公开(公告)号：US20220208565A1

公开(公告)日：2022-06-30

申请号：US17520826

申请日：2021-11-08

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Do Hyeon YOON ,  Yong Hee LEE

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

公开(公告)号：US20220208564A1

公开(公告)日：2022-06-30

申请号：US17563189

申请日：2021-12-28

Applicant: SEMES CO., LTD.

Inventor： EUI SANG LIM ,  YONG HEE LEE

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/02

Abstract: A substrate treating device includes a liquid treating chamber for liquid-treating a substrate therein, a drying chamber for dry-treating the liquid-treated substrate, a transfer device for transferring the substrate between the liquid treating chamber and the drying chamber, and a controller for controlling the liquid treating chamber and the transfer device. The transfer device includes a transfer robot having a hand for placing the substrate thereon, and a heating member for heating the substrate. The controller controls the transfer device such that the heating member of the transfer device heats a liquid on the substrate to a first temperature before the transfer device transfers the substrate taken out from the liquid treating chamber to the drying chamber.

公开(公告)号：US20220208561A1

公开(公告)日：2022-06-30

申请号：US17377666

申请日：2021-07-16

Applicant: Semes Co., Ltd.

Inventor： Yonghee LEE ,  Sangmin LEE ,  Euisang LIM ,  Dohyeon YOON

IPC: H01L21/67

Abstract: An apparatus for processing a substrate may include a process chamber providing a processing space in which a predetermined process may be performed on the substrate, and a supporting device contacting the process chamber and supporting the process chamber. The supporting device may include a supporting chamber providing a supporting space for supporting components of the process chamber and a supply member supplying a fluid into the supporting space.

公开(公告)号：US20220199434A1

公开(公告)日：2022-06-23

申请号：US17553868

申请日：2021-12-17

Applicant: SEMES CO., LTD.

Inventor： OH JIN KWON

IPC: H01L21/67 ,  H05B45/52 ,  H05B45/14 ,  H05B45/12

Abstract: The inventive concept provides a light treating member for performing a light treatment on a substrate. The light treating member comprises a circuit unit comprising a plurality of LED module units connected in series, each LED module unit comprising a plurality of identical LED modules connected with each other in parallel.

公开(公告)号：US20220197318A1

公开(公告)日：2022-06-23

申请号：US17554625

申请日：2021-12-17

Applicant: SEMES CO., LTD.

Inventor： Sang Bo SEO ,  Soo Hyang KANG ,  Young Chul SHIN ,  Chung Woo LEE

IPC: G05D23/19 ,  G05D23/24 ,  H05B3/26 ,  H05B1/02 ,  G01K7/16

Abstract: A temperature adjustment apparatus configured to perform temperature adjustment and control for each fine zone of a substrate, a multi-zone temperature adjustment apparatus including the same, and a multi-zone temperature adjustment type substrate supporting apparatus are proposed. The temperature adjustment apparatus includes a first power source, a second power source, an ammeter connected to the second power source in series and configured to measure a current value of the second power source, a heater inducing a first direction current to dissipate heat energy while being connected to the first power source in series during a heating time period, a temperature sensor inducing a second direction current while being connected to the second power source in series during a sensing time period, and a switch controller controlling connection between the first power source and the heater and connection between the second power source and the temperature sensor.

公开(公告)号：US11367635B2

公开(公告)日：2022-06-21

申请号：US16133043

申请日：2018-09-17

Applicant: SEMES CO., LTD.

Inventor： Sangmin Lee ,  Woo Young Kim ,  Joo Jib Park ,  Boong Kim

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/673 ,  H01L21/02

Abstract: Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.

公开(公告)号：US20220186379A1

公开(公告)日：2022-06-16

申请号：US17503741

申请日：2021-10-18

Applicant: SEMES CO., LTD.

Inventor： Jin Mo JAE ,  Seung Hoon OH ,  Young Seop CHOI ,  Mi So PARK ,  Jong Hyeon WOO

IPC: C23C18/16

Abstract: An apparatus for treating a substrate includes a vessel having a sealable process space formed therein in which the substrate is accommodated, a supply port that is provided inside a wall of the vessel and that supplies a process fluid into the process space, an exhaust port provided inside the wall of the vessel and spaced apart from the supply port, and a buffer member provided in the process space, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above. The buffer member includes a sidewall portion that is located outward of the supply port and the exhaust port and that makes contact with the wall of the vessel and an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, the through-hole forming a straight flow path in an up/down direction.

公开(公告)号：US20220174786A1

公开(公告)日：2022-06-02

申请号：US17531798

申请日：2021-11-21

Applicant: SEMES CO., LTD.

Inventor： Soon Hyun KIM ,  Byung Geun KIM ,  Byoung Chan LEE

IPC: H05B1/02 ,  F28D21/00 ,  H05B3/06 ,  H01L21/67

Abstract: A heater assembly includes a housing having an accommodation space therein and having a cooling gas inlet communicating with the accommodation space, a heater coupled to the housing, and a porous block disposed in the accommodation space.

公开(公告)号：US20220172966A1

公开(公告)日：2022-06-02

申请号：US17539070

申请日：2021-11-30

Applicant: SEMES CO., LTD.

Inventor： JUN YOUNG CHOI ,  KYU HWAN CHANG

IPC: H01L21/67 ,  B08B7/00

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus comprises a first treating part performing, a liquid treatment on a plurality of substrates in a batch-type treating, method and a second treating part treating the substrates which have been treated at the first treating part, and performing, the liquid treatment or a drying treatment on a single substrate a single-type treating method.

公开(公告)号：US20220167462A1

公开(公告)日：2022-05-26

申请号：US17534329

申请日：2021-11-23

Applicant: SEMES CO., LTD.

Inventor： CHUNG WOO LEE ,  IN KYU PARK ,  YONG SEOK JANG ,  SUNG YOUN JEON

IPC: H05B1/02 ,  H01J37/32

Abstract: A support unit may include a plurality of heaters disposed in a matrix form in the support unit to heat a substrate, and a power supply unit for supplying power to the plurality of heaters, wherein a current applied to the plurality of heaters is controlled by switches connected to rows and columns of the matrix, respectively, and the switches connected to the rows of the matrix include first switches capable of controlling the current applied to the rows of the matrix and second switches connected in parallel with the first switches.