公开(公告)号：US20080007856A1

公开(公告)日：2008-01-10

申请号：US11635540

申请日：2006-12-08

申请人： Ken ichiro Tango ,  Toshihiko Fujii

发明人： Ken ichiro Tango ,  Toshihiko Fujii

IPC分类号： G11B5/09

CPC分类号： G06F3/0656 ,  G06F3/0616 ,  G06F3/0682 ,  G11B27/107 ,  G11B27/3027 ,  G11B2220/93

摘要： In a magnetic tape storage including a nonvolatile buffer memory, the buffer memory memorizing sets of data sent from a host computer, a set of data including a pair of one file and one tape mark, the tape mark showing the end of the file, sets of data are continuously stored in the buffer memory until the total data amount of the sets of data comes up to a predetermined data amount, and the sets of data stored in the buffer memory are wrote to a magnetic tape (called flushing) when the total data amount of the sets of data in the buffer memory exceeds the predetermined data amount. The frequency of the flushing and tape reposition according to the flushing can be greatly decreased. The wear-out of the magnetic tape and mechanical section relating to the magnetic tape running in the storage can be reduced.

摘要翻译： 在包括非易失性缓冲存储器的磁带存储器中，存储从主计算机发送的数据集的缓冲存储器，包括一对一个文件和一个磁带标记的一组数据，显示文件结束的磁带标记 的数据被连续地存储在缓冲存储器中，直到数据组的总数据量达到预定的数据量，并且当总计数据被存储在缓冲存储器中时，存储在缓冲存储器中的数据组被写入磁带（称为冲洗） 缓冲存储器中的数据组的数据量超过预定数据量。 根据冲洗的冲洗和带重新定位的频率可以大大降低。 可以减少与在存储器中运行的磁带有关的磁带和机械部分的磨损。

公开(公告)号：US20060040206A1

公开(公告)日：2006-02-23

申请号：US11205980

申请日：2005-11-04

申请人： Mutsuo Nakashima ,  Yoshitaka Hamada ,  Katsuya Takemura ,  Kazumi Noda ,  Toshihiko Fujii

发明人： Mutsuo Nakashima ,  Yoshitaka Hamada ,  Katsuya Takemura ,  Kazumi Noda ,  Toshihiko Fujii

IPC分类号： G03C1/76

CPC分类号： G03F7/0757 ,  G03F7/0045 ,  Y10S430/108

摘要： A resist composition is provided comprising a silicone resin, a photoacid generator, a nitrogen-containing organic compound, and a solvent. The silicone resin is obtained through cohydrolytic condensation of a mixture of three silane monomers containing an organic group having a hydroxyl group and having at least 3 fluorine atoms, in total, on a proximate carbon atom, an organic group having a carboxyl group protected with an acid labile group, and a lactone ring-bearing organic group, respectively. The resist composition has satisfactory resolution and overcomes the problem of a low selective etching ratio between resist film and organic film during oxygen reactive etching.

公开(公告)号：US06713612B2

公开(公告)日：2004-03-30

申请号：US10426623

申请日：2003-05-01

申请人： Katsuhiro Kobayashi ,  Youichi Ohsawa ,  Koji Hasegawa ,  Takao Yoshihara ,  Kazunori Maeda ,  Toshihiko Fujii

发明人： Katsuhiro Kobayashi ,  Youichi Ohsawa ,  Koji Hasegawa ,  Takao Yoshihara ,  Kazunori Maeda ,  Toshihiko Fujii

IPC分类号： C07C24514

CPC分类号： G03F7/0382 ,  C07C317/28 ,  G03F7/0045 ,  G03F7/0392

摘要： Sulfonyldiazomethane compounds containing a long-chain alkylcyclohexyl group are novel and useful as photoacid generators. Chemical amplification type resist compositions comprising the same are suited for microfabrication because of many advantages including improved resolution, improved focus latitude, minimized line width variation or shape degradation even on long-term PED, minimized debris left after coating, development and peeling, and improved pattern profile after development.

摘要翻译： 含有长链烷基环己基的磺酰基重氮甲烷化合物是新颖的，可用作光致酸发生剂。 包含该化合物的化学放大型抗蚀剂组合物由于包括改进的分辨率，改善的聚焦纬度，最小化的线宽变化或最小化的线宽变化或形状退化，甚至在长时间的PED，最小的残留在涂层，显影和剥离之后的碎片以及改进的许多优点也适用于微细加工。 开发后的图案样式。

公开(公告)号：US06708862B2

公开(公告)日：2004-03-23

申请号：US10207964

申请日：2002-07-31

申请人： Toshihiko Fujii ,  Takashi Ohta ,  Shinichi Sugiura ,  Toshimasa Akamatsu ,  Katsufumi Morimune

发明人： Toshihiko Fujii ,  Takashi Ohta ,  Shinichi Sugiura ,  Toshimasa Akamatsu ,  Katsufumi Morimune

