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231.发明授权
公开(公告)号：US5409399A
公开(公告)日：1995-04-25
申请号：US164316
申请日：1993-12-08
Applicant: Frank L. Geoghegan , Bruce A. Peterson
Inventor： Frank L. Geoghegan , Bruce A. Peterson
CPC classification number: H05K3/308 , H01R12/58 , H01R12/716 , H01R43/16 , H05K2201/10189 , H05K2201/10757 , H05K2201/10878
Abstract: A system is disclosed for maintaining an electrical connector assembly mounted on a printed circuit board during soldering of the assembly to the board. A housing has a plurality of terminals mounted therein. The terminals include solder tails projecting from the housing for insertion into respective holes in the printed circuit board. Each terminal is stamped in planar form of sheet metal material. The solder tails are arranged in a row of pairs thereof, with the solder tails in each row being in a plane transverse to the row. All of the solder tails are of similar shape with each solder tail including a straight intermediate section projecting from the housing, a straight tip section for insertion into a respective hole in the printed circuit board, and an offset curved section between the intermediate and tip sections. The curved section of one solder tail extends in a direction transverse to the row opposite to the curved section of the other solder tail in each pair thereof. Each curved section is shaped such that each solder tail engages the circuit board within its respective hole only at a portion of the curved section. The straight intermediate section and the straight tip section of each solder tail are collinear.
Abstract translation: 公开了一种用于在将组件焊接到电路板的过程中维护安装在印刷电路板上的电连接器组件的系统。 壳体具有安装在其中的多个端子。 端子包括从壳体突出的焊接尾部，用于插入到印刷电路板中的各个孔中。 每个端子被冲压成平面形式的金属板材料。 焊料尾部排列成一排，其中每排中的焊料尾部处于横向于该行的平面。 所有的焊尾都具有相似的形状，每个焊尾包括从壳体突出的直的中间部分，用于插入印刷电路板的相应孔中的直的尖端部分，以及中间部分和末端部分之间的偏移弯曲部分 。 一个焊尾的弯曲部分在横向于每一对中另一个焊尾的弯曲部分相对的行的方向上延伸。 每个弯曲部分被成形为使得每个焊接尾部仅在弯曲部分的一部分处与其相应孔内的电路板接合。 每个焊尾的直的中间部分和直的尖端部分是共线的。
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公开(公告)号：US5369551A
公开(公告)日：1994-11-29
申请号：US148292
申请日：1993-11-08
Applicant: John G. Gore , Neal J. Tolar
Inventor： John G. Gore , Neal J. Tolar
CPC classification number: H05K1/0243 , H05K1/141 , H05K3/303 , H05K3/3426 , H05K3/3442 , H05K3/3447 , H05K1/0271 , H05K2201/049 , H05K2201/09063 , H05K2201/09081 , H05K2201/09181 , H05K2201/0989 , H05K2201/09909 , H05K2201/10083 , H05K2201/10303 , H05K2201/10318 , H05K2201/10727 , H05K2201/10734 , H05K2201/10757 , H05K2201/10848 , H05K2201/10871 , H05K2201/10946 , H05K2201/10969 , H05K2201/10984 , H05K2203/041 , H05K3/28 , H05K3/3452 , H05K3/368 , Y02P70/613
Abstract: An interface printed circuit board is configured to be placed between a leadless component such as a surface mount package used to house a SAW device and a standard printed circuit board configured for solder joints in a leadless contact with the printed circuit board. The interface device is made using materials having similar characteristic thermal expansion properties as that of the printed circuit to with it is affixed. Solder pads are placed in offset pairs and interface board material is removed such that the combination causes the interface board to flex from the forces caused by the differing expansion coefficients of the solder, the package and the printed circuit boards. The configuration causes the relative movement between the leadless carrier and the printed circuit board to occur along a length of epoxy and glass board material by bending the epoxy and glass as opposed to applying tensional or compressive forces to the solder joints. Such an approach relieves the stress and resulting creep seen at solder joints in the typical solder joint or column. In addition, by segregating the input and output pads and placing a metal shield between them, crosstalk rejection of the components is improved.
