公开(公告)号：US09091924B2

公开(公告)日：2015-07-28

申请号：US13625210

申请日：2012-09-24

Applicant: STMicroelectronics Pte Ltd.

Inventor： Gino George ,  KeenYip Koh ,  CheeChiang Lee ,  Ditto Adnan

IPC: G01F7/00 ,  G03F7/16 ,  H01L21/67

CPC classification number: G03F7/16 ,  H01L21/6715

Abstract: A photoresist delivery system includes a photoresist pump, a photoresist reservoir coupled to the photoresist pump, and a photoresist container. A control valve is between the photoresist reservoir and the photoresist container and is movable from a closed position to an open position upon engagement of the photoresist container with the photoresist reservoir to replenish photoresist therein.

Abstract translation: 光致抗蚀剂传输系统包括光致抗蚀剂泵，耦合到光致抗蚀剂泵的光致抗蚀剂储存器和光致抗蚀剂容器。 控制阀位于光致抗蚀剂储存器和光致抗蚀剂容器之间，并且在光致抗蚀剂容器与光致抗蚀剂储存器接合时能够从关闭位置移动到打开位置，以补充其中的光致抗蚀剂。

公开(公告)号：US20150140479A1

公开(公告)日：2015-05-21

申请号：US14084773

申请日：2013-11-20

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Alan Lee ,  Xi Ge

IPC: G03F1/00 ,  G03F1/42 ,  G03F7/20

CPC classification number: G03F1/00 ,  G03F1/42 ,  G03F1/50 ,  G03F7/70283 ,  G03F7/70425

Abstract: A method of processing a semiconductor wafer may include providing a rotatably alignable photolithography mask that includes different mask images. Each mask image may be in a corresponding different mask sector. The method may also include performing a series of exposures with the rotatably alignable photolithography mask at different rotational alignments with respect to the semiconductor wafer so that the different mask images produce at least one working semiconductor wafer sector, and at least one non-working semiconductor wafer sector.

Abstract translation: 一种处理半导体晶片的方法可以包括提供包括不同掩模图像的可旋转对准的光刻掩模。 每个掩模图像可以在相应的不同的掩模扇区中。 该方法还可以包括使用相对于半导体晶片的不同旋转对准的可旋转对准的光刻掩模执行一系列曝光，使得不同的掩模图像产生至少一个工作半导体晶片扇区，以及至少一个非工作半导体晶片 部门。

公开(公告)号：US20150103297A1

公开(公告)日：2015-04-16

申请号：US14050522

申请日：2013-10-10

Applicant: STMICROELECTRONICS PTE. LTD

Inventor： WeeChinJudy LIM ,  David Gani ,  Hk Looi ,  Bs Aw ,  Cheng-hai Cheh

IPC: G02F1/29 ,  B23K31/02 ,  B32B37/24 ,  B23K1/00

CPC classification number: G02F1/29 ,  B23K1/0016 ,  B23K2101/38 ,  G02F2001/294 ,  G02F2202/28 ,  Y10T156/10

Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.

Abstract translation: 光学组件可以包括衬底，由衬底承载的壳体，并且在其上表面中具有至少一个粘合剂容纳凹部，以及由壳体承载的透镜。 光学组件还可以包括与透镜相邻的液晶聚焦单元，并且包括与其相关联的单元层和导电触点对。 所述光学组件还可以包括至少一个导电构件，在所述至少一个粘合剂容纳凹部内并且将每对所述导电触点连接在一起，并且所述至少一个粘合剂容纳凹部中的粘合体覆盖所述至少一个 导电部件。

公开(公告)号：US20150069607A1

公开(公告)日：2015-03-12

申请号：US14548090

申请日：2014-11-19

Applicant: STMicroelectronics Pte Ltd

Inventor： How Yuan Hwang ,  Kah Wee Gan

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48

CPC classification number: H01L24/14 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/023 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.

Abstract translation: 集成电路封装包括在复原衬底中的集成电路管芯。 然后将活性侧加工成模塑料，同时处理非活性侧。 然后部分地去除活性侧上的模塑料，并且在活性侧上放置焊球。

公开(公告)号：US20150060891A1

公开(公告)日：2015-03-05

申请号：US14013507

申请日：2013-08-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Yonggang Jin

IPC: H01L31/173 ,  H01L23/00

CPC classification number: H01L31/173 ,  H01L21/568 ,  H01L24/14 ,  H01L24/19 ,  H01L24/20 ,  H01L24/81 ,  H01L24/96 ,  H01L27/14678 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00

Abstract: An electronics assembly includes a semiconductor die assembly, an enclosure affixed to the semiconductor die assembly, the enclosure defining first and second chambers over the semiconductor die assembly, and first and second optical elements mounted in the first and second chambers, respectively. The semiconductor die assembly includes a semiconductor die encapsulated in a molded material, an encapsulation layer located on the top surface of the semiconductor die, and at least one patterned metal layer and at least one dielectric layer over the encapsulation layer. Conductive pillars extend through the encapsulation layer for electrical connection to the semiconductor die. The encapsulation layer blocks optical crosstalk between the first and second chambers. A method is provided for making the electronics assembly.

Abstract translation: 电子组件包括半导体管芯组件，固定到半导体管芯组件的外壳，在半导体管芯组件上限定第一和第二腔室的外壳，以及安装在第一和第二腔室中的第一和第二光学元件。 半导体管芯组件包括封装在模制材料中的半导体管芯，位于半导体管芯的顶表面上的封装层，以及至少一个图案化金属层和封装层上的至少一个介电层。 导电柱延伸穿过封装层，以与半导体管芯电连接。 封装层阻止第一和第二腔室之间的光学串扰。 提供了一种用于制造电子组件的方法。

公开(公告)号：US08937774B2

公开(公告)日：2015-01-20

申请号：US13657542

申请日：2012-10-22

Applicant: STMicroelectronics Pte Ltd.

