公开(公告)号：USD667049S1

公开(公告)日：2012-09-11

申请号：US29400186

申请日：2011-08-24

Applicant: Jang Soon Park ,  Bum Jin Lee ,  Chang Rae Seong

Designer： Jang Soon Park ,  Bum Jin Lee ,  Chang Rae Seong

公开(公告)号：US08262928B2

公开(公告)日：2012-09-11

申请号：US12777532

申请日：2010-05-11

Applicant: Bong-Kyun Kim ,  Jong-Hyun Choung ,  Byeong-Jin Lee ,  Sun-Young Hong ,  Hong-Sick Park ,  Shi-Yul Kim ,  Ki-Beom Lee ,  Sam-Young Cho ,  Sang-Woo Kim ,  Hyun-Cheol Shin ,  Won-Guk Seo

Inventor： Bong-Kyun Kim ,  Jong-Hyun Choung ,  Byeong-Jin Lee ,  Sun-Young Hong ,  Hong-Sick Park ,  Shi-Yul Kim ,  Ki-Beom Lee ,  Sam-Young Cho ,  Sang-Woo Kim ,  Hyun-Cheol Shin ,  Won-Guk Seo

IPC: H01L33/44 ,  C09K13/08

CPC classification number: C23F1/26 ,  C23F1/18 ,  H01L21/32134 ,  H01L27/124 ,  H01L29/458

Abstract: An etchant includes about 0.1 percent by weight to about 30 percent by weight of ammonium persulfate (NH4)2S2O8, about 0.1 percent by weight to about 10 percent by weight of an inorganic acid, about 0.1 percent by weight to about 10 percent by weight of an acetate salt, about 0.01 percent by weight to about 5 percent by weight of a fluorine-containing compound, about 0.01 percent by weight to about 5 percent by weight of a sulfonic acid compound, about 0.01 percent by weight to about 2 percent by weight of an azole compound, and a remainder of water. Accordingly, the etchant may have high stability to maintain etching ability. Thus, manufacturing margins may be improved so that manufacturing costs may be reduced.

Abstract translation: 蚀刻剂包括约0.1重量％至约30重量％的过硫酸铵（NH 4）2 S 2 O 8，约0.1重量％至约10重量％的无机酸，约0.1重量％至约10重量％的 约0.01重量％至约5重量％的含氟化合物的乙酸盐，约0.01重量％至约5重量％的磺酸化合物，约0.01重量％至约2重量％ 的唑类化合物，剩余的水。 因此，蚀刻剂可能具有高稳定性以保持蚀刻能力。 因此，可以提高制造裕度，从而可以降低制造成本。

公开(公告)号：US20120224437A1

公开(公告)日：2012-09-06

申请号：US13470617

申请日：2012-05-14

Applicant: Hye-Jin Kim ,  Kwang-Jin Lee ,  Du-Eung Kim ,  Hung-Jun An

Inventor： Hye-Jin Kim ,  Kwang-Jin Lee ,  Du-Eung Kim ,  Hung-Jun An

IPC: G11C5/14

CPC classification number: G11C5/14 ,  G11C7/1078 ,  G11C7/1096 ,  G11C8/10 ,  G11C11/22 ,  G11C13/00 ,  G11C13/0004 ,  G11C13/0007 ,  G11C13/0023 ,  G11C13/0038 ,  G11C13/0069 ,  G11C2013/0088 ,  G11C2013/009 ,  G11C2213/72

Abstract: A non-volatile memory device using a variable resistive element is provided. The non-volatile memory device includes a memory cell array having a plurality of non-volatile memory cells, a first voltage generator configured to generate a first voltage, a voltage pad configured to receive an external voltage that has a level higher than the first voltage, a write driver configured to be supplied with the external voltage and configured to write data to the plurality of non-volatile memory cells selected from the memory cell array; a sense amplifier configured to be supplied with the external voltage and configured to read data from the plurality of non-volatile memory cells selected from the memory cell array, and a row decoder and a column decoder configured to select the plurality of non-volatile memory cells included in the memory cell array, the row decoder being supplied with the first voltage and the column decoder being supplied with the external voltage.

