lead has an upper surface coplanar with an upper surface of the IC die. The die pad has a lower surface exposed through the encapsulating material body, and has a thickness greater than a thickness of each of the plurality of leads.

Abstract translation: 集成电路（IC）封装包括芯片焊盘和固定在裸片焊盘上的IC芯片。 IC芯片具有与芯片焊盘的外边缘对准的外边缘。 封装材料体围绕芯片焊盘和IC芯片。 引线从封装材料体向外延伸并耦合到IC管芯。 每个引线具有与IC芯片的上表面共面的上表面。 管芯焊盘具有通过封装材料体暴露的下表面，并且其厚度大于多个引线中的每一个的厚度。

公开(公告)号：US09385153B2

公开(公告)日：2016-07-05

申请号：US14740468

申请日：2015-06-16

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L27/00 ,  H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48095 ,  H01L2224/73265

Abstract: An image sensor device may include an interconnect layer having an opening extending therethrough, an image sensor IC within the opening and having an image sensing surface, and an IR filter aligned with the image sensing surface. The image sensor device may include an encapsulation material laterally surrounding the image sensor IC and filling the opening, and a flexible interconnect layer coupled to the interconnect layer opposite the image sensing surface.

Abstract translation: 图像传感器装置可以包括具有延伸穿过其中的开口的互连层，在开口内的图像传感器IC，并且具有图像感测表面，以及与图像感测表面对准的IR滤光器。 图像传感器装置可以包括横向围绕图像传感器IC并填充开口的封装材料，以及耦合到与图像感测表面相对的互连层的柔性互连层。

公开(公告)号：US20160190029A1

公开(公告)日：2016-06-30

申请号：US14585566

申请日：2014-12-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Kim-Yong GOH ,  Yiyi Ma ,  Xueren Zhang

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/367

CPC classification number: H01L23/3135 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making an electronic device may include positioning an integrated circuit (IC) die on an upper surface of a grid array substrate having connections on a lower surface thereof and coupling respective bond pads of the IC die to the grid array with bond wires. The method may also include forming a first encapsulating layer over the IC die and bond wires and positioning a heat spreader on the substrate above the first encapsulating layer after forming the first encapsulating layer. The method may further include forming a second encapsulating layer over the first encapsulating layer and embedding the heat spreader in the second encapsulating layer.

Abstract translation: 制造电子设备的方法可以包括将集成电路（IC）裸片定位在具有在其下表面上的连接的网格阵列基板的上表面上，并且将IC芯片的各个接合焊盘与接合线连接到网格阵列。 该方法还可以包括在IC芯片上方形成第一封装层，并且在形成第一封装层之后，将第一封装层上的基板上的散热器定位在第一封装层上方的基板上。 该方法还可以包括在第一封装层上形成第二封装层，并将散热器嵌入第二封装层中。

公开(公告)号：US20160133662A1

公开(公告)日：2016-05-12

申请号：US14535423

申请日：2014-11-07

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Dave Alexis DELACRUZ ,  David GANI

IPC: H01L27/146

CPC classification number: H01L27/14625 ,  G03B3/10 ,  G03B17/02 ,  G03B29/00 ,  H01L27/14618 ,  H01L27/14685

Abstract: An image sensor device may include an interconnect layer, an image sensor IC on the interconnect layer, and a barrel adjacent the interconnect layer and having first electrically conductive traces. The image sensor device may include a liquid crystal focus cell carried by the barrel and having cell layers, and second electrically conductive contacts. A pair of adjacent cell layers may have different widths. The image sensor device may include an electrically conductive adhesive body coupling at least one of the second electrically conductive contacts to a corresponding one of the first electrically conductive traces.

Abstract translation: 图像传感器装置可以包括互连层，互连层上的图像传感器IC，以及与互连层相邻并且具有第一导电迹线的镜筒。 图像传感器装置可以包括由筒体承载并具有单元层的液晶聚焦单元和第二导电触点。 一对相邻的单元层可以具有不同的宽度。 图像传感器装置可以包括将至少一个第二导电触点耦合到第一导电迹线中的对应的一个的导电粘合体。

公开(公告)号：US20160104737A1

公开(公告)日：2016-04-14

申请号：US14740468

申请日：2015-06-16

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48095 ,  H01L2224/73265

Abstract: An image sensor device may include an interconnect layer having an opening extending therethrough, an image sensor IC within the opening and having an image sensing surface, and an IR filter aligned with the image sensing surface. The image sensor device may include an encapsulation material laterally surrounding the image sensor IC and filling the opening, and a flexible interconnect layer coupled to the interconnect layer opposite the image sensing surface.