IPC分类号： B23K3704

CPC分类号： H01L24/83 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/32 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/8319 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15763 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： A die bonding apparatus includes a first member having a surface to be die bonded on which solder is disposed, a base portion for mounting the first member thereon in a predetermined position, a second member disposed in an inclined manner with respect to the first member and faces the solder, and an inclination attenuating member for inclining and holding the second member with respect to the first member to attenuate an angle of inclination &thgr;1 of the second member with respect to the first member in a state where the solder is melted. In a state where the first, second members, and the solder are heated and the solder is melted, die bonding is effected while the inclination attenuating member gradually attenuates the angle of inclination &thgr;1, so that it is possible to suppress the occurrence of bubbles in the solder.

摘要翻译： 芯片接合装置包括：第一部件，其具有要被焊接的表面，焊料被放置在其上;第一部件，用于将第一部件安装在预定位置;第二部件，相对于第一部件倾斜设置; 面对焊料，以及倾斜衰减构件，用于相对于第一构件倾斜并保持第二构件，以在焊料熔化的状态下衰减第二构件相对于第一构件的倾斜角θ1。 在第一，第二构件和焊料被加热并且焊料熔化的状态下，当倾斜衰减构件逐渐衰减倾斜角度θ1时，进行管芯接合，从而可以抑制气泡的发生 焊料。

公开(公告)号：US4249983A

公开(公告)日：1981-02-10

申请号：US56593

申请日：1979-07-11

申请人： Toshihiko Fujii

发明人： Toshihiko Fujii

IPC分类号： B29C51/08 ,  B29C51/16 ,  B29C51/26 ,  B31F1/00 ,  B32B3/28 ,  B60R13/02 ,  B29C17/00

CPC分类号： B32B3/28 ,  B29C51/16 ,  B29C51/261 ,  B31F1/0077 ,  B60R13/02 ,  B29C51/082 ,  Y10T156/1744

摘要： A trim panel, which is composed of a substrate of corrugated paperboard and a decorative and/or protective skin layer, is produced by press-forming the substrate into a desired shape by a hot-press, parting the movable die of the press from the stationary die to leave the shaped substrate in the latter die, dragging a sheet material employed as the skin into the press so as to stretch above the shaped substrate, and pressing the stretched skin material against the shaped substrate, interposing an adhesive layer therebetween unless the skin material has an adhesive property, with application of heat to accomplish adhesion. The hot-press is combined with a substrate feed mechanism and a skin material feed mechanism which includes a piston rod with a sheet-grasping device mounted thereon and can serve also the function of withdrawing the shaped and laminated product from the stationary die. At the second pressing, adjustment of the clearance between the dies according to the thickness of the skin is effective for achieving a uniform adhesion of the skin to the substrate without deforming the substrate.

摘要翻译： 由瓦楞纸板的基材和装饰性和/或保护性表皮层构成的装饰板通过热压将基材压制成所需的形状而制成，将印刷机的活动模具从 固定模具将成形基板留在后者模具中，将用作皮肤的片材拖入压机中以在成形基板上方拉伸，并将拉伸的表皮材料压靠在成形基板上，在其间插入粘合剂层，除非 皮肤材料具有粘合性，并施加热量以实现粘合。 热压机与基板供给机构和表皮材料供给机构结合，该机构包括安装有片材夹持装置的活塞杆，并且还具有从固定模具中取出成形和层叠产品的功能。 在第二次压制时，根据皮肤的厚度调整模具之间的间隙对于在不使基材变形的情况下实现皮肤均匀地粘附到基底上是有效的。

公开(公告)号：US4124421A

公开(公告)日：1978-11-07

申请号：US765586

申请日：1977-02-04

申请人： Toshihiko Fujii

发明人： Toshihiko Fujii

IPC分类号： B32B5/18 ,  B29C51/00 ,  B29C51/14 ,  B29C55/00 ,  B29C61/00 ,  B29C63/00 ,  B29C65/00 ,  B29C65/40 ,  B29C65/48 ,  B29C65/70 ,  B29C65/78 ,  B31F1/00 ,  B32B37/00 ,  B60R13/02 ,  B29C3/00

CPC分类号： B29C51/14 ,  B31F1/0077 ,  B32B37/1018 ,  B60R13/0212 ,  B32B2307/10 ,  B32B2307/304 ,  Y10T156/1043

摘要： A method of producing a shaped wall covering material composed of a corrugated cardboard substrate, a porous buffer layer adhered onto one side of the substrate and a thermoplastic resin liner coated on the outer surface of the buffer layer. The starting materials are set in a hot-press in an orderly piled arrangement with interposed adhesive materials and subjected to press-shaping between male and female dies with application of heat. During the shaping operation, air is sucked from the gap between the substrate and the shaped surface of one die through holes intentionally formed in this die. The resultant attraction of the piled materials to this die facilitates the shaping and prevents a layer-separation or deformation of the product attributable to a sticking tendency of the liner to the other die. The suction can be enhanced by forming pin-like protuberances on the die surface contacting the substrate to intrude into the buffer layer and squeezing the buffer layer and/or substrate in a marginal region by a periopheral wall-like protuberance formed, for example, on the other die surface.

