公开(公告)号：US20120155783A1

公开(公告)日：2012-06-21

申请号：US12970817

申请日：2010-12-16

Applicant: Yong Huang ,  Lucas Hui

Inventor： Yong Huang ,  Lucas Hui

IPC: G06K9/40

CPC classification number: H04N5/14 ,  G06T5/002 ,  G06T2200/12 ,  G06T2207/20192

Abstract: A directional anti-aliasing filter circuit includes an input node and an output node, a directional anti-aliasing filter having an input coupled to the input node, an adaptive gain control having an input coupled to an output of the directional anti-aliasing filter, a summer having a first input coupled to an output of the adaptive gain control, a second input coupled to the input node, and an output coupled to the output node, a texture detector for providing a texture adjust signal to the directional anti-aliasing filter and a texture adaptive gain signal to the adaptive gain control, an edge detector for providing an edge direction signal to the directional anti-aliasing filter, and a corner detector for providing a corner adaptive gain signal to the adaptive gain control.

Abstract translation: 定向抗混叠滤波器电路包括输入节点和输出节点，具有耦合到输入节点的输入的定向抗混叠滤波器，具有耦合到定向抗混叠滤波器的输出的输入的自适应增益控制， 具有耦合到自适应增益控制的输出的第一输入，耦合到输入节点的第二输入和耦合到输出节点的输出的加法器，纹理检测器，用于向定向抗混叠滤波器提供纹理调整信号 以及到自适应增益控制的纹理自适应增益信号，用于向定向抗混叠滤波器提供边缘方向信号的边缘检测器，以及用于向自适应增益控制提供角自适应增益信号的角检测器。

公开(公告)号：US20120146657A1

公开(公告)日：2012-06-14

申请号：US12965170

申请日：2010-12-10

Applicant: Anthony Junior Casillan ,  Yannick Guedon ,  Dianbo Guo

Inventor： Anthony Junior Casillan ,  Yannick Guedon ,  Dianbo Guo

IPC: G01R31/28

CPC classification number: G06F3/044 ,  G06F3/0416

Abstract: A short circuit detection module for a touch panel includes first and second short circuit detection circuits. The first short circuit detection circuit is coupled to a first conductive line of the touch panel. The first short circuit detection circuit is configured to drive the first conductive line with a first signal having a first logic level. The second short circuit detection circuit is coupled to second, adjacent, conductive line of the touch panel. The second short circuit detection circuit is configured to drive the second conductive line with a second signal having a second logic level that is complementary to the first logic level.

Abstract translation: 用于触摸面板的短路检测模块包括第一和第二短路检测电路。 第一短路检测电路耦合到触摸面板的第一导电线。 第一短路检测电路被配置为用具有第一逻辑电平的第一信号驱动第一导线。 第二短路检测电路耦合到触摸面板的第二相邻的导电线。 第二短路检测电路被配置为用具有与第一逻辑电平互补的第二逻辑电平的第二信号来驱动第二导线。

公开(公告)号：US08164179B2

公开(公告)日：2012-04-24

申请号：US12336422

申请日：2008-12-16

Applicant: Kim-Yong Goh ,  Jing-En Luan

Inventor： Kim-Yong Goh ,  Jing-En Luan

IPC: H01L23/12

CPC classification number: H01L23/367 ,  H01L23/04 ,  H01L23/3114 ,  H01L23/552 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A chip scale package (CSP) device includes a CSP having a semiconductor die electrically coupled to a plurality of solder balls. A can having an inside top surface and one or more side walls defines a chamber. The CSP is housed in the chamber and is attached to the inside top surface of the can. A printed circuit board is attached to the solder balls and to the one or more side walls to provide support to the CSP and to the can. The CSP may be a Wafer-Level CSP. The can may be built from a metallic substance or from a non-metallic substance. The can provides stress relief to the CSP during a drop test and during a thermal cycle test.

Abstract translation: 芯片级封装（CSP）器件包括具有电耦合到多个焊球的半导体管芯的CSP。 具有内顶表面和一个或多个侧壁的罐体限定了一个室。 CSP容纳在腔室中，并连接到罐的内部顶部表面。 印刷电路板附接到焊球和一个或多个侧壁以提供对CSP和罐的支撑。 CSP可能是晶片级CSP。 罐可以由金属物质或非金属物质制成。 在跌落测试期间和热循环测试期间，罐可以为CSP提供应力消除。

公开(公告)号：US20120085748A1

公开(公告)日：2012-04-12

申请号：US12902005

申请日：2010-10-11

Applicant: Olivier Le Neel ,  Fuchao Wang ,  Ravi Shankar

Inventor： Olivier Le Neel ,  Fuchao Wang ,  Ravi Shankar

IPC: H05B1/00

CPC classification number: H05B3/0014 ,  H01L23/34 ,  H01L23/345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H05B1/0227 ,  H05B3/02 ,  H05B3/06 ,  H05B3/12 ,  H05B3/34 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.

