公开(公告)号：US07456035B2

公开(公告)日：2008-11-25

申请号：US10899864

申请日：2004-07-27

Applicant: Ivan Eliashevich ,  Boris Kolodin ,  Emil P. Stefanov

Inventor： Ivan Eliashevich ,  Boris Kolodin ,  Emil P. Stefanov

IPC: H01L21/00

CPC classification number: H01L25/0753 ,  H01L33/0079 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: In a method for fabricating a flip-chip light emitting diode device, epitaxial layers (14, 114) are deposited on a growth substrate (16, 116) to produce an epitaxial wafer. A plurality of light emitting diode devices are fabricated on the epitaxial wafer. The epitaxial wafer is diced to generate a device die (10, 110). The device die (10, 110) is flip chip bonded to a mount (12, 112). The flip chip bonding includes securing the device die (10, 110) to the mount (12, 112) by bonding at least one electrode (20, 22, 120) of the device die (10, 110) to at least one bonding pad (26, 28, 126) of the mount (12, 112). Subsequent to the flip chip bonding, a thickness of the growth substrate (16, 116) of the device die (10, 110) is reduced.

Abstract translation: 在制造倒装芯片发光二极管器件的方法中，外延层（14,114）沉积在生长衬底（16,116）上以产生外延晶片。 在外延晶片上制造多个发光二极管器件。 切割外延晶片以产生器件管芯（10,110）。 器件管芯（10,110）被倒装芯片结合到安装件（12,112）上。 倒装芯片接合包括通过将器件管芯（10,110）的至少一个电极（20,22，120）粘合到至少一个焊盘（10,110）上来将器件管芯（10,110）固定到安装座（12,112） （12,112）的底部（26,28,126）。 在倒装芯片接合之后，器件管芯（10,110）的生长衬底（16,116）的厚度减小。

公开(公告)号：US20070236956A1

公开(公告)日：2007-10-11

申请号：US11394895

申请日：2006-03-31

Applicant: Boris Kolodin ,  Shawn Du ,  Emil Radkov ,  Mark Mayer ,  Ivan Eliashevich

Inventor： Boris Kolodin ,  Shawn Du ,  Emil Radkov ,  Mark Mayer ,  Ivan Eliashevich

IPC: G02B6/00 ,  F21V9/00

CPC classification number: G02B6/0008 ,  F21S41/00 ,  F21Y2115/10 ,  G02B3/00 ,  G02B6/04

Abstract: At least two light emitting diodes emit a non-parallel light beam. A condensing system, operationally coupled with the light emitting diodes, receives the emitted non-parallel light beam and converts the received non-parallel light beam into a parallel light beam. A non-imaging concentrator includes an input surface which collects the parallel light beam, and an output surface, which includes phosphor material and outputs light.

Abstract translation: 至少两个发光二极管发射非平行光束。 与发光二极管可操作地耦合的冷凝系统接收所发射的非平行光束并将接收到的非平行光束转换为平行光束。 非成像集中器包括收集平行光束的输入表面和包括磷光体材料并输出光的输出表面。

公开(公告)号：US20070120135A1

公开(公告)日：2007-05-31

申请号：US10525697

申请日：2003-08-29

Applicant: Thomas Soules ,  Stanton Weaver ,  Chen-Lun Chen ,  Mathew Sommers ,  Boris Kolodin ,  Anan Setlur ,  Thomas Stecher

Inventor： Thomas Soules ,  Stanton Weaver ,  Chen-Lun Chen ,  Mathew Sommers ,  Boris Kolodin ,  Anan Setlur ,  Thomas Stecher

IPC: H01L33/00 ,  H01L29/22 ,  H01L29/227

CPC classification number: H01L33/58 ,  F21K9/64 ,  H01L33/44 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An LED device including an LED chip and a lens positioned apart from the chip and coated with a uniform thickness layer of fluorescent phosphor for converting at least some of the radiation emitted by the chip into visible light. Positioning the phosphor layer away from the LED improves the efficiency of the device and produces more consistent color rendition. The surface area of the lens is preferably at least ten times the surface area of the LED chip. For increased efficiency, the reflector and submount can also be coated with phosphor to further reduce internal absorption.

