公开(公告)号：US20100038116A1

公开(公告)日：2010-02-18

申请号：US12389521

申请日：2009-02-20

Applicant: CHUNG-JEN TSAI ,  CHIA-CHENG CHEN ,  HUNG-YI CHANG ,  TUNG-YAO KUO ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  CHIA-CHENG CHEN ,  HUNG-YI CHANG ,  TUNG-YAO KUO ,  CHENG-HSIEN LIN

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/46 ,  C25D5/16

CPC classification number: H05K1/0271 ,  H05K3/243 ,  H05K2201/09136 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/2009

Abstract: A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.

Abstract translation: 印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。 铜层在其给定部分包括多个电迹线。 加强层的厚度在远离给定部分的方向上增加。 在本公开中还提供了制造印刷电路板的方法。

公开(公告)号：US20100021652A1

公开(公告)日：2010-01-28

申请号：US12494279

申请日：2009-06-30

Applicant: CHENG-HSIEN LIN ,  YAO-WEN BAI ,  RUI ZHANG

Inventor： CHENG-HSIEN LIN ,  YAO-WEN BAI ,  RUI ZHANG

IPC: B05D3/06

CPC classification number: H05K3/185 ,  H05K3/105 ,  H05K2203/013 ,  H05K2203/125

Abstract: A method of forming electrical traces includes the steps of: providing a substrate; printing an ink pattern using a silver containing ink on the substrate, the ink comprising an aqueous carrier medium having dissolved therein a water-soluble light sensitive silver salt; irradiating the ink pattern to reduce silver salt therein to silver particles thereby forming an underlayer; and electroless plating a metal overcoat layer on the underlayer thereby obtaining electrical traces.

Abstract translation: 形成电迹线的方法包括以下步骤：提供衬底; 在基材上使用含银墨水印刷油墨图案，该油墨包含其中溶解有水溶性光敏银盐的水性载体介质; 照射油墨图案以将其中的银盐还原成银颗粒，从而形成底层; 并在底层上无电镀覆金属外涂层，从而获得电迹线。

公开(公告)号：US20100003784A1

公开(公告)日：2010-01-07

申请号：US12466361

申请日：2009-05-14

Applicant: CHUNG-JEN TSAI ,  CHIA-CHENG CHEN ,  HUNG-YI CHANG ,  TUNG-YAO KUO ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  CHIA-CHENG CHEN ,  HUNG-YI CHANG ,  TUNG-YAO KUO ,  CHENG-HSIEN LIN

IPC: H01L21/52

CPC classification number: H05K1/0271 ,  H05K3/0052 ,  H05K3/303 ,  H05K3/341 ,  H05K2201/09127 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009

Abstract: A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.

Abstract translation: 一种用于在印刷电路板上组装电子部件的方法包括以下步骤。 首先，提供包括中央主要部分和外围不想要的部分的印刷电路板基板。 其次，分别在主要部分和不想要的部分上形成导电图案和加强图案。 第三，电子部件安装在主体部分上并与导电图形电连接。 第五，去除不想要的部分。

公开(公告)号：US20090242246A1

公开(公告)日：2009-10-01

申请号：US12253869

申请日：2008-10-17

Applicant: SHING-TZA LIOU ,  YAO-WEN BAI ,  CHENG-HSIEN LIN

Inventor： SHING-TZA LIOU ,  YAO-WEN BAI ,  CHENG-HSIEN LIN

IPC: H05K3/10 ,  H05K1/03

CPC classification number: H05K1/097 ,  B82Y10/00 ,  H05K3/125 ,  H05K3/246 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2203/013 ,  Y10T29/49155 ,  Y10T428/2462 ,  Y10T428/30 ,  Y10T428/32

Abstract: A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.

Abstract translation: 印刷电路板包括具有表面的基板，具有形成在表面上的多个电迹线的电路层和形成在电路层上的导电金属层。 电路层由碳纳米管和金属纳米颗粒组成。

公开(公告)号：US20090183823A1

公开(公告)日：2009-07-23

申请号：US12270612

申请日：2008-11-13

Applicant: LIN REN ,  YING SU ,  CHENG-HSIEN LIN

Inventor： LIN REN ,  YING SU ,  CHENG-HSIEN LIN

IPC: B32B37/00

CPC classification number: H05K3/4691 ,  H05K3/0052 ,  H05K3/4611 ,  H05K2201/0909 ,  H05K2201/09127 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T156/1064

Abstract: A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.

Abstract translation: 制造刚柔柔性印刷电路板的方法包括以下步骤。 首先，提供柔性基板。 其次，在柔性基板中限定至少一个狭缝。 第三，提供具有对应于柔性基板的结构的刚性基板。 第四，将柔性基板层合到刚性基板上以获得层压基板。 第五，去除刚性基板的一部分。 第六，层叠基板沿着假想边界线切割以去除层叠基板的废弃部分。 因此，获得刚性柔性印刷电路板。

公开(公告)号：US20080116166A1

公开(公告)日：2008-05-22

申请号：US11865619

申请日：2007-10-01

Applicant: CHIH-YI TU ,  CHENG-HSIEN LIN ,  I-HSIEN CHIANG

Inventor： CHIH-YI TU ,  CHENG-HSIEN LIN ,  I-HSIEN CHIANG

IPC: H05K3/46 ,  H01B13/00

CPC classification number: H05K3/4697 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2203/063 ,  H05K2203/108 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The present inventions relates to a method for manufacturing a multilayer FPCB having different number of layers in different areas. The method includes the steps of: providing a binder layer; removing a portion of the binder layer thereby defining an opening in the binder layer; forming a multilayer FPCB which having a first copper clad laminate structure and a second copper clad laminate structure disposed on two opposite sides of the binder layer respectively using the binder layer; cutting the first copper clad laminate structure; cutting the multilayer FPCB in manner that a portion of first copper clad laminate structure that is exposed to the opening is separated from the first copper clad structure thereby obtain a multilayer FPCB having different number of layers in different areas.

