公开(公告)号：US20050283061A1

公开(公告)日：2005-12-22

申请号：US11027162

申请日：2004-12-29

申请人： Chang Ryu ,  Seung Kim ,  Youn Kim

发明人： Chang Ryu ,  Seung Kim ,  Youn Kim

IPC分类号： A61B5/0408 ,  A61B5/04 ,  A61B5/0404 ,  A61B5/0428

CPC分类号： A61B5/04286 ,  A61B5/0404 ,  A61B5/0428 ,  Y10S439/909

摘要： Provided is a physiological signal detection module which has a heating member and a multi-channel connector. The heating member maintains an electrode's contact with a user skin at a constant temperature, and the multi-channel connector module for electrical connection transmits the physiological signal to an external physiological signal detection apparatus. It is possible to prevent the skin from being directly contacted with the electrode in the cold state and have a less impact given by a change of the impedance due to a skin temperature based on the change of the season and external temperature, so that the stable physiological signal can be detected without distortion.

摘要翻译： 提供了具有加热构件和多通道连接器的生理信号检测模块。 加热构件在恒定温度下保持电极与使用者皮肤的接触，并且用于电连接的多通道连接器模块将生理信号传输到外部生理信号检测装置。 可以防止皮肤在冷态中与电极直接接触，并且由于根据季节和外部温度的变化而由皮肤温度引起的阻抗变化的影响较小，使得稳定 可以无畸变地检测生理信号。

公开(公告)号：US20050178585A1

公开(公告)日：2005-08-18

申请号：US11042360

申请日：2005-01-24

申请人： Young Kim ,  Byoung Min ,  Chang Ryu ,  Han Kim

发明人： Young Kim ,  Byoung Min ,  Chang Ryu ,  Han Kim

IPC分类号： H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K1/115 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09809

摘要： Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole.

摘要翻译： 公开了一种PCB，其具有轴向平行的通孔，其中用作接地的外部接地通孔围绕用于PCB中的电路连接的通孔形成，从而最小化由通孔引起的噪声的影响。

公开(公告)号：US20060258053A1

公开(公告)日：2006-11-16

申请号：US11431742

申请日：2006-05-09

申请人： Doo Lee ,  Chang Ryu ,  Han Cho ,  Byoung Min

发明人： Doo Lee ,  Chang Ryu ,  Han Cho ,  Byoung Min

IPC分类号： H01L21/00

CPC分类号： H01L24/18 ,  H01L24/82 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/188 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/0959 ,  H01L2924/00 ,  H01L2224/0401

摘要： Disclosed herein is a method for manufacturing a component-embedded printed circuit board that is economically advantageous and simple. The method is characterized by stacking boards in which a high density of electronic components are mounted to form a core layer in which the electronic components are embedded, and by subsequently building up additional circuit layers.

摘要翻译： 本文公开了一种经济有利且简单的组件嵌入式印刷电路板的制造方法。 该方法的特征在于堆叠板，其中安装高密度的电子部件以形成其中嵌入电子部件的芯层，以及随后构建附加的电路层。

公开(公告)号：US20060252853A1

公开(公告)日：2006-11-09

申请号：US10535279

申请日：2003-11-18

申请人： Pulickel Ajayan ,  Chang Ryu ,  Nirupama Chakrapani ,  Gunaranjan Viswanathan ,  Seamus Curran

发明人： Pulickel Ajayan ,  Chang Ryu ,  Nirupama Chakrapani ,  Gunaranjan Viswanathan ,  Seamus Curran

IPC分类号： D01F9/12 ,  C08K9/00

CPC分类号： B82Y30/00 ,  B82Y40/00 ,  C01B32/174 ,  C01B2202/02 ,  C01B2202/06 ,  D06M13/144 ,  D06M13/51 ,  D06M2101/40 ,  D06M2400/01

摘要： The invention relates to derivatized, well-dispersed CNTs that have enhanced miscibility with organic agents. Composite materials may be made using such CNTs. The composite materials, in turn, may be used in optical and electronic applications.