Abstract translation: 提供具有有源电路的集成电路。 加热元件邻近有源电路并且被配置为加热有源电路。 温度传感器也与有源电路相邻并且被配置为测量有源电路的温度。 温度控制器耦合到有源电路并被配置为从温度传感器接收温度信号。 温度控制器操作加热元件以加热有源电路以将有源电路的温度保持在所选择的温度范围内。

公开(公告)号：US20120074592A1

公开(公告)日：2012-03-29

申请号：US12893651

申请日：2010-09-29

Applicant: Jing-En Luan

Inventor： Jing-En Luan

IPC: H01L23/48 ,  H01L21/56

CPC classification number: H01L24/97 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2224/83 ,  H01L2224/19 ,  H01L2224/82 ,  H01L2924/00

Abstract: An electronic package that includes a composite material base. In one embodiment the electronic package is an expanded wafer-level package. The composite material base is composed of woven strands and polymer material. In one embodiment the composite material base is composed of woven fiberglass strands and an epoxy material. In various embodiments the package includes an electronic circuitry layer on one or another face of the composite material base. In other embodiments conductive vias connect the circuitry layers, including a redistribution layer. In yet another embodiment an electronic package is mounted on the composite material base and electrically couples to the circuit of the expanded wafer-level package. The package having the composite material base is mechanically stronger and can be made thinner than a package that relies on an encapsulant material for structure, and resists cracking.

Abstract translation: 一种包括复合材料基底的电子封装。 在一个实施例中，电子封装是扩展的晶片级封装。 复合材料基底由编织线和聚合物材料组成。 在一个实施方案中，复合材料基底由编织的玻璃纤维束和环氧材料组成。 在各种实施例中，封装包括在复合材料基底的一个或另一个面上的电子电路层。 在其它实施例中，导电通孔连接电路层，包括再分配层。 在另一个实施例中，电子封装安装在复合材料基底上并电耦合到扩展的晶片级封装的电路。 具有复合材料基底的包装机械地更坚固，并且可以制成比依赖于用于结构的密封剂材料的包装，并且抗龟裂。

公开(公告)号：US20120049323A1

公开(公告)日：2012-03-01

申请号：US12862589

申请日：2010-08-24

Applicant: Hui Chong Vince Ng ,  Olivier Le Neel ,  Calvin Leung

Inventor： Hui Chong Vince Ng ,  Olivier Le Neel ,  Calvin Leung

IPC: H01L27/06 ,  H01L21/02

CPC classification number: H01L23/5228 ,  H01L21/76834 ,  H01L21/76852 ,  H01L28/20 ,  H01L2221/1078 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure is directed to an integrated circuit having a substrate and a first and a second interconnect structure over the substrate. Each interconnect structure has a first conductive layer over the substrate and a second conductive layer over the first conductive layer. The integrated circuit also includes a thin film resistor over a portion of the substrate between the first and the second interconnect structure that electrically connects the first conductive layers of the first and second interconnect structures.

Abstract translation: 本发明涉及一种集成电路，该集成电路具有衬底和衬底上的第一和第二互连结构。 每个互连结构在衬底上具有第一导电层，并且在第一导电层上方具有第二导电层。 集成电路还包括在第一和第二互连结构之间的衬底的一部分上的薄膜电阻器，其电连接第一和第二互连结构的第一导电层。

公开(公告)号：US08054122B2

公开(公告)日：2011-11-08

申请号：US12633777

申请日：2009-12-08

Applicant: Dianbo Guo

Inventor： Dianbo Guo

IPC: H03L5/00

CPC classification number: H03K17/145 ,  H03K2217/0018 ,  H03K2217/0036 ,  H03K2217/0054

Abstract: An analog switch includes a transistor whose source connected to a signal input and whose drain is connected to a signal output. An output of a gate control circuit is connected to the transistor gate. A first input of the gate control circuit is connected to the source of the transistor. The gate control circuit responds to a logic transition of an enable signal received at a second input by pre-charging a substantially constant gate-to-source voltage across the transistor. This voltage is stored by a gate-to-source connected capacitor. In one steady-state logic condition of the enable signal, the gate control circuit operates to turn off the transistor. In another steady-state logic condition of the enable signal, the gate control circuit permits the signal received at the signal input to drive the gate of the transistor with a voltage offset by the substantially constant gate-to-source voltage stored on the capacitor.

Abstract translation: 模拟开关包括其源极连接到信号输入并且其漏极连接到信号输出的晶体管。 栅极控制电路的输出端连接到晶体管栅极。 栅极控制电路的第一输入端连接到晶体管的源极。 栅极控制电路通过对晶体管两端的基本恒定的栅极 - 源极电压进行预充电来响应在第二输入端接收的使能信号的逻辑转换。 该电压由栅极到源极连接的电容器存储。 在使能信号的一个稳态逻辑条件下，栅极控制电路用于关断晶体管。 在使能信号的另一个稳态逻辑条件下，门控制电路允许在信号输入处接收到的信号以由存储在电容器上的基本上恒定的栅极 - 源极电压的电压偏移来驱动晶体管的栅极。

公开(公告)号：US20110216906A1

公开(公告)日：2011-09-08

申请号：US12718277

申请日：2010-03-05

Applicant: Annamalai Swaminathan ,  Sapna George

Inventor： Annamalai Swaminathan ,  Sapna George

IPC: H04R5/00

CPC classification number: H04R5/00

Abstract: The perception of 3D sound positioning can be achieved using a 2D arrangement of speakers positioned around the listener. The disclosed techniques can enable listeners to perceive sounds as coming from above and/or below them, without the need for positioning speakers above and/or below the listener. In some embodiments, elevation information can be included in the X and Y horizontal components of the 2D ambisonics encoding. The X and Y components can be decoded using 2D ambisonics decoding. Suitable filtering may be performed on the decoded sound information to enhance the listener's perception of the elevation information encoded in the X and Y components.

