公开(公告)号：US09413079B2

公开(公告)日：2016-08-09

申请号：US13799645

申请日：2013-03-13

Applicant: INTEL CORPORATION

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini

IPC: H01Q3/02 ,  H01Q21/29 ,  H01Q3/24 ,  H01Q3/26 ,  H01Q15/08 ,  H01Q21/06 ,  H01Q23/00 ,  H01Q25/00 ,  H01P11/00 ,  H01Q1/50

CPC classification number: H01Q21/293 ,  H01L2224/16225 ,  H01P11/00 ,  H01Q1/36 ,  H01Q1/50 ,  H01Q3/24 ,  H01Q3/26 ,  H01Q15/08 ,  H01Q21/061 ,  H01Q21/065 ,  H01Q23/00 ,  H01Q25/00 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: Embodiments of the present disclosure are directed to a single-package communications device that includes an antenna module with a plurality of independently selectable arrays of antenna elements. The antenna elements of the different arrays may send and/or receive data signals over different ranges of signal angles. The communications device may further include a switch module to separately activate the individual arrays. In some embodiments, a radio frequency (RF) communications module may be included in the package of the communications device. In some embodiments, the RF communications module may be configured to communicate over a millimeter-wave (mm-wave) network using the plurality of arrays of antenna elements.

Abstract translation: 本公开的实施例涉及一种单包装通信设备，其包括具有多个可独立选择的天线元件阵列的天线模块。 不同阵列的天线元件可以在不同的信号角度范围上发送和/或接收数据信号。 通信设备还可以包括用于单独地激活各个阵列的交换机模块。 在一些实施例中，射频（RF）通信模块可以包括在通信设备的包中。 在一些实施例中，RF通信模块可以被配置为使用多个天线元件阵列在毫米波（mm波）网络上进行通信。

公开(公告)号：US20160020165A1

公开(公告)日：2016-01-21

申请号：US14433369

申请日：2014-05-06

Applicant: INTEL CORPORATION

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini ,  Torrey W. Frank

IPC: H01L23/498 ,  H01L21/288 ,  H01L23/522 ,  H01L21/48 ,  G06F1/16 ,  H01L23/66

CPC classification number: H01L23/49838 ,  G06F1/1613 ,  H01L21/288 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5223 ,  H01L23/562 ,  H01L23/66 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/3511

Abstract: Embodiments of the present disclosure describe a multi-layer package with antenna and associated techniques and configurations. In one embodiment, an integrated circuit (IC) package assembly includes a first layer having a first side and a second side disposed opposite to the first side a second layer coupled with the first side of the first layer, one or more antenna elements coupled with the second layer and a third layer coupled with the second side of the first layer, wherein the first layer is a reinforcement layer having a tensile modulus that is greater than a tensile modulus of the second layer and the third layer. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例描述了具有天线和相关联的技术和配置的多层封装。 在一个实施例中，集成电路（IC）封装组件包括具有第一侧的第一层和与第一侧相对设置的第二层，第二层与第一层的第一侧耦合，一个或多个天线元件与 所述第二层和与所述第一层的第二侧耦合的第三层，其中所述第一层是具有大于所述第二层和所述第三层的拉伸模量的拉伸模量的增强层。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09166284B2

公开(公告)日：2015-10-20

申请号：US13721245

申请日：2012-12-20

Applicant: INTEL CORPORATION

Inventor： Telesphor Kamgaing ,  Valluri R. Rao ,  Ofir Degani

IPC: H01Q1/38 ,  H01P11/00 ,  H01Q1/22

CPC classification number: H01Q9/045 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01P11/00 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q21/0006 ,  Y10T29/49018

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.

Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括形成包括设置在设备的背侧的分立天线的封装结构，其中分立天线包括天线基板，通过天线基板垂直设置的通过天线基板。 垂直设置在器件内的穿通器件衬底通孔经由天线衬底与封装衬底耦合，并且封装衬底与器件的有源侧耦合。

公开(公告)号：US20250113428A1

公开(公告)日：2025-04-03

申请号：US18478967

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Eng Huat Goh ,  Tin Poay Chuah ,  Kavitha Nagarajan ,  Telesphor Kamgaing ,  Poh Boon Khoo ,  Jiun Hann Sir

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40

Abstract: Technologies for a shield for electromagnetic interference include a circuit board with an integrated circuit package on it, with a hole in the circuit board under the integrated circuit package. The integrated circuit package may include one or more dies or other components on the underside of the package, at least partially positioned in the hole in the circuit board. An electromagnetic shield box can be positioned in the hole. Tabs of the electromagnetic shield box may interface with pads on the same side of the circuit board as the integrated circuit package. The electromagnetic shield box may prevent or reduce electromagnetic or radiofrequency interference on the components of the integrated circuit package. Positioning the electromagnetic shield box can reduce the overall height of the circuit board, among other advantages.

