Abstract:
Provided is a semiconductor device capable of controlling an on-die-termination (ODT) circuit and an off-chip-driver (OCD) circuit and a control method used by the semiconductor device. The semiconductor device includes a control code generation unit generating a control code in response to a control signal, an addition unit adding an adjustment code to the control code to produce an adjusted control code, and an ODT circuit, wherein an impedance of the ODT circuit is adjusted in response to the adjusted control code. The semiconductor device can adjust the control code more precisely by adding or subtracting the adjustment code to or from the control code. Accordingly, the impedance of an OCD circuit or ODT circuit can be adjusted more precisely.
Abstract:
We describe an input buffer having a stabilized operating point and an associated method. An input buffer may include a first differential amplifying unit to generate a first output signal having a first operating point and a second differential amplifying unit to generate a second output signal having a second operating point. An output control circuit varies respective weights of the first and second output signals responsive to an output control signal. The first differential amplifying unit may operate responsive to a reference voltage and an input voltage signal. The second differential amplifying unit may operate responsive to the reference voltage and the input voltage signal. The first operating point may be relatively higher than the second operating point.
Abstract:
Disclosed is a method for forming an aluminum oxide film of a large surface area on an electrode for a high voltage electrolytic capacitor. In accordance with the method, an oxide film of a uniform thickness is formed, prior to a process of etching the oxide film. A re-anodization is then partially conducted for an etched portion of the oxide film. The resultant oxide film has an increased surface area. The method of the invention makes it possible to prepare a dielectric oxide film having characteristics of a uniform thickness and a large surface area. In accordance with the invention, it is possible to expect an increase in the capacitance of electrolytic capacitors.
Abstract:
A method of forming an insulation film by alternating multiple times, respectively, a process of adsorbing a precursor onto a substrate and a process of treating the adsorbed surface using reactant gas and a plasma, wherein a plasma is applied in the process of supplying the precursor.
Abstract:
A Dynamic Voltage and Frequency Scaling (DVFS) method, comprising of a scheduling execution of DVFS to adjust frequency or voltage of a target device at a first scheduled time; monitoring operating frequency of the target device; and selectively deferring execution of DVFS at a later scheduled time based on the operating frequency of the target device; wherein execution of DVFS at a next scheduled time is deferred when the operating frequency of the target device is below a given minimum frequency.
Abstract:
A resist underlayer composition includes a solvent, and an organosilane condensation polymerization product of: a compound represented by the following Chemical Formula 1, a compound represented by the following Chemical Formula 2, and a compound represented by the following Chemical Formula 3, [R1O]3Si—X [Chemical Formula 1] [R2O]3Si—R3 [Chemical Formula 2] [R4O]3Si—Si[OR5]3. [Chemical Formula 3]
Abstract:
A resist underlayer composition, including a solvent, and an organosilane condensation polymerization product of hydrolyzed products produced from a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, and a compound represented by Chemical Formula 3.
Abstract:
A photoresist underlayer composition includes a solvent, and a polysiloxane resin represented by Chemical Formula 1: {(SiO1.5—Y—SiO1.5)x(SiO2)y(XSiO1.5)z}(OH)e(OR1)f. [Chemical Formula 1]
Abstract:
In one embodiment, the memory device includes a memory cell array, a data line selection circuit and selection control logic. The memory cell array has at least a first memory cell group and a redundancy memory cell group. The first memory cell group includes a plurality of first memory cells associated with a first data line, and the redundancy memory cell group includes a plurality of redundancy memory cells associated with a redundancy data line. The selection control logic is configured to detect if a defective memory cell in the first memory cell group is being accessed, and is configured to control the data line selection circuit to replace access via the first data line with access via the redundancy data line such that a detected defective memory cell in the first memory cell group is replaced with one of the plurality of redundancy memory cells.