Abstract translation: 3D声音定位的感觉可以使用位于收听者周围的扬声器的2D布置来实现。 所公开的技术可以使得听众能够将声音感知为来自其上方和/或下方，而不需要在收听者之上和/或之下定位扬声器。 在一些实施例中，高程信息可以包括在2D对准编码的X和Y水平分量中。 X和Y分量可以使用二维对数解码进行解码。 可以对解码的声音信息执行适当的滤波，以增强听众对在X和Y分量中编码的高程信息的感知。

公开(公告)号：US20110210808A1

公开(公告)日：2011-09-01

申请号：US12713390

申请日：2010-02-26

Applicant: Tang Min ,  Olivier Le Neel ,  Ravi Shankar

Inventor： Tang Min ,  Olivier Le Neel ,  Ravi Shankar

IPC: H01H1/00 ,  H01H9/00 ,  H01H11/00

CPC classification number: H01H1/0036

Abstract: Switches that are actuated through exposure to a magnetic field are described. Such switches include conductive portions that are electrically separate from one another when in an open switch configuration. A mobile element of a switch includes one or more anchoring members that are in electrical contact with one of the conductive portions. The mobile element also has a beam that is attached to the one or more anchoring members. The beam can be attached to the one or more anchoring members by flexures. In some cases, the beam includes a plurality of strips. The beam has an end portion that is configured to move toward the other conductive portion when exposed to an external force, such as a magnetic field. When the mobile element electrically contacts the other conductive portion of the substrate, an electrical pathway is established between the conductive portions, giving rise to a closed switch configuration. Various configurations of anchoring members may significantly decrease initial upward beam deformation upon manufacture of the mobile element, resulting in an increased sensitivity upon exposure to a magnetic field. Methods for manufacturing switches that exhibit increased sensitivity to magnetic fields are also disclosed. Switches described can be formed using semiconductor manufacturing techniques. Methods described also include forming a beam that is attached to one or more anchoring members where an end portion of the beam moves in a substantially downward direction upon exposure to a magnetic field of sufficient intensity.

Abstract translation: 描述通过暴露于磁场而被致动的开关。 这种开关包括当处于开路开关配置时彼此电分离的导电部分。 开关的移动元件包括与导电部分之一电接触的一个或多个锚定构件。 移动元件还具有附接到一个或多个锚固构件的梁。 梁可以通过弯曲连接到一个或多个锚固构件。 在一些情况下，梁包括多个条。 梁具有端部，其被配置为当暴露于诸如磁场的外力时朝向另一导电部分移动。 当移动元件电接触衬底的另一导电部分时，在导电部分之间建立电路径，产生闭合的开关构造。 锚定构件的各种构造可以在制造移动元件时显着降低初始向上的梁变形，导致暴露于磁场时的灵敏度增加。 还公开了对磁场具有增强的灵敏度的开关的制造方法。 所描述的开关可以使用半导体制造技术形成。 所描述的方法还包括形成连接到一个或多个锚固构件的梁，其中梁的端部在暴露于足够强度的磁场时沿基本上向下的方向移动。

公开(公告)号：US07982723B2

公开(公告)日：2011-07-19

申请号：US12233350

申请日：2008-09-18

Applicant: Kusuma Adi Ningrat

Inventor： Kusuma Adi Ningrat

IPC: G06F3/45

CPC classification number: G06F3/044 ,  G06F2203/04104 ,  G06F2203/04808

Abstract: A touch screen capable of correctly identifying multiple touches employs multiple active line arrays oriented to provide multi-dimensional data. Three arrays of capacitance based active lines are each distinctly oriented to form a plurality of intersections. A first and second array are generally oriented perpendicularly while a third array is oriented to bisect the resulting matrix such that the active lines of the third array also intersect the existing vertices. As a result of a touch each active line array identifies the location of the touch from three distinct directions. Ambiguity from dual touch scenarios existing in dual array systems is removed by providing an additional reference.

Abstract translation: 能够正确识别多个触摸的触摸屏采用多个有源线阵列，以提供多维数据。 三个基于电容的有源线阵列每个被明显地取向以形成多个交点。 第一和第二阵列通常垂直取向，而第三阵列被定向成平分所得到的矩阵，使得第三阵列的活动线也与现有顶点相交。 作为触摸的结果，每个活动线阵列从三个不同的方向识别触摸的位置。 通过提供额外的参考，可以消除双阵列系统中存在的双重触控场景的模糊性。