Abstract translation: 接口印刷电路板被配置为放置在诸如用于容纳SAW器件的表面安装封装的无引线部件和被配置为与印刷电路板无引线接触的焊接点的标准印刷电路板之间。 接口装置使用具有与印刷电路相似的特性热膨胀特性的材料制成，以便将其固定。 焊盘被放置在偏移对中，并且移除接口板材料，使得组合使得接口板从由焊料，封装和印刷电路板的不同膨胀系数引起的力弯曲。 通过弯曲环氧树脂和玻璃，这种结构使得无引线载体和印刷电路板之间的相对运动沿环氧树脂和玻璃板材料的长度发生，而不是向焊点施加张力或压缩力。 这种方法减轻了典型焊点或柱中焊点处的应力和结果蠕变。 此外，通过分离输入和输出焊盘并在它们之间放置金属屏蔽，组件的串扰抑制被改善。
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公开(公告)号：US4873123A
公开(公告)日：1989-10-10
申请号：US102447
申请日：1987-09-29
Applicant: Michael J. Canestaro , William J. Summa
Inventor： Michael J. Canestaro , William J. Summa
CPC classification number: H05K3/3442 , H05K1/0271 , H05K3/4092 , H05K2201/0394 , H05K2201/10727 , H05K2201/10757 , Y02P70/613
Abstract: A flexible electrical connection, and method for making such a connection, for mounting an electronic device, such as a semiconductor chip made primarily of silicon, on an organic substrate, such as a printed circuit board made of a glass material impregnated with epoxy resin, are disclosed. The flexible electrical connection comprises a circuit line attached to the surface of the organic substrate and having a floating terminus in a relatively low adhesive area of the organic substrate where it is desired to mount the electronic device on the organic substrate. The floating terminus includes a stress relief bend, and the flexible electrical connection relieves stresses, such as thermal stresses, which may otherwise damage the physical and/or electrical connection between the electronic device and the floating terminus of the flexible electrical connection when the electronic device is mounted on the surface of the organic substrate.
Abstract translation: 用于将诸如由硅制成的半导体芯片的电子装置安装在诸如由浸渍有环氧树脂的玻璃材料制成的印刷电路板的有机基板上的柔性电连接和用于制造这种连接的方法， 被披露。 柔性电连接包括连接到有机衬底的表面上的电路线，并且在有机衬底的相对低的粘合区域中具有浮动端，其中希望将电子器件安装在有机衬底上。 浮动终端包括应力消除弯曲，并且柔性电连接减轻诸如热应力的应力，否则当电子设备（例如，电子设备）可能会损坏电子设备与柔性电连接的浮动终端之间的物理和/或电连接 安装在有机基板的表面上。
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234.发明授权Process of forming a compliant lead frame for array-type semiconductor packages 失效形成用于阵列型半导体封装的柔性引线框架的工艺
公开(公告)号：US4751199A
公开(公告)日：1988-06-14
申请号：US5675
申请日：1987-01-21
Applicant: William S. Phy
Inventor： William S. Phy
CPC classification number: H05K7/12 , H05K3/3426 , H05K1/0271 , H05K2201/10719 , H05K2201/10757 , H05K2201/10818 , H05K2201/10924 , H05K2201/10946 , Y02P70/613 , Y10T29/49121 , Y10T29/4913 , Y10T29/49135 , Y10T29/53174
Abstract: A lead frame that is suited for use on array types of integrated circuit packages to provide a high degree of compliance for absorbing mechanical stress induced by thermal changes includes a series of individual terminal elements that are connected in a strip form by means of break tabs disposed between adjacent elements. Each terminal element provides two spaced, generally parallel mounting surfaces that are resiliently connected to one another by means of an integral intermediate section. While the terminal elements are interconnected in strip form, one of the mounting surfaces of each element can be bonded to an associated attachment region on the semiconductor substrate. After all of the terminals of the strip have been so bonded, the break tabs between adjacent terminals can be removed to thereby separate the terminals from one another. The package which then results contains discrete compliant terminals which are suitable for subsequent surface attachment to the printed circuit board.