Abstract translation: 一种LED装置，包括LED芯片和与芯片分离并且涂覆有均匀厚度的荧光荧光粉层的透镜，用于将由芯片发射的至少一些辐射转换成可见光。 将荧光体层定位在远离LED的位置，提高了器件的效率，并产生更一致的色彩再现。 透镜的表面积优选为LED芯片的表面积的至少十倍。 为了提高效率，反射器和底座也可以涂覆磷光体，以进一步减少内部吸收。

公开(公告)号：US10422484B2

公开(公告)日：2019-09-24

申请号：US15158978

申请日：2016-05-19

Applicant: Gary R. Allen ,  David C. Dudik ,  Boris Kolodin ,  Joshua I. Rintamaki ,  Bruce R. Roberts

Inventor： Gary R. Allen ,  David C. Dudik ,  Boris Kolodin ,  Joshua I. Rintamaki ,  Bruce R. Roberts

IPC: F21K9/232 ,  F21V9/30 ,  F21V3/00 ,  F21V9/00 ,  F21V29/507 ,  F21V29/67 ,  F21V29/74 ,  F21V29/77 ,  F21V3/02 ,  F21K9/23 ,  F21K9/64 ,  F21K9/235 ,  F21V19/00 ,  F21V23/00 ,  F21K9/238 ,  F21K9/66 ,  F21V29/00 ,  F21Y101/00 ,  F21Y115/10 ,  F21Y103/33 ,  F21Y113/13

Abstract: A light emitting apparatus comprises: an LED-based light source; a spherical, spheroidal, or toroidal diffuser generating a Lambertian light intensity distribution output at any point on the diffuser surface responsive to illumination inside the diffuser; and a base including a base connector. The LED based light source, the diffuser, and the base are secured together as a unitary LED lamp installable in a lighting socket by connecting the base connector with the lighting socket. The diffuser is shaped and arranged respective to the LED based light source in the unitary LED lamp to conform with an isolux surface of the LED based light source. The base is operatively connected with the LED based light source in the unitary LED lamp to electrically power the LED based light source using electrical power received at the base connector.

公开(公告)号：US09944519B2

公开(公告)日：2018-04-17

申请号：US13424835

申请日：2012-03-20

Applicant: Christopher L. Bohler ,  Boris Kolodin ,  Emil Radkov ,  Srinath K. Aanegola ,  Stanton E. Weaver, Jr. ,  James T. Petroski ,  Zena Brown

Inventor： Christopher L. Bohler ,  Boris Kolodin ,  Emil Radkov ,  Srinath K. Aanegola ,  Stanton E. Weaver, Jr. ,  James T. Petroski ,  Zena Brown

IPC: F21V3/00 ,  B82Y10/00 ,  F21V29/70 ,  F21V29/02 ,  F21V29/58 ,  F21K9/23 ,  F21K9/232 ,  F21K9/64 ,  F21Y105/00 ,  F21V29/63 ,  F21K9/61 ,  F21Y115/10

CPC classification number: B82Y10/00 ,  F21K9/23 ,  F21K9/232 ,  F21K9/61 ,  F21K9/64 ,  F21V3/00 ,  F21V3/02 ,  F21V29/58 ,  F21V29/63 ,  F21V29/70 ,  F21V29/773 ,  F21Y2105/00 ,  F21Y2105/18 ,  F21Y2115/10

Abstract: A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.

