公开(公告)号：US4377316A

公开(公告)日：1983-03-22

申请号：US238873

申请日：1981-02-27

Applicant: Mario E. Ecker ,  Leonard T. Olson

Inventor： Mario E. Ecker ,  Leonard T. Olson

IPC: H01L23/32 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H01L23/52 ,  H01L23/538 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K1/18

CPC classification number: H05K3/303 ,  H01L21/486 ,  H01L23/4985 ,  H01L23/5384 ,  H05K3/363 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/16152 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/141 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10659 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10727 ,  H05K2201/10878 ,  H05K2201/2036 ,  H05K2203/043 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3457 ,  Y02P70/613

Abstract: A system for connecting a semiconductor chip carrier to a printed circuit card is described. The semiconductor chip carrier has a flexible, extendable wiring membrane attached to the bottom thereof which extends beyond the periphery of the semiconductor chip carrier and in the area beyond the periphery is provided with electrical contacts. The electrical contacts are mated to complementary contacts in a printed circuit card which is biased from the semiconductor chip carrier by electrical and thermal contact means. The membrane, inter alia, provides high density electrical contact between the semiconductor and printed circuit card. Various elements thereof and a process for forming the same are described.

Abstract translation: 描述了用于将半导体芯片载体连接到印刷电路卡的系统。 半导体芯片载体具有附接到其底部的柔性的可延伸的布线膜，其延伸超出半导体芯片载体的周边，并且在超过外围的区域中设置有电触点。 电触点与印刷电路卡中的互补触点配合，印刷电路卡通过电接触和热接触装置从半导体芯片载体偏置。 该膜尤其在半导体和印刷电路卡之间提供了高密度的电接触。 对其各种要素及其形成方法进行说明。

公开(公告)号：US3509268A

公开(公告)日：1970-04-28

申请号：US3509268D

申请日：1967-04-10

Applicant: SPERRY RAND CORP

Inventor： SCHWARTZ LEON ,  FRADETTE REAL J

IPC: H01R12/51 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46 ,  H05K3/36 ,  H05K1/14

CPC classification number: H01R12/523 ,  H05K3/308 ,  H05K3/4046 ,  H05K3/4623 ,  H05K2201/044 ,  H05K2201/096 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2201/10878

公开(公告)号：US3059152A

公开(公告)日：1962-10-16

申请号：US79225259

申请日：1959-02-05

Applicant: GLOBE UNION INC

Inventor： KHOURI ALFRED S

IPC: H01R12/00 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/10696 ,  H05K2201/10803 ,  H05K2201/10818 ,  H05K2201/10871 ,  H05K2201/10878 ,  Y10T29/49945

公开(公告)号：US3056939A

公开(公告)日：1962-10-02

申请号：US4532360

申请日：1960-07-26

Applicant: ILLINOIS TOOL WORKS

Inventor： RAYBURN CHARLES C

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10871 ,  H05K2201/10878

公开(公告)号：US3001104A

公开(公告)日：1961-09-19

申请号：US59602156

申请日：1956-07-05

Applicant: PHILCO CORP

Inventor： BROWN JR REYNOLDS D

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2203/1446

公开(公告)号：US2903516A

公开(公告)日：1959-09-08

申请号：US63388057

申请日：1957-01-14

Applicant: MOTOROLA INC

Inventor： BIEDERMANN WILLIAM C ,  GUTSCHICK LESTER C

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10083 ,  H05K2201/10787 ,  H05K2201/10863 ,  H05K2201/10878