Abstract translation: 适用于集成电路封装的阵列类型的引线框架，以提供用于吸收由热变化引起的机械应力的高度依从性，包括一系列单独的端子元件，其通过设置的断开突片连接成带状 在相邻元素之间。 每个端子元件提供两个间隔开的，大致平行的安装表面，其通过一体的中间部分弹性地相互连接。 当端子元件以带状形式互连时，每个元件的一个安装表面可以结合到半导体衬底上的相关联的附接区域。 在条的所有端子已经被接合之后，可以去除相邻端子之间的断开突片，从而将端子彼此分开。 然后结果的封装包含适合于后续表面连接到印刷电路板的分立的柔性端子。
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公开(公告)号：US4728751A
公开(公告)日：1988-03-01
申请号：US915485
申请日：1986-10-06
Applicant: Michael J. Canestaro , William J. Summa
Inventor： Michael J. Canestaro , William J. Summa
CPC classification number: H05K3/4092 , H05K1/0271 , H05K3/3442 , H05K2201/0394 , H05K2201/10727 , H05K2201/10757 , Y02P70/613
Abstract: A flexible electrical connection, and method for making such a connection, for mounting an electronic device, such as a semiconductor chip made primarily of silicon, on an organic substrate, such as a printed circuit board made of a glass material impregnated with epoxy resin, are disclosed. The flexible electrical connection comprises a circuit line attached to the surface of the organic substrate and having a floating terminus in a relatively low adhesive area of the organic substrate where it is desired to mount the electronic device on the organic substrate. The floating terminus includes a stress relief bend, and the flexible electrical connection relieves stresses, such as thermal stresses, which may otherwise damage the physical and/or electrical connection between the electronic device and the floating terminus of the flexible electrical connection when the electronic device is mounted on the surface of the organic substrate.
Abstract translation: 用于将诸如由硅制成的半导体芯片的电子装置安装在诸如由浸渍有环氧树脂的玻璃材料制成的印刷电路板的有机基板上的柔性电连接和用于制造这种连接的方法， 被披露。 柔性电连接包括连接到有机衬底的表面上的电路线，并且在有机衬底的相对低的粘合区域中具有浮动端，其中希望将电子器件安装在有机衬底上。 浮动终端包括应力消除弯曲，并且柔性电连接减轻诸如热应力的应力，否则当电子设备（例如，电子设备）可能会损坏电子设备与柔性电连接的浮动终端之间的物理和/或电连接 安装在有机基板的表面上。
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Patent Agency Ranking
公开(公告)号：US4703393A
公开(公告)日：1987-10-27
申请号：US757308
申请日：1985-07-22
Applicant: Tsuyoshi Yamamoto , Nobuhide Okada , Yasuo Kawamura
Inventor： Tsuyoshi Yamamoto , Nobuhide Okada , Yasuo Kawamura
CPC classification number: H05K3/3426 , H05K3/30 , H05K1/0271 , H05K2201/10689 , H05K2201/10757 , Y02P70/613
Abstract: A mounting structure of a flat-lead package-type electronic component wherein ends of lead terminals drawn out from a surface of a package are bent to be horizontal with respect to the plane of the package and other portions of said lead terminal are tilted inward by a desired angle with respect to the normal of the plane.
Abstract translation: 扁平引线封装型电子部件的安装结构，其中从封装的表面引出的引线端子的端部相对于封装的平面弯曲成水平的，并且所述引线端子的其它部分向内倾斜 相对于平面的法线的期望角度。
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公开(公告)号：US4647126A
公开(公告)日：1987-03-03
申请号：US745050
申请日：1985-06-17
Applicant: Stephen M. Sobota, Jr.
Inventor： Stephen M. Sobota, Jr.
CPC classification number: H01R12/57 , H05K3/3426 , H05K7/1053 , H01F2027/295 , H05K1/0271 , H05K2201/10727 , H05K2201/10757 , H05K2201/10946 , Y02P70/613
Abstract: A compliant lead clip comprises a single strip of metal bent to form a C-shaped member and an S-shaped member, the two members having a common portion. An integrated circuit chip is inserted into the C-shaped member and soldered thereto after which the lower part of the S-shaped member is soldered to the top surface of a printed circuit board whereby the chip is supported above the printed circuit board. The S-shaped member bends or twists to absorb forces which would otherwise be exerted on the solder joints as a result of warpage of the printed circuit board or temperature changes where the chip carrier and printed circuit board have different thermal coefficients of expansion.
