-
公开(公告)号：US20210020805A1
公开(公告)日：2021-01-21
申请号：US17062119
申请日：2020-10-02
Applicant: Cree, Inc.
Inventor： Kevin W. Haberern , Matthew Donofrio , Bennett Langsdorf , Thomas Place , Michael John Bergmann
IPC: H01L33/08 , H01L33/40 , H01L25/075
Abstract: Monolithic LED chips are disclosed comprising a plurality of active regions on a submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another with at least some of the active regions having a space between adjacent ones of the active regions that is 10 percent or less of the width of one or more of the active regions. The space is substantially not visible when the LED chip is emitting, such that the LED chips emits light similar to a filament.
-
公开(公告)号：US10658546B2
公开(公告)日：2020-05-19
申请号：US14602040
申请日：2015-01-21
Applicant: CREE, INC.
Inventor： Matthew Donofrio , Pritish Kar , Sten Heikman , Harshad Golakia , Rajeev Acharya , Yuvaraj Dora
Abstract: Simplified LED chip architectures or chip builds are disclosed that can result in simpler manufacturing processes using fewer steps. The LED structure can have fewer layers than conventional LED chips with the layers arranged in different ways for efficient fabrication and operation. The LED chips can comprise an active LED structure. A dielectric reflective layer is included adjacent to one of the oppositely doped layers. A metal reflective layer is on the dielectric reflective layer, wherein the dielectric and metal reflective layers extend beyond the edge of said active region. By extending the dielectric layer, the LED chips can emit with more efficiency by reflecting more LED light to emit in the desired direction. By extending the metal reflective layer beyond the edge of the active region, the metal reflective layer can serve as a current spreading layer and barrier, in addition to reflecting LED light to emit in the desired direction. The LED chips can also comprise self-aligned and self-limiting features that simplify etching processes during fabrication.
-
公开(公告)号：US10421158B1
公开(公告)日：2019-09-24
申请号：US16274064
申请日：2019-02-12
Applicant: Cree, Inc.
Inventor： Matthew Donofrio , John Edmond , Harshad Golakia
IPC: H01L29/16 , H01L21/67 , B23K26/53 , H01L21/268 , H01L21/683 , H01L21/02 , H01L21/82 , H01L21/306 , B23K26/00 , B23K26/06 , B23K26/08 , B23K26/359 , B23K103/00 , B23K101/40
Abstract: A method for processing a crystalline substrate to form multiple patterns of subsurface laser damage facilitates subsequent fracture of the substrate to yield first and second substrate portions of reduced thickness. Multiple (e.g., two, three, or more) groups of parallel lines of multiple subsurface laser damage patterns may be sequentially interspersed with one another, with at least some lines of different groups not crossing one another. Certain implementations include formation of multiple subsurface laser damage patterns including groups of parallel lines that are non-parallel to one another, but with each line remaining within ±5 degrees of perpendicular to the direction of a hexagonal crystal structure of a material of the substrate. Further methods involve formation of initial and subsequent subsurface laser damage patterns that are centered at different depths within an interior of a substrate, with the subsurface laser damage patterns being registered with one another and having vertical extents that are overlapping.
-
公开(公告)号：US20170294417A1
公开(公告)日：2017-10-12
申请号：US15399729
申请日：2017-01-05
Applicant: Cree, Inc.
Inventor： John Edmond , Matthew Donofrio , Jesse Reiherzer , Peter Scott Andrews , Joseph G. Clark , Kevin Haberern
Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
-
25.发明授权Semiconductor light emitting diodes with crack-tolerant barrier structures and methods of fabricating the same 有权具有耐裂纹阻挡结构的半导体发光二极管及其制造方法公开(公告)号：US09496458B2
公开(公告)日：2016-11-15
申请号：US13790369
申请日：2013-03-08
Applicant: Cree, Inc.
Inventor： Matthew Donofrio , Michael Bergmann , Kevin Haberern , Kevin Schneider
CPC classification number: H01L33/12 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2933/0025 , H01L2933/0066 , H01L2924/00
Abstract: A light emitting device includes an epitaxial region, an insulating layer on the epitaxial region, a bond pad on the insulating layer, and a crack reducing feature in the insulating layer. The crack reducing feature is configured to reduce the propagation of cracks in the insulating layer to an outside surface of the insulating layer. Related methods are also disclosed.
Abstract translation: 发光器件包括外延区域，外延区域上的绝缘层，绝缘层上的接合焊盘以及绝缘层中的裂纹减少特征。 裂纹减少特征被配置为减小绝缘层中的裂纹到绝缘层的外表面的传播。 还公开了相关方法。
-
Patent Agency Ranking
公开(公告)号：US09243777B2
公开(公告)日：2016-01-26
申请号：US13837379
申请日：2013-03-15
Applicant: CREE, INC.
