公开(公告)号：US20080288441A1

公开(公告)日：2008-11-20

申请号：US11741923

申请日：2007-04-30

Applicant: JIN WON LEE ,  YOUNG KI LEE ,  SEUNG WOO KANG ,  SANG JEONG LEE ,  HYUN JU JIN ,  BYUNG JIP KIM ,  JUNE HWA SONG

Inventor： JIN WON LEE ,  YOUNG KI LEE ,  SEUNG WOO KANG ,  SANG JEONG LEE ,  HYUN JU JIN ,  BYUNG JIP KIM ,  JUNE HWA SONG

IPC: G06F17/30

CPC classification number: G06F17/30675

Abstract: The present invention relates to a processing method of data stream using Border Monitoring Query, and more particularly a monitoring method and a system for data streams which are a large volume of data and continuously generated such as financial ticker, GPS data or a ubiquitous sensor network (USN).The objectives of the present invention are to process a large number of BMQs over data streams in high-performance and scalable manner. For this purpose, the invention presents BMQ-Index, a scalable and high performance data stream monitoring framework. The main idea of BMQ-Index is shared and incremental processing. For shared processing, BMQ-Index adopts a query indexing approach, thereby achieving a high level of scalability. Once BMQ-Index is built on registered queries, only relevant queries are quickly searched for upon an incoming data. For incremental processing, BMQ-Index employs an incremental access method, i.e., an index structure to store delta query information and an incremental search algorithm. Thus, successive BMQ evaluations are greatly accelerated.

Abstract translation: 本发明涉及使用边界监视查询的数据流的处理方法，更具体地说，涉及一种数据流的监视方法和系统，该数据流是大量的数据并连续生成的，例如金融报价单，GPS数据或普遍存在的传感器网络 （USN）。 本发明的目标是以高性能和可扩展的方式处理数据流上的大量BMQ。 为此，本发明提出了可扩展和高性能的数据流监测框架BMQ-Index。 BMQ-Index的主要思想是共享和增量处理。 对于共享处理，BMQ-Index采用查询索引方式，从而实现了高度的可扩展性。 一旦BMQ-Index建立在注册查询上，只有在输入数据时快速搜索相关查询。 对于增量处理，BMQ-Index使用增量访问方法，即用于存储增量查询信息和增量搜索算法的索引结构。 因此，连续的BMQ评估大大加快。

公开(公告)号：US20070288649A1

公开(公告)日：2007-12-13

申请号：US11734399

申请日：2007-04-12

Applicant: June-Hwa Song ,  Seung-Woo Kang ,  Young-Ki Lee ,  Sung-Hwan Ihm ,  Soun-Eil Park ,  Jae-Sun Han ,  Su-Myeon Kim

Inventor： June-Hwa Song ,  Seung-Woo Kang ,  Young-Ki Lee ,  Sung-Hwan Ihm ,  Soun-Eil Park ,  Jae-Sun Han ,  Su-Myeon Kim

IPC: G06F15/16 ,  H04L12/02

CPC classification number: G06F17/30516

Abstract: Methods and systems of processing a data stream are disclosed. A developer may develop a service only by programming a Service Unit (SU) including a service logic (SL) and including a Service Unit Description Language (SUDL) file, so that the developer may not need to program complicated stream processing code, such as stream source connection code, network input/output (I/O) code, and buffering code. In addition, the stream source connected dynamically to the service and a service execution mode (such as push and pull modes) may be converted by simply changing setting files based on the service model. The system includes modules for managing and processing the stream in reality, such as stream source connection modules, network I/O processing modules, and stream buffering modules, the modules operating the developed program through the service model.

Abstract translation: 公开了处理数据流的方法和系统。 开发者可以仅通过编程包括服务逻辑（SL）并且包括服务单元描述语言（SUDL）文件的服务单元（SU）来开发服务，使得开发者可能不需要编程复杂的流处理代码，例如 流源连接代码，网络输入/输出（I / O）代码和缓冲代码。 此外，可以通过基于服务模型简单地改变设置文件来转换动态地连接到服务的流源和服务执行模式（例如推拉模式）。 该系统包括用于在现实中管理和处理流的模块，例如流源连接模块，网络I / O处理模块和流缓冲模块，模块通过服务模型运行开发的程序。