Abstract translation: 柔性引线夹包括弯曲以形成C形构件和S形构件的单个金属条，所述两个构件具有公共部分。 将集成电路芯片插入到C形构件中并焊接到其上，之后将S形构件的下部焊接到印刷电路板的顶表面，由此芯片被支撑在印刷电路板上。 S形构件弯曲或扭曲以吸收由于印刷电路板的翘曲或者芯片载体和印刷电路板具有不同的热膨胀系数而导致的温度变化，否则将施加在焊点上的力。
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238.发明授权
公开(公告)号：US4333069A
公开(公告)日：1982-06-01
申请号：US206703
申请日：1980-11-14
Applicant: Joseph P. Worth , Bert B. Fletcher
Inventor： Joseph P. Worth , Bert B. Fletcher
CPC classification number: H01C17/28 , H01C1/01 , H01C1/14 , H05K3/308 , H01F2027/295 , H05K1/0271 , H05K2201/068 , H05K2201/10651 , H05K2201/10757 , H05K2201/10818 , H05K2201/10848 , H05K2201/10871 , H05K2201/10878 , H05K2203/166 , H05K3/3447 , Y10T29/49082 , Y10T29/49087
Abstract: An electrical resistor comprising an elongated resistor body having a resistance wire winding extending between its ends and terminals at each end contact the resistance winding and each comprise a strip of given width having a first end portion extending about and secured with an end of the body, and a second end portion which extends in a direction transverse to the axis of the body and has a tip for being received through an opening in a printed circuit board. Each strip has an intermediate neck portion of reduced width which is positioned proximate to the resistor body and is twisted so that the second portion extends in a plane which is perpendicular to the axis of the body and in the same direction with and spaced from that of the other terminal allowing adjustment of the distance between their tips. The second end portions each have a shoulder proximate to its tip which is seated on the surface of a circuit board, fixing the position of the resistor and stabilizing its mounting thereon.The method of making an electrical resistor comprises the steps of segmenting a continuous wire wound core to provide resistor bodies, and cutting out portions of a continuous substantially plane strip of metal material at spaced locations therealong to provide narrow neck regions, and first and second end portions above and below each neck region.
Abstract translation: 一种电阻器，包括细长电阻体，其具有在其端部之间延伸的电阻线绕组和在每个端部处的端子与电阻绕组接触，并且每个包括具有给定宽度的条带，该第一端部围绕主体的端部延伸并固定， 以及第二端部，该第二端部在横向于所述主体的轴线的方向上延伸并且具有用于通过印刷电路板中的开口接收的尖端。 每个条具有减小的宽度的中间颈部，其位于接近电阻体的位置，并且被扭转，使得第二部分在垂直于主体的轴线并沿与该主体的轴线相同的方向延伸并且与 另一个终端允许调整他们的提示之间的距离。 第二端部各自具有靠近其尖端的肩部，其位于电路板的表面上，固定电阻器的位置并稳定其安装在其上。 制造电阻器的方法包括以下步骤：分割连续绕线芯以提供电阻体，并在其间隔开的位置处切割金属材料连续基本上平面的条的部分以提供窄的颈部区域，以及第一和第二端 每个颈部上方和下方的部分。
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公开(公告)号：US3004505A
公开(公告)日：1961-10-17
申请号：US68702457
申请日：1957-09-30
Applicant: WESTERN ELECTRIC CO
Inventor： DVORAK HOWARD A
CPC classification number: B23K3/0653 , B23K2201/42 , H05K3/3405 , H05K2201/10651 , H05K2201/10757
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公开(公告)号：US2931998A
公开(公告)日：1960-04-05
申请号：US62817456
申请日：1956-12-13
Applicant: QUALITY COMPONENTS INC
Inventor： KNOUSE EDGAR J
CPC classification number: H01C1/14 , H05K3/308 , H05K2201/10651 , H05K2201/10757 , H05K2201/10871
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