Inventor： Matthew Donofrio , Gerald Negley , Shaow B. Lin
CPC classification number: F21V9/08 , C09K11/06 , C09K2211/182 , G02B1/04 , G02B5/206
Abstract: The present disclosure relates to optical elements and coatings comprising rare-earth element (REE) compounds for light wavelength attenuation of light emitting diode (LED) elements and lamps. More particularly, the present disclosure relates to LED elements and lamps comprising wavelength attenuating elements comprising REE compounds having at least a portion of non-crystalline, non-hydrate form, methods of preparing such elements, and LED elements, LED arrays, LED packages, optical elements, lamps and systems made with same.
Abstract translation: 本公开涉及包含用于发光二极管（LED）元件和灯的光波长衰减的稀土元素（REE）化合物的光学元件和涂层。 更具体地说，本公开涉及包括波长衰减元件的LED元件和灯，所述波长衰减元件包括具有至少一部分非结晶非水合物形式的REE化合物，制备这些元件的方法，以及LED元件，LED阵列，LED封装， 光学元件，制造的灯和系统。
-
公开(公告)号：US08878209B2
公开(公告)日：2014-11-04
申请号：US14183955
申请日：2014-02-19
Applicant: Cree, Inc.
Inventor： John Adam Edmond , David B. Slater, Jr. , Jayesh Bharathan , Matthew Donofrio
CPC classification number: H01L33/007 , H01L33/22 , H01L33/44
Abstract: A high efficiency Group III nitride light emitting diode is disclosed. The diode includes a Group III nitride-based light emitting region including a plurality of Group III nitride-based layers. A lenticular surface directly contacts one of the Group III nitride-based layers of the light emitting region. The lenticular surface includes a transparent material that is different from the Group III nitride-based layer of the light emitting region that the lenticular surface directly contacts.
Abstract translation: 公开了一种高效率III族氮化物发光二极管。 二极管包括包含多个III族氮化物基层的III族氮化物基发光区域。 透镜表面直接接触发光区域的III族氮化物基层之一。 透镜表面包括与透镜面直接接触的发光区域的III族氮化物基层不同的透明材料。
-
公开(公告)号：US20140268794A1
公开(公告)日：2014-09-18
申请号：US13837379
申请日：2013-03-15
Applicant: CREE, INC.
Inventor： Matthew Donofrio , Gerald Negley , Shaow B. Lin
CPC classification number: F21V9/08 , C09K11/06 , C09K2211/182 , G02B1/04 , G02B5/206
Abstract: The present disclosure relates to optical elements and coatings comprising rare-earth element (REE) compounds for light wavelength attenuation of light emitting diode (LED) elements and lamps. More particularly, the present disclosure relates to LED elements and lamps comprising wavelength attenuating elements comprising REE compounds having at least a portion of non-crystalline, non-hydrate form, methods of preparing such elements, and LED elements, LED arrays, LED packages, optical elements, lamps and systems made with same.
Abstract translation: 本公开涉及包含用于发光二极管（LED）元件和灯的光波长衰减的稀土元素（REE）化合物的光学元件和涂层。 更具体地说，本公开涉及包括波长衰减元件的LED元件和灯，所述波长衰减元件包括具有至少一部分非结晶非水合物形式的REE化合物，制备这些元件的方法，以及LED元件，LED阵列，LED封装， 光学元件，制造的灯和系统。
-
公开(公告)号：US20140167089A1
公开(公告)日：2014-06-19
申请号：US14183955
申请日：2014-02-19
Applicant: Cree, Inc.
Inventor： John Adam Edmond , David B. Slater, JR. , Jayesh Bharathan , Matthew Donofrio
IPC: H01L33/00
CPC classification number: H01L33/007 , H01L33/22 , H01L33/44
Abstract: A high efficiency Group III nitride light emitting diode is disclosed. The diode includes a Group III nitride-based light emitting region including a plurality of Group III nitride-based layers. A lenticular surface directly contacts one of the Group III nitride-based layers of the light emitting region. The lenticular surface includes a transparent material that is different from the Group III nitride-based layer of the light emitting region that the lenticular surface directly contacts.
Abstract translation: 公开了一种高效率III族氮化物发光二极管。 二极管包括包含多个III族氮化物基层的III族氮化物基发光区域。 透镜表面直接接触发光区域的III族氮化物基层之一。 透镜表面包括与透镜面直接接触的发光区域的III族氮化物基层不同的透明材料。
-
公开(公告)号：US20210074687A1
公开(公告)日：2021-03-11
申请号：US16950142
申请日：2020-11-17
Applicant: Cree, Inc.
Inventor： John Edmond , Matthew Donofrio , Jesse Reiherzer , Peter Scott Andrews , Joseph G. Clark , Kevin Haberern
Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
-
-
-
-
-
-
-
-
-
Search Results
52
records
(took 0.031 seconds)
