公开(公告)号：US20090052207A1

公开(公告)日：2009-02-26

申请号：US11964492

申请日：2007-12-26

Applicant: Ching-Chung CHEN ,  Yen-Chun Chou

Inventor： Ching-Chung CHEN ,  Yen-Chun Chou

IPC: F21V7/04

CPC classification number: G02B6/001 ,  G02B6/0038 ,  H04N1/02815 ,  H04N1/0286 ,  H04N1/02885 ,  H04N1/02895 ,  H04N1/1017 ,  H04N1/193

Abstract: A light source module of scanning device includes a first light guide rod, a second light guide rod, and a light emitting diode. The first light guide rod has a first incident surface and is disposed at a first end portion. The second light guide rod has a second incident surface and is disposed at a second end portion. The light emitting diode is disposed between the first end portion and the second end portion.

Abstract translation: 扫描装置的光源模块包括第一导光杆，第二导光杆和发光二极管。 第一导光杆具有第一入射面，并设置在第一端部。 第二导光杆具有第二入射面，并设置在第二端部。 发光二极管设置在第一端部和第二端部之间。

公开(公告)号：US20070001181A1

公开(公告)日：2007-01-04

申请号：US11161363

申请日：2005-08-01

Applicant: Ching-Chung Chen

Inventor： Ching-Chung Chen

IPC: H01L33/00 ,  H01L21/00

CPC classification number: H01L33/44 ,  H01L33/641 ,  H01L2933/0091

Abstract: A light emitting diode comprising a semiconductor layer, a first electrode, a second electrode and a diamond-like carbon layer is provided. The semiconductor layer includes a first type doped semiconductor layer, a light emitting layer and a second type doped semiconductor layer. Wherein, the light emitting layer locates between the first type doped semiconductor layer and the second type doped semiconductor layer. The first electrode is electrically connected to the first type doped semiconductor layer. The second electrode is electrically connected to the second type doped semiconductor layer. The diamond-like carbon layer covers on the semiconductor layer and exposes at least a portion of the first electrode. Moreover, the exposed outer surface of the diamond-like carbon layer is a rough surface. Alternatively, other passivation layer with rough surface can be substituted for the diamond-like carbon layer.

Abstract translation: 提供了包括半导体层，第一电极，第二电极和类金刚石碳层的发光二极管。 半导体层包括第一掺杂半导体层，发光层和第二掺杂半导体层。 其中，发光层位于第一掺杂半导体层和第二掺杂半导体层之间。 第一电极电连接到第一类型的掺杂半导体层。 第二电极电连接到第二类型掺杂半导体层。 类金刚石碳层覆盖在半导体层上并暴露第一电极的至少一部分。 此外，金刚石状碳层的露出的外表面是粗糙的表面。 或者，具有粗糙表面的其它钝化层可以代替类金刚石碳层。

公开(公告)号：US20060278884A1

公开(公告)日：2006-12-14

申请号：US11148606

申请日：2005-06-08

Applicant: Ching-Chung Chen

Inventor： Ching-Chung Chen

IPC: H01L29/22

CPC classification number: H01L33/0079 ,  H01L21/6835 ,  H01L24/27 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2224/06102 ,  H01L2224/274 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/12041

Abstract: A substrate-free LED device is provided. The LED device comprises a substrate, an epitaxial layer disposed on the substrate, a first electrode disposed on a portion of the epitaxial layer, a second electrode disposed on another portion of the epitaxial layer, and a protection layer, disposed over the epitaxial layer. It is noted that in the LED device, the substrate comprises, for example but not limited to, high heat-sink substrate, and the protection layer comprises, for example but not limited to, high heat-sink, high transparent material.

Abstract translation: 提供了一种无基板的LED器件。 LED器件包括衬底，设置在衬底上的外延层，设置在外延层的一部分上的第一电极，设置在外延层的另一部分上的第二电极以及设置在外延层上的保护层。 注意，在LED器件中，衬底包括例如但不限于高散热衬底，并且保护层包括例如但不限于高散热器，高透明材料。

公开(公告)号：US06566160B2

公开(公告)日：2003-05-20

申请号：US09885044

申请日：2001-06-21

Applicant: Cheng-Pang Yeh ,  Ching-Chung Chen

Inventor： Cheng-Pang Yeh ,  Ching-Chung Chen

IPC: H01L2100

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14643 ,  H01L27/14687

Abstract: The present invention provides a method for increasing adhesion of color filters and preventing cross talk effects on a semiconductor wafer. The method first involves forming a dielectric layer on the semiconductor wafer, which covers each MOS transistor sensor formed on the surface of the semiconductor wafer. Then, a plurality of metal layers are formed on the dielectric layer, each two metal layers positioned approximately above two ends of one MOS transistor sensor. Next, a passivation layer is formed, followed by the formation of a first color filter on the passivation layer. The two ends of the first color filter are aligned approximately above the two metal layers. Thereafter, a second color filter and a third color filter are sequentially formed on the passivation layer, and portions of both the second color filter and the third color filter cover one end of the first color filter. The portions of each color filter covering one other are used to enhance adhesion of the color filters, and simultaneously to function as barriers to prevent cross talk effects.