Abstract translation: 图像传感器装置可以包括具有延伸穿过其中的开口的互连层，在开口内的图像传感器IC，并且具有图像感测表面，以及与图像感测表面对准的IR滤光器。 图像传感器装置可以包括横向围绕图像传感器IC并填充开口的封装材料，以及耦合到与图像感测表面相对的互连层的柔性互连层。

公开(公告)号：US20160104656A1

公开(公告)日：2016-04-14

申请号：US14741535

申请日：2015-06-17

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/367

CPC classification number: H01L23/562 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/4882 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/18 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/3511

Abstract: An electronic device may include an integrated circuit (IC), electrically conductive connectors coupled to the IC, and a heat sink layer adjacent the IC and opposite the electrically conductive connectors. The electronic device may include an encapsulation material surrounding the IC and the electrically conductive connectors, a redistribution layer having electrically conductive traces coupled to the electrically conductive connectors, a stiffener between the heat sink layer and the redistribution layer, and a fan-out component between the heat sink layer and the redistribution layer and being in the encapsulation material.

Abstract translation: 电子设备可以包括集成电路（IC），耦合到IC的导电连接器以及与IC相邻并与导电连接器相对的散热层。 电子设备可以包括围绕IC和导电连接器的封装材料，具有耦合到导电连接器的导电迹线的再分布层，散热层和再分布层之间的加强件，以及在散热层之间的扇出部分， 散热层和再分配层，并且在封装材料中。

公开(公告)号：US20160099373A1

公开(公告)日：2016-04-07

申请号：US14968359

申请日：2015-12-14

Applicant: STMicroelectronics Pte Ltd

Inventor： Yonggang Jin ,  Wee Chin Judy Lim

IPC: H01L31/16 ,  H01L31/18 ,  H01L31/0232 ,  H01L25/16

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  G01V8/12 ,  H01L21/568 ,  H01L25/167 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167 ,  H01L31/18 ,  H01L31/186 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2924/3511 ,  H03K17/941 ,  H03K17/9631 ,  H03K17/9638 ,  H03K2217/96023 ,  Y10T156/1052 ,  Y10T156/1064

Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.

Abstract translation: 光学检测传感器用作包括光学系统和选择性透射结构的接近检测传感器。 诸如激光的电磁辐射可以通过选择性透射结构的透射部分发射。 可以检测反射光束以确定物体的存在。 传感器通过将透射结构封装在第一密封体中并将光学系统封装在第二密封体内而形成。 然后将第一和第二密封剂体接合在一起。 在晶片规模中组装由连接的密封体产生的结构被切割以形成光学检测传感器。

公开(公告)号：US09257423B2

公开(公告)日：2016-02-09

申请号：US14090673

申请日：2013-11-26

Applicant: STMicroelectronics Pte. Ltd.

Inventor： Calvin Leung ,  Olivier Le Neel

IPC: H01L27/06 ,  H01L21/768 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L21/6835 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/76895 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/20 ,  H01L27/0629 ,  H01L27/1052 ,  H01L28/60 ,  H01L29/6675 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.

Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成电子器件。 导电材料沉积在聚酰亚胺上并图案化以形成电极和信号迹线。 电子器件的剩余部分形成在聚酰亚胺上。 然后在第一聚酰亚胺层上形成第二聚酰亚胺层。 然后去除玻璃基板，暴露电极和电子设备的顶表面。

公开(公告)号：US09105766B2

公开(公告)日：2015-08-11

申请号：US13845445

申请日：2013-03-18

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics Pte Ltd

Inventor： Romain Coffy ,  Eric Saugier ,  Hk Looi ,  Norbert Chevrier

IPC: H01L33/48 ,  H01L31/0203 ,  H01L31/18 ,  G01S17/02 ,  H01L25/16 ,  H03K17/94 ,  G01S7/481 ,  H03K17/945

CPC classification number: H01L31/0203 ,  G01S7/481 ,  G01S17/026 ,  H01L25/167 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H03K17/941 ,  H03K2017/9455 ,  H03K2217/94026 ,  H03K2217/94112 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.

Abstract translation: 光学电子封装包括固定到晶片的透射芯片和接收芯片。 透明封装结构由形成在发射机芯片和接收芯片的至少一部分上的透明板和透明封装块形成，透明封装块嵌入发射器芯片。 不透明的封装块在透明板上延伸并且包括露出透明板的前部区域的开口。 前部区域位于发射芯片的光发射机之上，相对于接收芯片的光学传感器横向偏移。