公开(公告)号：US08757836B2

公开(公告)日：2014-06-24

申请号：US13005970

申请日：2011-01-13

Applicant: Boris Kolodin ,  Glenn H. Kuenzler ,  Gary R. Allen ,  Mark J. Mayer ,  Yiyu Cao

Inventor： Boris Kolodin ,  Glenn H. Kuenzler ,  Gary R. Allen ,  Mark J. Mayer ,  Yiyu Cao

IPC: F21S4/00 ,  F21V21/00 ,  F21V9/16

CPC classification number: F21S4/00 ,  F21K9/232 ,  F21K9/64 ,  F21V3/061 ,  F21V3/062 ,  F21V3/10 ,  F21V3/12 ,  F21V5/04 ,  F21V29/51 ,  F21V29/74 ,  F21Y2107/90 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0066 ,  G02B19/0071

Abstract: A lighting apparatus includes a bilaterally symmetrical light engine comprising first and second light emitting diode (LED) devices or planar LED device arrays facing opposite directions, and an envelope including phosphor spaced apart from and surrounding the bilaterally symmetrical light engine. The phosphor is effective to convert light emitted by the light engine to emission light. The bilaterally symmetrical light engine may be configured to emit light having a bilaterally symmetrical intensity distribution that is uniform except at emission angles within 10° of the symmetry plane of the bilaterally symmetrical light engine. Each of the first and second LED devices or planar LED device arrays may comprise at least one hemispherically emitting LED device including an LED chip and an encapsulant encapsulating the LED chip and shaped to refract light emitted by the LED chip into a uniform distribution over a hemispherical solid angle.

Abstract translation: 一种照明装置，包括双面对称的光引擎，其包括面向相反方向的第一和第二发光二极管（LED）器件或平面LED器件阵列，以及包括与双侧对称光引擎隔开并围绕其的荧光体的外壳。 荧光体有效地将由光引擎发射的光转换成发射光。 双侧对称光引擎可以被配置为发射具有双向对称强度分布的光，除了在双边对称光引擎的对称平面的10°内的发射角度下，其均匀。 第一和第二LED器件或平面LED器件阵列中的每一个可以包括至少一个半射发射LED器件，其包括LED芯片和封装LED芯片的密封剂，并且被成形为将由LED芯片发射的光折射成半球形的均匀分布 立体角。

公开(公告)号：US08299701B2

公开(公告)日：2012-10-30

申请号：US12005583

申请日：2007-12-27

Applicant: Boris Kolodin ,  Srinath Aanegola ,  Emil Vergilov Radkov

Inventor： Boris Kolodin ,  Srinath Aanegola ,  Emil Vergilov Radkov

IPC: H01J1/62 ,  H01J63/04

CPC classification number: G02F1/133603 ,  G02F2001/133614 ,  H01J1/63 ,  H01L33/504 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are a lighting device, a backlighting device, and a display device that comprise a radiation source such as LED and wavelength converting members comprising phosphors. In one embodiment, self-absorption within the devices is suppressed or reduced by placing a selective reflector between two wavelength converting members, and the wavelength converting member emitting light with longer peak wavelength is substantially isolated from the irradiation of another wavelength converting member emitting light with shorter peak wavelength. In other embodiments, the wavelength converting members are arranged in strip configuration; or in adjacent hexagons configuration.

Abstract translation: 提供了包括诸如LED的辐射源和包括磷光体的波长转换构件的照明装置，背光装置和显示装置。 在一个实施例中，通过在两个波长转换构件之间放置选择性反射器来抑制或减小器件内的自吸收，并且发射具有较长峰值波长的光的波长转换构件基本上与发射具有 较短的峰值波长。 在其他实施例中，波长转换构件被布置成带状构造; 或相邻的六边形配置。

公开(公告)号：US20120230012A1

公开(公告)日：2012-09-13

申请号：US13424835

申请日：2012-03-20

Applicant: Christopher L. Bohler ,  Boris Kolodin ,  Emil Radkov ,  Srinath K. Aanegola ,  Stanton E. Weaver, JR. ,  James T. Petroski ,  Zena Brown

Inventor： Christopher L. Bohler ,  Boris Kolodin ,  Emil Radkov ,  Srinath K. Aanegola ,  Stanton E. Weaver, JR. ,  James T. Petroski ,  Zena Brown

IPC: F21V29/00 ,  F21V29/02 ,  F21V7/00 ,  F21V9/16 ,  F21V5/04

CPC classification number: B82Y10/00 ,  F21K9/23 ,  F21K9/232 ,  F21K9/61 ,  F21K9/64 ,  F21V3/00 ,  F21V3/02 ,  F21V29/58 ,  F21V29/63 ,  F21V29/70 ,  F21V29/773 ,  F21Y2105/00 ,  F21Y2105/18 ,  F21Y2115/10

Abstract: A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light The enclosure (22) has a shape of a standard incandescent lamp.