公开(公告)号：US20070221928A1

公开(公告)日：2007-09-27

申请号：US11717154

申请日：2007-03-13

Applicant: Young Ki Lee ,  Seon Goo Lee ,  Seog Moon Choi ,  Sang Hyun Shin

Inventor： Young Ki Lee ,  Seon Goo Lee ,  Seog Moon Choi ,  Sang Hyun Shin

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01078 ,  H01L2924/00014

Abstract: A light emitting diode package which is superior in heat radiation and easily manufacturable. In the light emitting diode package, an Al substrate has a reflective cup formed thereon. At least one light emitting diode chip is disposed on a bottom surface of the reflective cup. An Al anodized film extends through the Al substrate to divide the bottom surface of the reflective cup into a plurality of substrate electrodes. Here, at least one of the substrate electrodes is surrounded by the Al anodized film. Also, the substrate electrodes are connected to a light emitting diode chip, respectively.

Abstract translation: 发光二极管封装，散热优良，易于制造。 在发光二极管封装中，Al衬底上形成有反射杯。 至少一个发光二极管芯片设置在反射杯的底表面上。 Al阳极氧化膜延伸穿过Al衬底，以将反射杯的底表面分成多个衬底电极。 这里，至少一个基板电极被Al阳极氧化膜包围。 此外，基板电极分别连接到发光二极管芯片。

公开(公告)号：US20070217221A1

公开(公告)日：2007-09-20

申请号：US11723059

申请日：2007-03-16

Applicant: Young Ki Lee ,  Seog Moon Choi ,  Young Bok Yoon ,  Sang Hyun Shin

Inventor： Young Ki Lee ,  Seog Moon Choi ,  Young Bok Yoon ,  Sang Hyun Shin

IPC: F21V7/04

CPC classification number: H05K1/053 ,  F21K9/00 ,  F21V29/76 ,  F21V29/89 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/0347 ,  H05K2201/10106 ,  H05K2203/0315 ,  H01L2924/00

Abstract: An anodized metal substrate module superior in heat radiation properties and reduced in manufacturing costs. A metal plate is provided. An anodized film is formed on the metal plate. A heat generating device is mounted on the metal plate. Also, a conductive line is formed on the anodized film.

Abstract translation: 阳极氧化金属基板模块，其散热性能优异，制造成本降低。 提供金属板。 阳极氧化膜形成在金属板上。 发热装置安装在金属板上。 此外，在阳极氧化膜上形成导线。

公开(公告)号：US08941220B2

公开(公告)日：2015-01-27

申请号：US13484160

申请日：2012-05-30

Applicant: Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

Inventor： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

IPC: H01L23/495 ,  H01L23/433 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/4334 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

Abstract translation: 本文公开了一种功率模块封装，包括：第一衬底，其上安装有第一半导体芯片; 以及具有安装在其上的第二半导体芯片的第二基板，所述第二基板与所述第一基板结合，使得其厚度方向的侧表面设置在所述第一基板的上表面上。

公开(公告)号：US08754517B2

公开(公告)日：2014-06-17

申请号：US13532362

申请日：2012-06-25

Applicant: Kwang Soo Kim ,  Young Ki Lee ,  Ji Hyun Park ,  Bum Seok Suh

Inventor： Kwang Soo Kim ,  Young Ki Lee ,  Ji Hyun Park ,  Bum Seok Suh

IPC: H01L23/48

CPC classification number: H01L23/3735 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4985 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed herein is a double side cooling power semiconductor module including: a first cooler having a concave part formed in one surface thereof in a thickness direction; a first semiconductor chip mounted on the concave part of the first cooler; a second cooler having one surface and the other surface and formed on one surface of the first cooler so that one surface thereof contacts the first semiconductor chip; a circuit board formed on the other surface of the second cooler; a second semiconductor chip mounted on the circuit board; and a flexible substrate having a circuit layer electrically connecting the first and second semiconductor chips to each other.

Abstract translation: 本发明公开了一种双面冷却功率半导体模块，包括：第一冷却器，其厚度方向在其一个表面上形成有凹部; 安装在第一冷却器的凹部上的第一半导体芯片; 第二冷却器，其具有一个表面和另一个表面，并形成在第一冷却器的一个表面上，使得其一个表面接触第一半导体芯片; 形成在所述第二冷却器的另一个表面上的电路板; 安装在所述电路板上的第二半导体芯片; 以及具有将第一和第二半导体芯片彼此电连接的电路层的柔性基板。

公开(公告)号：US08664755B2

公开(公告)日：2014-03-04

申请号：US13247603

申请日：2011-09-28

Applicant: Chang Hyun Lim ,  Young Ki Lee ,  Kwang Soo Kim ,  Seog Moon Choi

Inventor： Chang Hyun Lim ,  Young Ki Lee ,  Kwang Soo Kim ,  Seog Moon Choi

IPC: H01L23/495 ,  H01L21/00

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/291 ,  H01L2224/29187 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.

