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    Method for electrochemically forming structures including non-parallel mating of contact masks and substrates
    21.
    发明申请
    Method for electrochemically forming structures including non-parallel mating of contact masks and substrates 有权
    用于电化学形成结构的方法，包括接触掩模和基底的非平行配合

    公开(公告)号：US20040182716A1

    公开(公告)日：2004-09-23

    申请号：US10724515

    申请日：2003-11-26

    Applicant: Microfabrica Inc.

    Inventor： Adam L. Cohen ,  Dennis R. Smalley

    IPC: C25D005/02

    CPC classification number: B81C1/00126 ,  B33Y10/00 ,  B81C2201/019

    Abstract: Treatment of substrates, formation of structures, and formation of multilayer structures using contact masks are disclosed where a non-parallel or non-simultaneous mating of various mask contact surfaces to a substrate surface occurs. Some embodiments involve bringing a relative planar mask contact surface and a relative planar substrate surface together at a small angle (but larger than an alignment tolerance associated with the system). Some embodiments involve flexing a mask to make it non-planar and bringing it into contact with a substrate such that progressively more contact between the mask and substrate occur until complete mating is achieved. Some embodiments involve use of gas or liquid pressure to bow a flexible or semi-flexible mask and use a linear actuator to bring the mating surfaces together and to bring the mask into a more planar configuration.

    Abstract translation: 公开了基板的处理，结构的形成和使用接触掩模的多层结构的形成，其中发生各种掩模接触表面与基板表面的非平行或非同时的配合。 一些实施例涉及将相对平面的掩模接触表面和相对平面的基板表面以小角度（但大于与系统相关联的对准公差）组合在一起。 一些实施例涉及弯曲掩模以使其非平面并使其与基底接触，使得在掩模和基底之间逐渐更多的接触发生直到完成配合。 一些实施例涉及使用气体或液体压力来弯曲柔性或半柔性掩模，并且使用线性致动器将配合表面合在一起并使掩模进入更平面的构型。

    Non-conformable masks and methods and apparatus for forming three-dimensional structures
    22.
    发明申请
    Non-conformable masks and methods and apparatus for forming three-dimensional structures 有权
    用于形成三维结构的不合格掩模和方法和装置

    公开(公告)号：US20040147124A1

    公开(公告)日：2004-07-29

    申请号：US10724513

    申请日：2003-11-26

    Applicant: Microfabrica Inc.

    Inventor： Adam L. Cohen ,  Dennis R. Smalley

    IPC: H01L021/302 ,  H01L021/461

    CPC classification number: B81C1/00182 ,  B33Y10/00

    Abstract: Electrochemical Fabrication techniques are used to modify substrates or to form multilayer structures (e.g. components or devices) from a plurality of overlaying and adhered layers. Masks are used to selectively etch or deposit material. Some masks may be of the contact type and may be formed of multiple materials some of which may be support materials, some of which may be mating materials for contacting a substrate and some may be intermediate materials. In some embodiments the contact masks may have conformable contact surfaces (i.e. surfaces with sufficient flexibility or deformability that they can substantially conform to surface of the substrate to form a seal with it) or they may have semi-rigid or even rigid surfaces. In embodiments where masks are used for selective deposition operations, etching operations may be performed after deposition to remove flash deposits (thin undesired deposits from areas that were intended to be masked).

    Abstract translation: 电化学制造技术用于修饰衬底或从多个覆盖和粘附层形成多层结构（例如组件或器件）。 掩模用于选择性地蚀刻或沉积材料。 一些掩模可以是接触型并且可以由多种材料形成，其中一些可以是支撑材料，其中一些可以是用于接触基底的配合材料，一些可以是中间材料。 在一些实施例中，接触掩模可以具有适形的接触表面（即具有足够的柔性或可变形性的表面，使得它们可以基本上符合基底的表面以与其形成密封），或者它们可以具有半刚性或甚至刚性的表面。 在掩模用于选择性沉积操作的实施例中，可以在沉积之后执行蚀刻操作以去除闪蒸沉积物（来自旨在被掩蔽的区域的不希望的沉积物）。

    EFAB methods and apparatus including spray metal or powder coating processes
    23.
    发明申请
    EFAB methods and apparatus including spray metal or powder coating processes 审中-公开
    EFAB方法和设备，包括喷涂金属或粉末涂层工艺

    公开(公告)号：US20040146650A1

    公开(公告)日：2004-07-29

    申请号：US10697597

    申请日：2003-10-29

    Applicant: Microfabrica Inc.

    Inventor： Michael S. Lockard ,  Adam L. Cohen ,  Roger W. Barton

    IPC: B05D001/36 ,  B05D003/10

    CPC classification number: C23C4/02 ,  C25D1/00 ,  C25D1/003

    Abstract: Various embodiments of the invention present techniques for forming structures via a combined electrochemical fabrication process and a thermal spraying process or powder deposition processes. In a first set of embodiments, selective deposition occurs via masking processes (e.g. a contact masking process or adhered mask process) and thermal spraying or powder deposition is used in blanket deposition processes to fill in voids left by selective deposition processes. In a second set of embodiments, after selective deposition of a first material, a second material is blanket deposited to fill in the voids, the two depositions are planarized to a common level and then a portion of the first or second materials is removed (e.g. by etching) and a third material is sprayed into the voids left by the etching operation. In both embodiments the resulting depositions are planarized to a desired layer thickness in preparation for adding additional layers.

    Abstract translation: 本发明的各种实施例提出了通过组合的电化学制造工艺和热喷涂工艺或粉末沉积工艺形成结构的技术。 在第一组实施例中，通过掩模工艺（例如接触掩模工艺或粘附的掩模工艺）进行选择性沉积，并且在覆盖沉积工艺中使用热喷涂或粉末沉积来填充通过选择性沉积工艺留下的空隙。 在第二组实施例中，在选择性沉积第一材料之后，第二材料被覆盖沉积以填充空隙，将两个沉积物平坦化到共同的水平，然后去除第一或第二材料的一部分（例如 通过蚀刻），并且通过蚀刻操作将第三材料喷射到留下的空隙中。 在两个实施方案中，将所得沉积物平坦化至所需的层厚度，以准备添加另外的层。

    Compliant pin probes with extension springs, methods for making, and methods for using
    24.
    发明授权
    Compliant pin probes with extension springs, methods for making, and methods for using 有权

    公开(公告)号：US12078657B2

    公开(公告)日：2024-09-03

    申请号：US17854756

    申请日：2022-06-30

    Applicant: Microfabrica Inc.

    Inventor： Ming Ting Wu ,  Arun S. Veeramani

    IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00

    CPC classification number: G01R1/06722 ,  G01R1/06738 ,  G01R1/0735 ,  G01R3/00

    Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat extension spring segment and wherein in some embodiments the probes also provide: (1) narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements, and/or (2) ratcheting elements on probe arms and/or frame elements to allow permanent or semi-permanent transition from a build state or initial state to a working state or pre-biased state.

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