Abstract translation: 提供了使用可变电阻元件的非易失性存储器件。 非易失性存储器件包括具有多个非易失性存储器单元的存储单元阵列，被配置为产生第一电压的第一电压发生器，被配置为接收具有高于第一电压的电平的外部电压的电压焊盘 写入驱动器，被配置为被提供有所述外部电压并被配置为向从所述存储单元阵列中选择的所述多个非易失性存储器单元写入数据; 感测放大器，被配置为被提供有外部电压并且被配置为从从存储单元阵列中选择的多个非易失性存储器单元读取数据;行解码器和列解码器，被配置为选择多个非易失性存储器 包括在存储单元阵列中的单元，行解码器被提供有第一电压，并且列解码器被提供有外部电压。

公开(公告)号：US20120217554A1

公开(公告)日：2012-08-30

申请号：US13341304

申请日：2011-12-30

Applicant: Hyun Jin LEE

Inventor： Hyun Jin LEE

IPC: H01L29/772 ,  H01L21/336

CPC classification number: H01L29/66795 ,  H01L29/785 ,  H01L29/7853

Abstract: A semiconductor device and a method for fabricating the same are provided which can increase the effective channel area and maintain a transistor characteristic. Since the semiconductor device comprises a recess filled with a gate spacer, a gate threshold voltage can be maintained even though the ion-implanting concentration of the active region is not uniform. The semiconductor device comprises: a device isolation film that defines an active region formed over a semiconductor substrate; a line-type recess with a given depth formed to be extended along a first direction to intersect at the active region; and a gate formed to be extended along a second direction to intersect at the active region, wherein a spacer including a high K material is disposed at sidewalls.

Abstract translation: 提供一种半导体器件及其制造方法，其可以增加有效沟道面积并保持晶体管特性。 由于半导体器件包括填充有栅极间隔物的凹部，所以即使有源区域的离子注入浓度不均匀，也可以维持栅极阈值电压。 半导体器件包括：器件隔离膜，其限定形成在半导体衬底上的有源区; 具有给定深度的线状凹部形成为沿着第一方向延伸以在有源区域相交; 以及形成为沿着第二方向延伸以在有源区域相交的栅极，其中包括高K材料的间隔物设置在侧壁处。

公开(公告)号：US08253582B2

公开(公告)日：2012-08-28

申请号：US12568022

申请日：2009-09-28

Applicant: In Haeng Cho ,  Phal Jin Lee ,  Hoi Jin Jeong ,  Jong Hye Han

Inventor： In Haeng Cho ,  Phal Jin Lee ,  Hoi Jin Jeong ,  Jong Hye Han

IPC: G08B21/00

CPC classification number: D06F39/005 ,  H04R1/028

Abstract: A home appliance and home appliance system are provided. The home appliance may include an input device, through which an input signal is received from a user, and a control panel, into which the input device is inserted and connected, including a sound through-hole through which sound information passes. The home appliance may further include a sound output device disposed on a rear surface of the control panel that outputs the sound information corresponding to product information of the home appliance through the sound through-hole to outside of the home appliance. A gap may be formed between the input device and the sound through-hole into which the input device is inserted. Therefore, the sound information output from the sound output device may be transmitted to the outside through the gap. The home appliance may further include a sound guide, such that the sound information transmitted from the sound output device may be efficiently transmitted to the sound through-hole.

Abstract translation: 提供家电和家电系统。 家用电器可以包括从用户接收输入信号的输入装置和输入装置插入并连接到的控制面板，包括声音信息通过的声通孔。 家用电器还可以包括设置在控制面板的后表面上的声音输出装置，其通过声音通孔将与家用电器的产品信息相对应的声音信息输出到家用电器的外部。 可以在输入装置和插入输入装置的声音通孔之间形成间隙。 因此，从声音输出装置输出的声音信息可以通过间隙传送到外部。 家用电器还可以包括声音引导件，使得从声音输出设备发送的声音信息可以被有效地传输到声音通孔。

公开(公告)号：US20120211780A1

公开(公告)日：2012-08-23

申请号：US13404924

申请日：2012-02-24

Applicant: Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

Inventor： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

IPC: H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/504 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2924/00014

Abstract: An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.

Abstract translation: 根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。

公开(公告)号：US20120205250A1

公开(公告)日：2012-08-16

申请号：US13083262

申请日：2011-04-08

Applicant: Hee Jin Lee ,  Dong Hyun Cho ,  Ji Eun Jeon

Inventor： Hee Jin Lee ,  Dong Hyun Cho ,  Ji Eun Jeon

IPC: C25D3/38

CPC classification number: C25D3/38

Abstract: Disclosed is an electrolytic copper plating solution composition, which includes a copper salt, an acidic solution, and a PEG-PPG-PEG copolymer, and in which the PEG-PPG-PEG copolymer which is a non-ionic surfactant is added, thus decreasing the surface tension of the electrolytic copper plating solution, thereby enhancing plating wettability.