Abstract translation: 本文公开了一种功率模块封装，包括：第一基板; 第二基板，其具有用于连接到其一个表面的一侧或两侧上的第一基板的焊盘，并且具有用于连接到形成在其另一个表面上的外部的外部连接端子; 以及引线框架，其一端接合到第一基板，另一端接合到第二基板的焊盘，从而将第一和第二基板彼此垂直连接。

公开(公告)号：US08629538B2

公开(公告)日：2014-01-14

申请号：US13316072

申请日：2011-12-09

Applicant: Young Ki Lee ,  Young Ho Sohn ,  Kwang Soo Kim ,  Chang Hyun Lim

Inventor： Young Ki Lee ,  Young Ho Sohn ,  Kwang Soo Kim ,  Chang Hyun Lim

IPC: H01L23/495

CPC classification number: H01L23/4334 ,  H01L23/3107 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one side of one surface of the first substrate; and a first lead frame contacting the other side of one surface of the first substrate. The power module package further includes: a first metal layer formed on one side of one surface of the first substrate; a first bonding layer formed on the first metal layer and contacting a lower surface of the second substrate; a second metal layer formed on the other side of one surface of the first substrate; and a second bonding layer formed on the second metal layer and contacting a lower surface of the first lead frame.

Abstract translation: 本文公开了一种功率模块封装，包括：具有一个表面和另一个表面的第一基板; 第二基板，其接触所述第一基板的一个表面的一侧; 以及与第一基板的一个表面的另一侧接触的第一引线框架。 功率模块封装还包括：形成在第一衬底的一个表面的一侧上的第一金属层; 第一接合层，形成在所述第一金属层上并与所述第二基板的下表面接触; 形成在所述第一基板的一个表面的另一侧上的第二金属层; 以及形成在所述第二金属层上并与所述第一引线框架的下表面接触的第二接合层。

公开(公告)号：US08624123B2

公开(公告)日：2014-01-07

申请号：US13102323

申请日：2011-05-06

Applicant: Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

Inventor： Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

IPC: H05K1/00 ,  H05K7/20

CPC classification number: H05K7/205 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K3/0061 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0323 ,  H01L2924/00

Abstract: The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist.

Abstract translation: 印刷电路板技术领域本发明涉及印刷电路板。 将辐射涂层材料施加到形成在印刷电路板的最外部的电路层的一部分，从而可以提高印刷电路板的散热性能。 散热涂层材料也用作阻焊剂，从而可以在没有单独的阻焊剂的情况下绝缘和保护印刷电路板。

公开(公告)号：US20130270687A1

公开(公告)日：2013-10-17

申请号：US13532362

申请日：2012-06-25

Applicant: Kwang Soo Kim ,  Young Ki Lee ,  Ji Hyun Park ,  Bum Seok Suh

Inventor： Kwang Soo Kim ,  Young Ki Lee ,  Ji Hyun Park ,  Bum Seok Suh

IPC: H01L23/34

CPC classification number: H01L23/3735 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4985 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed herein is a double side cooling power semiconductor module including: a first cooler having a concave part formed in one surface thereof in a thickness direction; a first semiconductor chip mounted on the concave part of the first cooler; a second cooler having one surface and the other surface and formed on one surface of the first cooler so that one surface thereof contacts the first semiconductor chip; a circuit board formed on the other surface of the second cooler; a second semiconductor chip mounted on the circuit board; and a flexible substrate having a circuit layer electrically connecting the first and second semiconductor chips to each other.

Abstract translation: 本发明公开了一种双面冷却功率半导体模块，包括：第一冷却器，其厚度方向在其一个表面上形成有凹部; 安装在第一冷却器的凹部上的第一半导体芯片; 第二冷却器，具有一个表面和另一个表面，并形成在第一冷却器的一个表面上，使得其一个表面接触第一半导体芯片; 形成在所述第二冷却器的另一个表面上的电路板; 安装在所述电路板上的第二半导体芯片; 以及具有将第一和第二半导体芯片彼此电连接的电路层的柔性基板。