摘要:
A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.
摘要:
A cylindrical surface (3) is roughed to be prepared for a spray film (11) to be formed thereon, by cutting therein rough undulations (21) in a threaded form, using a cut chip (20) leaving a groove part (21a) of a respective undulation (21) in a preset direction or cut form, for breaking or partially tearing off a ridge part (21b) of the rough undulation (21) to have a remainder of the ridge part (21b) formed with finer undulations (22).
摘要:
In order to acquire typical X-ray spectra by dividing automatically dividing contained matter and regions where the density thereof differs into groups in X-ray mapping analysis, measurement starts with the spectra database empty, a designated location within the sample is irradiated with a primary beam by the primary beam control means, the sample is irradiated with the primary beam for a fixed period of time in order to acquire a measurement spectrum, the X-ray spectrum obtained through measurement and X-ray spectra in the spectra database are compared by the X-ray comparison means, the X-ray spectrum obtained through measurement is added to the database when no matching X-ray spectra exists in the database, and measurement is repeated at a designated measurement point.
摘要:
A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.
摘要:
A magnetic head device exhibiting optimum floating characteristics without the risk of fracturing a first rail, and a manufacturing method for the magnetic head device. In this magnetic head device, the first rail is formed on a surface of a first head chip facing a disc-shaped recording medium for extending parallel to the running direction of the disc-shaped recording medium, and a second rail is formed for extending parallel to the first rail. The first rail is formed by grooving the center slider side of the first head chip.
摘要:
A microprocessor incorporating a PLL circuit using a clock pulse having a relatively low frequency as an input clock signal of a reference frequency to form an oscillating pulse of a relatively high frequency by multiplying the input clock signal. In the microprocessor, the operation of the PLL circuit is stopped in the low-speed mode to supply the clock pulse of the relatively low frequency to the microprocessor as a system clock signal, and, in the high-speed mode, the PLL circuit is activated upon reception of an event requiring high-speed processing. Until the operation of the PLL circuit is stabilized and the request for high-speed processing comes, the above-mentioned clock pulse having the relatively low frequency is kept supplied continuously to the microprocessor as the system clock signal. This novel setup permits the high-speed switching of the microprocessor from the operating mode to the high-speed operating mode. Accordingly, the microprocessor may be kept operating until the output frequency of the PLL circuit is stabilized, thereby allowing the microprocessor to cope with an unpredictable situation such as the occurrence of a priority event or a failure.
摘要:
A tapped hole measuring apparatus available for automatically measuring the major diameter, minor diameter, effective diameter and depth of a tapped hole. The apparatus comprises a measuring stylus with at least two air discharging ports which can take inserting movement into the tapped hole. The apparatus separately measures the variations of the back pressures of air supplied to the air discharging ports, and converts the back pressure variations into electric signals and stores them. Also included in the apparatus is a configuration calculating section for comparing the variation of the electric signal from the tapped hole with a variation of electric signal from a reference tapped hole to obtain the configurational dimensions of the tapped hole being measured.
摘要:
A programmable controller is disclosed that incorporates a sequence control program adapted to input and output information to a variety of local intelligent appliances at a high velocity and a high efficiency in the field of factory automation for efficiently controlling factory production lines or the field of process automation for controlling multiple industrial processes. Provided for this purpose is an improved a change-over system associated with a 1-bit processor and an ordinary processor for executing the sequence control program. Also improved are functions for a user to particularly specify a BASIC program, software/hardware control functions for a group of I/O boards for transferring signals to receiving signals from the local appliances, and the ability to program the internally stored sequence control program.
摘要:
A boring cutter body (5) is inserted into a circular hole (3) and is rotated and moved in an axial direction, whereby screw-shaped groove parts (11) are formed by using a tool bit (9) provided on a tip end of an outer peripheral portion, and broken surfaces (15) are formed by breaking tips of ridge parts generated by formation of the groove parts (11). Moreover, the groove parts (11) are processed through electric discharge machining using a wire electrode (17) provided to the boring cutter body (5) behind the tool bit (9) in the rotating direction, thereby forming finely roughened portions (41) having more finely roughened shapes than the broken surfaces (15).
摘要:
A cylindrical internal surface processing method comprises forming a cylinder bore, roughening an upper section of the bore, depositing coating onto the bore, and machining a lower section of the bore and the coating. The forming of the cylinder bore includes forming the upper and lower sections with the lower section being axially spaced from the upper section and having an axial length greater than zero. The roughening creates a roughened surface such that a radially innermost edge of the roughened surface has an internal diameter smaller than an internal diameter of the lower section. The coating is deposited to cover the upper section and at least a portion of the lower section. The machining forms a tapered portion and a cylindrical portion, a radially outermost edge of the cylindrical portion having an internal diameter larger than that of a radially outermost edge of the roughened surface.