Abstract translation: 公开了一种电解铜电镀液组合物，其包含铜盐，酸性溶液和PEG-PPG-PEG共聚物，其中加入作为非离子表面活性剂的PEG-PPG-PEG共聚物，因此减少 电解铜电镀液的表面张力，从而提高电镀润湿性。

公开(公告)号：US20120200591A1

公开(公告)日：2012-08-09

申请号：US13266047

申请日：2011-05-26

Applicant: Seung Yong Lee ,  Yun Jin Lee ,  Min Jung Son

Inventor： Seung Yong Lee ,  Yun Jin Lee ,  Min Jung Son

IPC: G06T11/20

CPC classification number: G06T11/001 ,  G06T11/20

Abstract: Provided are a method of generating a resulting image as if drawn by an artist and an apparatus for executing the method. The apparatus includes a first generation unit configured to generate a vector field expressing a shape of an image using feature pixels of the image captured by an image device and direction information of the feature pixels, a second generation unit configured to generate a structure grid indicating a structure for rendering the shape of the image using the vector field, and a rendering unit configured to render primitives expressing predetermined tones on the generated structure grid. Accordingly, it is possible to automatically and rapidly generate a resulting image from one image. Anyone can easily generate a hedcut from one photo without the limitation that a limited number of artists need to invest a great deal of time to complete one hedcut.

Abstract translation: 提供了如何由艺术家和用于执行该方法的装置绘制的产生的图像的方法。 该装置包括：第一生成单元，被配置为使用由图像设备捕获的图像的特征像素和特征像素的方向信息来生成表示图像的形状的矢量场;第二生成单元，被配置为生成表示 用于使用矢量场渲染图像的形状的结构，以及渲染单元，被配置为在生成的结构网格上渲染表示预定色调的图元。 因此，可以从一个图像自动且快速地生成结果图像。 任何人都可以轻松地从一张照片中产生一个hedcut，而不限于数量有限的艺术家需要投入大量时间来完成一个hedcut。

公开(公告)号：US08233398B2

公开(公告)日：2012-07-31

申请号：US11970798

申请日：2008-01-08

Applicant: Chang-Yoon Oh ,  Hyun-Jeong Kang ,  Jae-Weon Cho ,  Hyoung-Kyu Lim ,  Sung-Jin Lee ,  Young-Bin Chang ,  Yeong-Moon Son ,  Taori Rakesh

Inventor： Chang-Yoon Oh ,  Hyun-Jeong Kang ,  Jae-Weon Cho ,  Hyoung-Kyu Lim ,  Sung-Jin Lee ,  Young-Bin Chang ,  Yeong-Moon Son ,  Taori Rakesh

IPC: G01R31/08

CPC classification number: H04B7/2606 ,  H04B7/155

Abstract: Provided is an apparatus and method for transmitting frame information in a wireless communication system using a relay scheme. In a method for transmitting frame information from an upper node in the wireless communication system, downlink section information for communication with the lower relay station for a relay service is transmitted to a lower relay station at the request of the lower relay station for an initial connection. After the initial connection, frame information for communication with the lower relay station for a relay service is transmitted to the lower relay station through the downlink section.

Abstract translation: 提供了一种在使用中继方案的无线通信系统中发送帧信息的装置和方法。 在用于从无线通信系统中的上层节点发送帧信息的方法中，用于与用于中继服务的下级中继站进行通信的下行链路部分信息在低级中继站的请求下被发送到下级中继站用于初始连接 。 在初始连接之后，通过下行链路部分将用于与中继服务的下级中继站进行通信的帧信息发送到下级中继站。

公开(公告)号：US08232644B2

公开(公告)日：2012-07-31

申请号：US13346191

申请日：2012-01-09

Applicant: Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

Inventor： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/274 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01079 ,  H01L2924/01087

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract translation: 在具有应力消除间隔物的半导体器件封装及其制造方法中，从芯片本体延伸的金属互连指状物提供芯片互连。 金属手指通过应力消除间隔物与芯片的主体隔离。 在一个示例中，这种隔离采取气隙的形式。 在另一个实例中，这种隔离采用弹性体材料的形式。 在这两种情况下，都避免了金属互连指和芯体之间的热膨胀系数的不匹配，从而减轻了与开裂和分层相关的问题，从而提高了器件的产量和器件的可靠性。