Abstract:
An edge emission FED (100) includes a supporting substrate (110); a cathode (120) disposed on the supporting substrate (110); a ballast layer (130) disposed on the cathode (120); an emissive layer (140) disposed on the ballast layer (130) and defining an emissive edge (183); a field shaper layer (150) disposed on the emissive layer (140); a dielectric layer (160) disposed on the field shaper layer (150); a gate extraction electrode (170) disposed on the dielectric layer (160); an emission well (180) defined by the ballast layer (130), the emissive edge (183), the field shaper layer (150), the dielectric layer (160), and the gate extraction electrode (170); and an anode plate (188) opposing the gate extraction electrode (170).
Abstract:
This invention is directed to an improvement of a field emission display architecture in which low-voltage row and column address signals control a much higher pixel activation voltage. Instead of using a pair of series-coupled transistors the emitter node grounding path as in the original architecture (one of which is gated by a column signal d the other of which is gated by a row signal), only a single transistor is utilized in the emitter node grounding path thus eliminating an intermediate node between the two transistors that was responsible for unwanted emissions under certain operating conditions. In a preferred embodiment of the invention, a current regulating resistor is placed in the grounding path in series with the primary grounding transistor, with the resistor being directly coupled to ground. Additionally, for the preferred embodiment of the invention, the gate of the grounding transistor is coupled via a second field-effect transistor to either a row signal or a column signal. In the case where the gate of the first transistor is coupled to a row signal, the gate of the second transistor is coupled to a column signal. Likewise, where the gate of the first transistor is coupled to a column signal, the gate of the second transistor is coupled to a row signal. Numerous other equivalent circuits are possible, and several examples of such equivalent circuits are depicted in this disclosure.
Abstract:
The present invention provides field emitter arrays (FEAs) incorporated with metal oxide semiconductor field effect transistors (MOSFETs) and method for fabricating the same which realizes a simultaneous fabrication of two kinds of devices, namely, an FEA and MOSFETs, by using common processing steps among the processes of fabricating Si-FEAs or metal FEAs and MOSFETs, wherein the method comprises steps of forming field emission tips and active regions for MOSFETs by oxidizing selected portions of a silicon nitride layer, forming a gate insulating oxide layer for the FEA and field oxide layers for MOSFETs simultaneously by the LOGOS method and connecting gate electrodes (row line) and cathode electrodes (column line) of the FEA to MOSFETs.
Abstract:
The object of the present invention is to provide a cold cathode field emission display whose resolution is not limited by the provision of individual ballast resistors for each pixel or by the wiring system used to deliver voltage to the cold cathodes. This has been achieved by providing additional layers beneath the cold cathodes arrays so that said resistors and voltage delivery systems are located directly below the cold cathode arrays instead of alongside of them. Six different embodiments of the invention are described.
Abstract:
A field emission device of simple structure enables stabilization and control of field emission current. A three-dimensional emitter formed on a base member incorporates therein a source layer on the side in contact with the base member, a drain layer on the side of the distal end including a tip and a channel region layer between the source layer and the drain layer. A gate is formed near the emitter. A strong electric field generated by applying a voltage to the gate causes cold electrons to be emitted from the emitter tip and the voltage applied to the gate also controls the conductivity of the channel region layer, whereby the field emission current emitted from the tip of the emitter is stabilized and controlled.
Abstract:
A field emitter display having reduced surface leakage comprising at least one emitter tip surrounded by a dielectric region. The dielectric region is formed of a composite of insulative layers, at least one of which has fins extending toward the emitter tip. A conductive gate, for extracting electrons from the emitter tip, is disposed superjacent the dielectric region. The fins increase the length of the path that leaked electrical charge travels before impacting the gate.
Abstract:
An electron emitter plate (10, 10') for an FED image display has a gate conductive layer (22) spaced by a dielectric insulating layer (25) from a cathode conductive layer formed into a mesh (18). Arrays (12) of microtips (14) are located within mesh spacings (16) for field emission of electrons toward a phosphor layer (34) of an anode plate (11). Cathode layer (18) is patterned into column stripes (19) separated by gaps (17). Gate layer (22) is patterned into row cross-stripes (24) separated by gaps (23) which intersect with stripes (19) at matrix addressable pixel locations (30). Resistive layer (15) is patterned into stripes (40) separated by gaps (42) which interrupt column-to-column electrical communication through resistive layer (15). Unetched strips (43) are provided to bridge gap discontinuities for deposition of gate layer (22) at crossovers of rows (24) between columns (19). In one embodiment, gate layer (22) has a mesh pattern with apertured pads (46) commonly connected along resistive gap edges by marginal buses (50) formed on borders (49) of resistive layer (15) along gaps (42). Adjacent marginal buses (50) are connected by crossover buses (52) formed over bridging strips (43).
Abstract:
Cold cathode passive matrix FEDs are fabricated by depositing a resistive layer on a substrate, and coated with a protective layer in which at least one hole is formed. Cathode material is deposited on the protective layer making direct contact with the resistive layer through the hole to form bases for the emitter tips which are subsequently etched from the cathode layer. The protective layer allows overetching of the cathode material to prevent tip-to-tip electrical shorts without attacking the underlying resistive layer.
Abstract:
A field emission element including an electrode structure made of a thin film exhibiting increased adhesive strength. A thin film of niobium nitride (NbN) is formed on a glass substrate by sputtering or the like. The NbN film exhibits increased adhesive strength to a degree sufficient to prevent etching for formation of the film into electrodes from causing peeling of the film.
Abstract:
A matrix-addressed diode flat panel display of field emission type is described, utilizing a diode (two terminal) pixel structure. The flat panel display comprises a cathode assembly having a plurality of cathodes, each cathode including a layer of cathode conductive material and a layer of a low effective work-function material deposited over the cathode conductive material and an anode assembly having a plurality of anodes, each anode including a layer of anode conductive material and a layer of cathodoluminescent material deposited over the anode conductive material, the anode assembly located proximate the cathode assembly to thereby receive charged particle emissions from the cathode assembly, the cathodoluminescent material emitting light in response to the charged particle emissions. The flat panel display further comprises means for selectively varying field emission between the plurality of corresponding light-emitting anodes and field-emission cathodes to thereby effect an addressable grey-scale operation of the flat panel display.