Abstract translation: 光源（10）包括光引擎（16），基座（24），电力转换电路（30）和外壳（22）。 光引擎（16）包括设置在平台（14）上的至少一个LED（12）。 平台（14）适于与基座（24）直接配合，该基座（24）是标准的白炽灯泡灯座。 荧光体（44）接收由至少一个LED（12）产生的光并将其转换成可见光。外壳（22）具有标准白炽灯的形状。

公开(公告)号：US07635869B2

公开(公告)日：2009-12-22

申请号：US11520905

申请日：2006-09-14

Applicant: Boris Kolodin ,  Michael Hsing ,  Stanton Earl Weaver, Jr. ,  Ivan Eliashevich ,  Srinath K. Aanegola

Inventor： Boris Kolodin ,  Michael Hsing ,  Stanton Earl Weaver, Jr. ,  Ivan Eliashevich ,  Srinath K. Aanegola

IPC: H01L33/00

CPC classification number: H01L33/483 ,  H01L33/62 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00

Abstract: In a light emitting device, a light emitting chip (12, 112) includes a stack of semiconductor layers (14) and an electrode (24, 141, 142) disposed on the stack of semiconductor layers. A support (10, 10′, 110, 210) has a generally planar surface (30) supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material (40, 41, 141, 142) is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (36, 36′) of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.

Abstract translation: 在发光器件中，发光芯片（12,112）包括堆叠的半导体层（14）和设置在半导体层堆叠上的电极（24,141,142）。 支撑件（10,10'，110,210）具有以倒装芯片方式支撑发光芯片的大致平坦的表面（30）。 导电芯片附接材料（40,41,141,142）凹入到支撑件的大致平坦的表面中，使得附接材料基本不突出在支撑体的大致平坦的表面上方。 附着材料提供发光芯片的电极与支撑体的导电路径（36,36'）之间的电连通。 可选地，至少半导体层的叠层和发光芯片的电极也凹入到支撑体的大致平坦的表面中。

公开(公告)号：US20090155958A1

公开(公告)日：2009-06-18

申请号：US11955787

申请日：2007-12-13

Applicant: Boris Kolodin ,  Xiang Gao ,  Ivan Eliashevich ,  Stanton E. Weaver, JR.

Inventor： Boris Kolodin ,  Xiang Gao ,  Ivan Eliashevich ,  Stanton E. Weaver, JR.

IPC: H01L21/60 ,  B23K1/06

CPC classification number: B23K20/10 ,  B23K20/023 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Systems and methods are provided to mitigate excess die attachment material accrual, and parasitic conductive paths formed thereby. A die attachment material (e.g., solder) is melted using a combination of localized heat sources and ultrasonic energy. The heat sources bring the die attachment material close to its melting point, which reduces an amount of bonding force associated with purely ultrasonic bonding techniques. An ultrasonic transducer brings the die attachment material the rest of the way up to its melting point, which reduces the overall temperature that the die and/or sensitive components thereon endure during the bonding process.

Abstract translation: 提供了系统和方法来减轻多余的芯片附着材料应力，以及由此形成的寄生导电路径。 使用局部热源和超声能量的组合来熔化模具附接材料（例如焊料）。 热源使模具附着材料接近其熔点，这减少了与纯超声波焊接技术相关联的结合力的量。 超声波换能器将模具附接材料的其余部分带到其熔点，这降低了模具和/或其敏感部件在粘合过程中承受的总体温度。