公开(公告)号：US10936028B2

公开(公告)日：2021-03-02

申请号：US15854828

申请日：2017-12-27

Applicant: Chih-Chin Chien ,  I-Feng Hsu ,  Ching-Chung Chen ,  Tse-Yang Lin ,  Tse-An Chu ,  Ching-Ya Tu ,  Chang-Yuan Wu ,  Hao-Wu Yang ,  Huan-Yang Yeh ,  Chin-Hsien Chang ,  Chin-Yuan Chuang ,  Chia-Hung Lin

Inventor： Chih-Chin Chien ,  I-Feng Hsu ,  Ching-Chung Chen ,  Tse-Yang Lin ,  Tse-An Chu ,  Ching-Ya Tu ,  Chang-Yuan Wu ,  Hao-Wu Yang ,  Huan-Yang Yeh ,  Chin-Hsien Chang ,  Chin-Yuan Chuang ,  Chia-Hung Lin

IPC: G06F1/20 ,  H05K7/20 ,  H05K5/00 ,  F04D27/00 ,  F04D25/08

Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.

公开(公告)号：US08716734B2

公开(公告)日：2014-05-06

申请号：US13336010

申请日：2011-12-23

Applicant: Ming-Ta Tsai ,  Ching-Chung Chen

Inventor： Ming-Ta Tsai ,  Ching-Chung Chen

IPC: H01L33/38 ,  H01L33/48

CPC classification number: H01L33/385 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package includes a substrate, an electrode layer, a light-emitting chip, a reflection cup and an encapsulation. The substrate includes a first surface, an opposite second surface, and two side surfaces. The electrode layer is consisted of a positive electrode and a negative electrode, each of which extends from the first surface to the second surface via a respective side surface. The light-emitting chip is located on the first surface of the substrate and electrically connected to the electrode layer. The reflection cup comprises a first part covering the electrode layer on the side surfaces of the substrate, a second part with a bowl-like shape on the first surface of the substrate and surrounding the light-emitting chip. The encapsulation is filled in the second part of the reflection cup.

Abstract translation: LED封装包括衬底，电极层，发光芯片，反射杯和封装。 基板包括第一表面，相对的第二表面和两个侧表面。 电极层由正电极和负电极构成，每个电极通过相应的侧表面从第一表面延伸到第二表面。 发光芯片位于基板的第一表面上并电连接到电极层。 反射杯包括在基板的侧表面上覆盖电极层的第一部分，在基板的第一表面上具有碗状形状的第二部分并且围绕发光芯片。 封装填充在反射杯的第二部分中。

公开(公告)号：US20120075882A1

公开(公告)日：2012-03-29

申请号：US13209446

申请日：2011-08-15

Applicant: JIAN-SHIHN TSANG ,  CHING-CHUNG CHEN ,  YA-WEN LIN

Inventor： JIAN-SHIHN TSANG ,  CHING-CHUNG CHEN ,  YA-WEN LIN

IPC: F21V7/22 ,  F21V9/16

CPC classification number: G02B6/005

Abstract: An LED module includes an LED and a light-guiding board. The light-guiding board includes a light-incident face facing the LED, a light-emergent face, a light-reflecting face opposite to the light-emergent face, and a light-converting layer containing phosphors therein. Light emitted from the LED sequentially moves the light-incident face, the light-converting layer and the light-emergent face to leave the light-guiding board. The light-converting layer has a uniform thickness.

Abstract translation: LED模块包括LED和导光板。 导光板包括面向LED的光入射面，发光面，与发光面相对的光反射面，以及含有荧光体的光转换层。 从LED发射的光依次移动光入射面，光转换层和光出射面离开导光板。 光转换层具有均匀的厚度。

公开(公告)号：US20100258283A1

公开(公告)日：2010-10-14

申请号：US12757057

申请日：2010-04-09

Applicant: Ching-Chung Chen ,  Ifeng Hsu ,  Chang-Yuan Wu ,  Jenq-Haur Pan

Inventor： Ching-Chung Chen ,  Ifeng Hsu ,  Chang-Yuan Wu ,  Jenq-Haur Pan

IPC: H01L23/467

CPC classification number: H05K7/20145 ,  G06F1/203

Abstract: An electronic device includes a housing, a module, a main board, and a fan. The module, the main board and the fan are all installed in the housing. The main board divides the interior of the housing into a first space and a second space, and there exists a channel opening between the main board and the module so as to communicate the first space with the second space. The fan is electrically connected to the main board, has a fan outlet and is capable of outputting airflow through the fan outlet to the outside of the housing.

Abstract translation: 电子设备包括壳体，模块，主板和风扇。 模块，主板和风扇都安装在外壳中。 主板将壳体的内部分成第一空间和第二空间，并且在主板和模块之间存在通道开口，以将第一空间与第二空间连通。 风扇电连接到主板，具有风扇出口，并且能够将通过风扇出口的气流输出到壳体的外部。

公开(公告)号：USD531343S1

公开(公告)日：2006-10-31

申请号：US29200804

申请日：2004-03-05

Applicant: Ching-Chung Chen

Designer： Ching-Chung Chen

公开(公告)号：US09226427B2

公开(公告)日：2015-12-29

申请号：US13710475

申请日：2012-12-11

Applicant: Chung-Luen Liu ,  Jenq-Haur Pan ,  Chang-Yuan Wu ,  Ching-Ya Tu ,  Ching-Chung Chen

Inventor： Chung-Luen Liu ,  Jenq-Haur Pan ,  Chang-Yuan Wu ,  Ching-Ya Tu ,  Ching-Chung Chen

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16 ,  H01L23/473

CPC classification number: H05K7/20145 ,  G06F1/1632 ,  G06F1/20

Abstract: A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.

Abstract translation: 适用于便携式电子设备的坞站包括基座，支撑部件和第一风扇。 基座包括气流引导斜面。 支撑部件设置在基座上并具有气流引导结构，其中便携式电子设备被配置为支撑在支撑部件上。 第一风扇设置在基座中并且提供冷却气流，其中气流引导斜面和气流引导结构引导冷却气流流入便携式电子设备。