Abstract:
The conventional flash memory device is fabricated by the MOS processing technology on a bulk substrate and has a similar configuration to an MOS device.While the conventional CMOS device has a superior scaling down characteristic, the scaling down characteristic of a flash memory device is poor due to the inability to reduce the thickness below 7 nm or 8 nm for the tunneling oxide film where the charges in the channel are tunneled into the floating electrode through the tunneling oxide.In order to resolve this problem, the present invention, instead of a SOI wafer, uses a cheaper bulk silicon wafer with lower defect density. A wall shape Fin active region where the channel and the source/drain are formed is connected to the bulk silicon substrate by which floating body effect and heat conduction problem are resolved. a flash memory device is fabricated by forming a tunneling oxide film on side surfaces of the Fin active and a floating (storage) electrode where the charges could be stored.The above structure has a superior scaling down characteristic and enhanced memory performance due to a double-gate flash memory device structure.
Abstract:
There are provided a nonvolatile memory device and a method of fabricating the same. A gate region of the nonvolatile memory device is formed as a stack structure including a tunnel oxide layer, a trapping layer, a blocking layer and a control gate electrode. The trapping layer is formed of a high-k dielectric having a higher dielectric constant than that of the tunnel oxide layer. When the trapping layer is formed of high-k dielectric, an EOT in a same thickness can be reduced, and excitation of electrons of the control gate electrode to the tunnel oxide layer due to a high potential barrier relative to the tunnel oxide layer is prevented so that program and erase voltages can be further reduced. As such, a problem that the tunnel oxide layer is damaged due to the conventional high program and erase voltages can be solved by reducing the program and erase voltages, and program and erase speeds of the transistor can be further improved.
Abstract:
Integrated circuit devices include a semiconductor substrate having a first doped region and a second doped region having a different doping type than the first doped region. A gate electrode structure on the semiconductor substrate extends between the first and second doped regions and has a gate insulation layer of a first high dielectric constant material in the first doped region and of a second high dielectric constant material, different from the first high dielectric constant material, in the second doped region. A gate electrode is on the gate insulation layer.
Abstract:
A thermistor of which resistance is changed depending on temperature and a secondary battery to which the thermistor is attached are disclosed. The thermistor is attached to an object via a lead which is made of different kinds of materials. The lead is configured so that a part of the lead to be united to the thermistor electrode is mainly made of the same material as the electrode and a part of the lead to be united to the object is mainly made of the same material as the surface of the object. Thus, the thermistor may be simply attached to the object only using the ultrasonic welding, thereby remarkably reducing junction inferiorities.
Abstract:
The present invention relates to a dermal substitute comprising the biodegradable polymer such as collagen and the biomaterial such as amnion, the preparation method and the use thereof. Specifically, the present invention provides with an amnion-collagen sponge complex structure prepared by attaching, inserting or incorporating an amnion obtained from placenta to/in collagen. Inventive dermal substitute can be applied to surgery and wound requiring skin graft, for example, severe burns such as second-degree burn, without rejection by immune system. Further, inventive dermal substitute with amnion instead of silicone membrane has several advantages, such as better biocompatibility, anti-inflammatory activity and promoting activity of wound healing and commercial utilization as basement membrane. Also, inventive complex structure can be used as the basic matrix of bio-artificial skin for culturing cells and the biodegradable basic matrix for preparing artificial organs.
Abstract:
A torsion spring is equipped to provide a resilient force toward an opposite direction of a manipulation force of a driver's pedal and an MR damper is equipped to promptly actively attenuate the resilient force of the torsion spring and the manipulation force of the driver's pedal. Thereby, contributing to a wide control range of the reaction force of the pedal, an effective response, and a proper formation of hysteresis of the reaction force of the pedal.
Abstract:
High dielectric layers formed from layers of hafnium oxide, zirconium oxide, aluminum oxide, yttrium oxide, and/or other metal oxides and silicates disposed on silicon substrates or ozone oxide layers over silicon substrates may be nitrided and post thermally treated by oxidation, annealing, or a combination of oxidation and annealing to form high dielectric layers having superior mobility and interfacial characteristics.
Abstract:
The present invention provides a flash memory element and its manufacturing method having improved overall memory characteristics by constituting a double-gate element for improving the scaling down characteristic of flash memory element. With the above double-gate flash memory structure, a flash memory element in the present invention improves the scaling down characteristic and the programming and retention characteristic of a flash memory element.
Abstract:
A semiconductor device and method of fabricating the same. The semiconductor device includes a first insulating film formed on a substrate and having a plurality of holes therein; a cavity formed under the first insulating film; an impurity region formed in the substrate and around the cavity; a second insulating film formed on portions of the first insulating film to fill the holes and a space between the cavity and the impurity region; a plurality of contact holes formed to expose certain portions of the impurity region; and a plurality of wiring layers formed to be in contact with the impurity region through the contact holes.
Abstract:
A semiconductor device and method of fabricating the same. The semiconductor device includes a first insulating film formed on a substrate and having a plurality of holes therein; a cavity formed under the first insulating film; an impurity region formed in the substrate and around the cavity; a second insulating film formed on portions of the first insulating film to fill the holes and a space between the cavity and the impurity region; a plurality of contact holes formed to expose certain portions of the impurity region; and a plurality of wiring layers formed to be in contact with the impurity region through the contact holes.