Abstract:
The present disclosure is directed to a method that includes exposing a surface of a silicon substrate in a first region between first and second isolation trenches, etching the silicon substrate in the first region to form a recess between the first and second isolation trenches,=; and forming a base of a heterojunction bipolar transistor by selective epitaxial growth of a film comprising SiGe in the recess.
Abstract:
A pixel circuit including: a detection circuit having first and second transistors coupled in series between differential output nodes of an antenna, wherein the antenna is configured to be sensitive to terahertz radiation; a capacitor coupled to an intermediate node between the first and second transistors; and control circuitry coupled to control nodes of the first and second transistors, the control circuitry being configured for selectively applying to the control nodes one of: a gate biasing voltage for biasing the control nodes of the first and second transistors during a detection phase of the pixel circuit; and a reset voltage for resetting a voltage stored by the capacitor.
Abstract:
A method for forming a via connecting a first upper level layer to a second lower level layer, both layers being surrounded with an insulating material, the method including the steps of: a) forming an opening to reach an edge of the first layer, the opening laterally continuing beyond said edge; b) forming a layer of a protection material on said edge only; c) deepening said opening by selectively etching the insulating material to reach the second lower level layer; and d) filling the opening with at least one conductive contact material.
Abstract:
A method for forming an integrated circuit including the steps of: a) forming openings in a front surface of a first semiconductor wafer, the depth of the openings being smaller than 10 μm, and filling them with a conductive material; b) forming doped areas of components in active areas of the front surface, forming interconnection levels on the front surface and leveling the surface supporting the interconnection levels; c) covering with an insulating layer a front surface of a second semiconductor wafer, and leveling the surface coated with an insulator; d) applying the front surface of the second wafer coated with insulator on the front surface of the first wafer supporting interconnection levels, to obtain a bonding between the two wafers; e) forming vias from the rear surface of the second wafer, to reach the interconnection levels of the first wafer; and f) thinning the first wafer to reach the openings filled with conductive material.
Abstract:
A MOS transistor including a U-shaped channel-forming semiconductor region and source and drain regions having the same U shape located against the channel-forming region on either side thereof, the internal surface of the channel-forming semiconductor region being coated with a conductive gate, a gate insulator being interposed.
Abstract:
A volatile memory includes volatile memory cells in which data write and read operations are performed. The memory cells are arranged in rows and in columns and are distributed in first separate groups of memory cells for each column. The memory includes, for each column, a write bit line dedicated to write operations and connected to all the memory cells of the column and read bit lines dedicated to read operations. Each read bit line is connected to all the memory cells of one of the first groups of memory cells. Each memory cell in the column is connected to a single one of the read bit lines.
Abstract:
An SRAM memory cell includes first and second inverters (14, 16) interconnected between first and second data nodes. Each inverter is formed from complementary MOS transistors (18, 20, 18null, 20null) connected in series between a DC voltage supply source and a grounding circuit (22). A circuit (28, 30) programs the MOS transistors by causing an irreversible degradation of a gate oxide layer of at least some of the transistors (18, 18null).
Abstract:
A device comprising a resonator formed of a piezoelectric layer sandwiched between two metal electrodes, the resonator being laid on a suspended beam, the device comprising means for deforming said beam by the difference in thermal expansion coefficients.
Abstract:
A sense amplifier connected to first and second bit lines, comprising means for precharging said bit lines to a high voltage, means for connecting one or the other of the bit lines to a memory cell, said connection causing according to the state of the memory cell a maintaining of the bit line at the high voltage or a voltage reduction, first and second transistors respectively controlled by the first and second bit lines, and, in series with the first and second transistors, a controllable means for the current through the transistor controlled by the bit line connected to the memory cell to be greater than the current through the other transistor when the voltages of the two bit lines are at the high voltage.
Abstract:
A phase-locked loop comprising a comparator generating a control voltage depending on the phase-shift between a reference signal and a feedback signal, an oscillator controlled by the control voltage, generating several phase-shifted signals of same period, one of which forms the output signal of the phase-locked loop, a multiplexer capable of providing any of the phase-shifted signals to the input of a divider, the output of which forms the feedback signal, and a means controlling the multiplexer to successively provide fractions of the phase-shifted signals, so that the divider receives a signal having an average period equal to a real fraction of the period of the phase-shifted signals.