摘要翻译： 本发明涉及具有增强的与有机试剂的混溶性的衍生的，良好分散的CNT。 可以使用这样的CNT来制造复合材料。 复合材料又可用于光学和电子应用。

公开(公告)号：US20060191711A1

公开(公告)日：2006-08-31

申请号：US11351938

申请日：2006-02-10

申请人： Suk Cho ,  Chang Ryu ,  Jin Ahn

发明人： Suk Cho ,  Chang Ryu ,  Jin Ahn

IPC分类号： H05K1/18 ,  H05K3/30 ,  H01L23/12

CPC分类号： H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82047 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4652 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2924/00

摘要： The present invention relates to an embedded chip printed circuit board in which a space required for embedding a chip is formed to a desired depth depending on various thicknesses of chips to be embedded, and thus, the circuit line for the electrical connection between the embedded chip and the circuit pattern layer can be formed to be relatively short, thereby maximizing space efficiency and decreasing inductance at high frequencies. In addition, a method of manufacturing such an embedded printed circuit board is also provided.

摘要翻译： 嵌入式芯片印刷电路板技术领域本发明涉及一种嵌入式芯片印刷电路板，其中嵌入芯片所需的空间根据要嵌入的芯片的各种厚度形成为期望的深度，因此，嵌入式芯片之间的电连接的电路线 并且电路图案层可以形成为相对较短，从而最大化空间效率并降低高频下的电感。 此外，还提供了一种制造这种嵌入式印刷电路板的方法。

公开(公告)号：US20060145805A1

公开(公告)日：2006-07-06

申请号：US11140680

申请日：2005-05-27

申请人： Han Kim ,  Byoung Min ,  Young Kim ,  Young Lee ,  Chang Ryu

发明人： Han Kim ,  Byoung Min ,  Young Kim ,  Young Lee ,  Chang Ryu

IPC分类号： H01F5/00

CPC分类号： H01F5/00 ,  H01F17/0006 ,  H01F17/0033 ,  H01F2017/002 ,  H05K1/165 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/097

摘要： A printed circuit board (PCB) having a three-dimensional spiral inductor, which includes a plurality of insulating layers and conductor layers. The PCB comprises a plurality of coil conductor patterns made of conductive material and shaped into strips, which is provided on the plurality of conductor layers, respectively, such that the plurality of coil conductor patterns are parallel to each other and positioned on the same plane perpendicular to the conductor layers, and in which each of the plurality of coil conductor patterns is longer than an adjacent inner coil conductor pattern.

摘要翻译： 一种具有三维螺旋电感器的印刷电路板（PCB），其包括多个绝缘层和导体层。 PCB包括由导电材料制成并成形为条的多个线圈导体图案，其分别设置在多个导体层上，使得多个线圈导体图案彼此平行并且位于同一平面上垂直 并且其中多个线圈导体图案中的每一个长于相邻的内部线圈导体图案。

公开(公告)号：US20060115770A1

公开(公告)日：2006-06-01

申请号：US11058998

申请日：2005-02-15

申请人： Jong Hong ,  Chang Ryu ,  Ho Jeon ,  Seok Lee

发明人： Jong Hong ,  Chang Ryu ,  Ho Jeon ,  Seok Lee

IPC分类号： G03C5/00

CPC分类号： H05K1/162 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/108 ,  H05K3/181 ,  H05K3/184 ,  H05K3/4644 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09881 ,  H05K2203/0551

摘要： Disclosed is a PCB including an embedded capacitor, in which a dielectric layer and an upper electrode layer are formed after a lower electrode layer of the embedded capacitor is formed, thereby providing a microcircuit pattern on a circuit layer having a lower electrode layer formed thereon, and a method of fabricating the same.

摘要翻译： 公开了一种在嵌入式电容器的下电极层形成之后形成介质层和上电极层的嵌入式电容器的PCB，从而在其上形成有下电极层的电路层上提供微电路图案， 及其制造方法。

公开(公告)号：US20060054352A1

公开(公告)日：2006-03-16

申请号：US11020466

申请日：2004-12-22

申请人： Chang Ryu ,  Myung Kang

发明人： Chang Ryu ,  Myung Kang

IPC分类号： H05K7/06

CPC分类号： H05K1/185 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49101 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

摘要翻译： 公开了一种包括嵌入式无源元件的PCB及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成，镀有第一导电材料，并彼此隔开预定距离。 嵌入式无源部件插入在端子之间，并且具有形成在其两侧的电极。 电极与端子分开预定距离，并通过第二导电材料与端子电连接。