Inventor： Laurent Herard

IPC: G02B9/00

CPC classification number: B29D11/00298 ,  G02B3/0031 ,  G02B3/0068 ,  G02B3/0075 ,  Y10T29/4998

Abstract: A method comprises depositing an optical filter layer on a glass wafer, then cutting the wafer into dice. The dice are positioned on a carrier and encapsulated in a molding compound to form a reconstituted wafer, and the wafer is back-ground and polished. Lens faces are positioned on opposing surfaces of the glass dice and spacers are positioned on one side of the wafer. The wafer is then cut into lens modules, each having two side-by-side lenses with an opaque molding compound barrier between. The individual modules are attached to devices that require dual lenses, such as, e.g., proximity sensors that use a light source and a light receiver or detector.

Abstract translation: 一种方法包括在玻璃晶片上沉积光学过滤层，然后将晶片切割成骰子。 将骰子定位在载体上并封装在模制化合物中以形成重构的晶片，并且将晶片进行背面和抛光。 透镜面定位在玻璃骰子的相对表面上，并且间隔物位于晶片的一侧。 然后将晶片切成透镜模块，每个透镜模块具有两个并排的透镜，其间具有不透明的模制化合物屏障。 各个模块附接到需要双透镜的装置，例如使用光源和光接收器或检测器的接近传感器。

公开(公告)号：US20150001659A1

公开(公告)日：2015-01-01

申请号：US13929610

申请日：2013-06-27

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Tien Choy Loh

IPC: H01L27/146

CPC classification number: H01L27/14629 ,  H01L27/14634 ,  H01L27/1467 ,  H01L27/14685 ,  H01L27/1469 ,  H01L2924/1461

Abstract: The present disclosure is directed to an infrared sensor that includes a plurality of pairs of support structures positioned on the substrate, each pair including a first support structure adjacent to a second support structure. The sensor includes plurality of pixels, where each pixel is associated with one of the pairs of support structures. Each pixel includes a first infrared reflector layer on the substrate between the first and the second support structures, a membrane formed on the first and second support structures, a thermally conductive resistive layer on the membrane and positioned above the first infrared reflector layer, a second infrared reflector layer on the resistive layer, and an infrared absorption layer on the second infrared reflector layer.

Abstract translation: 本公开涉及一种红外传感器，其包括定位在基板上的多对支撑结构，每对包括邻近第二支撑结构的第一支撑结构。 传感器包括多个像素，其中每个像素与一对支撑结构中的一个相关联。 每个像素包括在第一和第二支撑结构之间的衬底上的第一红外反射器层，形成在第一和第二支撑结构上的膜，膜上的导热电阻层并且位于第一红外反射层之上，第二 电阻层上的红外线反射层，以及第二红外线反射层上的红外线吸收层。

公开(公告)号：US08907465B2

公开(公告)日：2014-12-09

申请号：US13853645

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Kim-Yong Goh ,  Yiyi Ma ,  Wei Zhen Goh

IPC: H01L23/02 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81B7/0058 ,  B81C2203/0109 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/00014

Abstract: Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package.

Abstract translation: 集成电路封装的方法和装置。 封装的装置可以包括集成电路，包括图案化表面的第一包装部件和第二包装部件。 第一包装部件的图案化表面可以粘合地耦合到第二包装部件的表面或集成电路的表面。 集成电路可以至少部分地封装在第一和第二封装部件之间。 包装方法可以包括图案化集成电路封装的封装部件的表面。 包装部件的表面可以用于粘合地耦合到第二部件以至少部分地封装集成电路封装中的集成电路。

公开(公告)号：US20140353788A1

公开(公告)日：2014-12-04

申请号：US13907280

申请日：2013-05-31

Applicant: STMicroelectronics R&D Limited ,  STMicroelectronics Pte Ltd.

Inventor： Yonggang Jin ,  David Lawson ,  Colin Campbell ,  Anandan Ramasamy

IPC: H01L31/0216

CPC classification number: H01L31/02165 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02327 ,  H01L31/1013 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.

Abstract translation: 本公开的实施例涉及具有封装主体的光学封装，该封装主体在透明材料的至少一个表面上包括防光涂层。 防光涂层包括一个或多个开口，以允许光被传输到封装主体内的光学装置。 在一个实施例中，光保护涂层和开口允许基本上垂直的辐射被引导到封装主体内的光学装置。 在一个示例性实施例中，防光涂层位于透明材料的外表面上。 在另一个实施例中，防光涂层位于包装体内部的透明材料的内表面上。

公开(公告)号：US08885390B2

公开(公告)日：2014-11-11

申请号：US14150676

申请日：2014-01-08

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel

IPC: G11C11/00 ,  G11C11/56 ,  G11C13/00 ,  G11C11/21

CPC classification number: G11C13/0002 ,  G11C11/21 ,  G11C11/56 ,  G11C11/5678 ,  G11C13/0007 ,  G11C13/004 ,  G11C13/0061 ,  G11C13/0069 ,  G11C2013/008 ,  G11C2213/33 ,  G11C2213/71

Abstract: An integrated circuit is formed having an array of memory cells located in the dielectric stack above a semiconductor substrate. Each memory cell has two adjustable resistors and two heating elements. A dielectric material separates the heating elements from the adjustable resistors. One heating element alters the resistance of one of the resistors by applying heat thereto to write data to the memory cell. The other heating element alters the resistance of the other resistor by applying heat thereto to erase data from the memory cell.