Abstract translation: 本发明涉及一种制造在不同区域中具有不同层数的多层FPCB的方法。 该方法包括以下步骤：提供粘合剂层; 去除粘合剂层的一部分从而限定粘合剂层中的开口; 形成具有第一覆铜层压结构的多层FPCB和分别使用粘合剂层设置在粘合剂层的两个相对侧上的第二覆铜层压结构; 切割第一个覆铜层压结构; 以暴露于开口的第一覆铜层压体结构的一部分与第一铜包层结构体分离的方式切断多层FPCB，由此得到在不同区域中具有不同层数的多层FPCB。

公开(公告)号：US20120211267A1

公开(公告)日：2012-08-23

申请号：US13461749

申请日：2012-05-01

Applicant: PAI-HUNG HUANG ,  CHIH-KANG YANG ,  CHENG-HSIEN LIN

Inventor： PAI-HUNG HUANG ,  CHIH-KANG YANG ,  CHENG-HSIEN LIN

IPC: H05K1/05 ,  H05K1/03

CPC classification number: H05K3/0097 ,  H05K3/0082 ,  H05K3/064 ,  H05K2203/1554 ,  Y10T29/49162

Abstract: A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, and N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board.

Abstract translation: 印刷电路板基板包括金属包覆基板和沿着假想圆布置在金属包覆基板上的多个N个间隔开的电路基板，N是大于2的自然数。电路基板围绕中心等角地布置 的圆，并且每个电路基板相对于相邻的印刷电路板定向成360度/ N度。

公开(公告)号：US20100051332A1

公开(公告)日：2010-03-04

申请号：US12471396

申请日：2009-05-24

Applicant: CHUNG-JEN TSAI ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN ,  MENG-CHIEH HSU ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN ,  MENG-CHIEH HSU ,  CHENG-HSIEN LIN

IPC: H05K1/02

CPC classification number: H05K1/186 ,  B82Y10/00 ,  H01L23/373 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19042 ,  H05K3/4038 ,  H05K2201/026

Abstract: A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.

Abstract translation: 电路基板包括其中形成有导电图案的导电层，具有通孔的绝缘层和位于导电层和绝缘层之间的复合层。 通孔被配置为具有安装在其上的电子部件。 复合层包括聚合物基质和嵌入聚合物基质中的至少一个碳纳米管束。 至少一个碳纳米管束的一端与导电图案接触，另一端暴露在绝缘层的通孔中。

公开(公告)号：US20100021653A1

公开(公告)日：2010-01-28

申请号：US12330577

申请日：2008-12-09

Applicant: CHENG-HSIEN LIN ,  YAO-WEN BAI ,  QIU-YUE ZHANG ,  RUI ZHANG

Inventor： CHENG-HSIEN LIN ,  YAO-WEN BAI ,  QIU-YUE ZHANG ,  RUI ZHANG

IPC: C08J7/18

CPC classification number: H05K3/105 ,  H05K3/106 ,  H05K2201/0347 ,  H05K2203/013 ,  H05K2203/125

Abstract: An exemplary method for forming electrical traces on a substrate includes flowing steps. Firstly, a circuit pattern is formed on the substrate by printing a silver ions-containing ink. The ink comprises an aqueous carrier medium, and a silver halide emulsion soluble in the aqueous carrier medium. Secondly, an irradiation ray irradiates the circuit pattern to reduce the silver ions into silver to form a silver particle circuit pattern comprised of silver particles. Thirdly, a metal overcoat layer is electroless-plated on the silver particle circuit pattern thereby obtaining electrical traces.

Abstract translation: 在衬底上形成电迹线的示例性方法包括流动步骤。 首先，通过印刷含银离子的油墨在基板上形成电路图案。 油墨包含水性载体介质和可溶于载体介质的卤化银乳剂。 其次，照射线照射电路图案，将银离子还原为银，形成由银粒子构成的银粒子电路图案。 第三，将金属覆盖层无电镀在银粒子电路图案上，从而获得电迹线。

公开(公告)号：US20090304911A1

公开(公告)日：2009-12-10

申请号：US12261321

申请日：2008-10-30

Applicant: CHENG-HSIEN LIN ,  QIU-YUE ZHANG ,  YAO-WEN BAI

Inventor： CHENG-HSIEN LIN ,  QIU-YUE ZHANG ,  YAO-WEN BAI

IPC: H05K3/12 ,  B05D5/12

CPC classification number: H05K3/105 ,  H05K3/182 ,  H05K3/381 ,  H05K2203/013 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/1157 ,  H05K2203/125

Abstract: A method of forming a circuit on a circuit board includes the following steps. Firstly, a surface of an insulating substrate is hydrophilically treated. Secondly, a first circuit layer having a number of electrical traces is formed on the hydrophilically treated surface, the first circuit layer is comprised of a soluble palladium salt. Thirdly, the soluble palladium salt of the first circuit layer is reduced into metallic palladium, thereby obtaining a second circuit layer comprised of metallic palladium. Lastly, an electrically conductive layer is formed on the second circuit layer.

Abstract translation: 在电路板上形成电路的方法包括以下步骤。 首先，对绝缘基板的表面进行亲水处理。 其次，在亲水处理的表面上形成具有多个电迹线的第一电路层，第一电路层由可溶性钯盐构成。 第三，将第一电路层的可溶性钯盐还原为金属钯，从而获得由金属钯构成的第二电路层。 最后，在第二电路层上形成导电层。