公开(公告)号：US20250008685A1

公开(公告)日：2025-01-02

申请号：US18216049

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Nirmala Bailur ,  Min Suet Lim ,  Tongyan Zhai ,  Chee Chun Yee ,  Ruander Cardenas ,  Lance Lin ,  Eng Huat Goh ,  Javed Shaikh ,  Jun Liao ,  Kavitha Nagarajan ,  Tin Poay Chuah ,  Martin M. Chang ,  Shantanu D. Kulkarni ,  Telesphor Kamgaing

IPC: H05K7/20 ,  F04D19/00 ,  F04D29/52 ,  G06F1/20

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for cooling electronic devices. An example apparatus includes a fan module for an electronic device. The fan module includes a first cover; a second cover; an input/output (IO) board adjacent the second cover, the second cover and IO board beneath the first cover; and a fan between the first cover and the second cover, the fan to operate above the second cover and a portion of the IO board.

公开(公告)号：US20240429588A1

公开(公告)日：2024-12-26

申请号：US18824152

申请日：2024-09-04

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems. In one aspect, a microelectronic support for millimeter-wave communication includes a millimeter-wave communication transmission line, wherein the transmission line includes a trace in a metal layer, wherein the trace is electrically coupled to a via by a via pad in the metal layer; and a ground plane in the metal layer, wherein one or more metal portions contact the via pad and the ground plane.

公开(公告)号：US20240421062A1

公开(公告)日：2024-12-19

申请号：US18334188

申请日：2023-06-13

Applicant: Intel Corporation

Inventor： Tolga Acikalin ,  Shuhei Yamada ,  Telesphor Kamgaing ,  Tae Young Yang

IPC: H01L23/498 ,  H01L21/3205 ,  H01L23/00 ,  H01L23/15 ,  H01L23/49 ,  H01L23/538 ,  H01L23/544 ,  H01L25/065

Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die and a substrate including a glass core. The apparatus also includes a pluggable interconnect including a portion of the glass core. The pluggable interconnect includes a transmission line extending along the portion of the glass core.

公开(公告)号：US12166261B2

公开(公告)日：2024-12-10

申请号：US16911883

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16 ,  H01P3/12 ,  H01P5/08 ,  H01P5/107

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US20240405433A1

公开(公告)日：2024-12-05

申请号：US18328107

申请日：2023-06-02

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georg Seidemann ,  Harald Gossner ,  Thomas Wagner ,  Bernd Waidhas ,  Tae Young Yang

IPC: H01Q9/04 ,  H01Q1/22

Abstract: Disclosed herein are antenna modules, electronic assemblies, and communication devices. An example antenna module includes an IC component, an antenna patch support over a face of the IC component, and a stack of antenna patches vertically arranged at least partially above one another, where a first antenna patch of the stack is an antenna patch closest to the IC component, and a second antenna patch of the stack is an antenna patch closest to the first antenna patch. The first antenna patch is on the face of the IC component while the second and further antenna patches of the stack are on or in the antenna patch support and are electrically isolated from all electrically conductive material pathways in the antenna patch support and in the IC component.

公开(公告)号：US12155372B2

公开(公告)日：2024-11-26

申请号：US17688065

申请日：2022-03-07

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Aleksandar Aleksov ,  Feras Eid ,  Telesphor Kamgaing ,  Johanna M. Swan

IPC: H03H9/54 ,  H03H9/02 ,  H03H9/64

Abstract: Embodiments may relate to a die such as an acoustic wave resonator (AWR) die. The die may include a first filter and a second filter in the die body. The die may further include an electromagnetic interference (EMI) structure that surrounds at least one of the filters. Other embodiments may be described or claimed.