摘要翻译： 一种制造由瓦楞纸板基板，粘附在基板的一侧上的多孔缓冲层和涂覆在缓冲层的外表面上的热塑性树脂衬垫构成的成形壁覆盖材料的方法。 将起始材料设置在具有插入的粘合剂材料的有序堆叠布置的热压机中，并且在施加热量的情况下在阳模和阴模之间进行压制成形。 在成型操作期间，通过有意在该模具中形成的孔，从衬底和一个模具的成形表面之间的间隙吸入空气。 堆积的材料对该模具的吸引力有助于成形，并且防止由于衬垫到另一个模具的粘附倾向引起的产品的层分离或变形。 可以通过在与基板接触的模具表面上形成销状突起来增强吸力，以进入缓冲层，并通过例如形成在例如上面形成的周边壁状突起在边缘区域中挤压缓冲层和/或基板 另一个模具表面。

公开(公告)号：US09076738B2

公开(公告)日：2015-07-07

申请号：US13183175

申请日：2011-07-14

申请人： Takeru Watanabe ,  Toshihiko Fujii ,  Takeshi Kinsho ,  Tsutomu Ogihara

发明人： Takeru Watanabe ,  Toshihiko Fujii ,  Takeshi Kinsho ,  Tsutomu Ogihara

IPC分类号： H01L21/311 ,  C07C69/753 ,  G03F7/11 ,  H01L21/027

CPC分类号： H01L21/31144 ,  C07C69/753 ,  C07C2604/00 ,  G03F7/11 ,  H01L21/0271 ,  H01L21/31116

摘要： The invention provides a composition for a resist underlayer film, the composition for a resist underlayer film to form a resist underlayer film of a multilayer resist film used in lithography, wherein the composition comprises at least (A) a fullerene derivative that is a reaction product of a substance having a fullerene skeleton with a 1,3-diene compound derivative having an electron-withdrawing group and (B) an organic solvent. There can be a composition for a resist underlayer film for a multilayer resist film used in lithography, the composition giving a resist underlayer film having excellent high dry etching resistance, capable of suppressing wiggling during substrate etching with high effectiveness, and capable of avoiding a poisoning problem in upperlayer patterning that uses a chemical amplification resist; a process for forming a resist underlayer film; a patterning process; and a fullerene derivative.

摘要翻译： 本发明提供了一种用于抗蚀剂下层膜的组合物，用于形成抗蚀剂下层膜的组合物，用于形成用于光刻的多层抗蚀剂膜的抗蚀剂下层膜，其中所述组合物至少包含（A）富勒烯衍生物，其为反应产物 具有富勒烯骨架的物质与具有吸电子基团的1,3-二烯化合物衍生物和（B）有机溶剂。 可以使用用于光刻中的多层抗蚀剂膜的抗蚀剂下层膜的组合物，该组合物赋予抗蚀剂下层膜，其具有优异的耐干蚀刻性，能够高效地抑制基板蚀刻期间的扭曲，并且能够避免中毒 使用化学增幅抗蚀剂的上层图案化问题; 形成抗蚀剂下层膜的工序; 图案化过程; 和富勒烯衍生物。

公开(公告)号：US08663898B2

公开(公告)日：2014-03-04

申请号：US13311137

申请日：2011-12-05

申请人： Tsutomu Ogihara ,  Takeru Watanabe ,  Yusuke Biyajima ,  Daisuke Kori ,  Takeshi Kinsho ,  Toshihiko Fujii

发明人： Tsutomu Ogihara ,  Takeru Watanabe ,  Yusuke Biyajima ,  Daisuke Kori ,  Takeshi Kinsho ,  Toshihiko Fujii

IPC分类号： G03F7/00 ,  G03F7/11 ,  G03F7/26 ,  G03F7/40

CPC分类号： G03F7/091 ,  G03F7/094

摘要： There is disclosed A resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formulae (1-1) and/or (1-2), one or more kinds of a compound represented by the following general formula (2), and one or more kinds of a compound, represented by the following general formula (3), and/or an equivalent body thereof. There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value as an antireflective film), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.

摘要翻译： 公开了抗蚀剂下层膜组合物，其中组合物含有通过至少一种或多种下列通式（1-1）和/或（1-2）表示的化合物的缩合得到的聚合物：一种或多种 由以下通式（2）表示的化合物的种类以及由以下通式（3）表示的化合物和/或其等同体的一种或多种。 可以提供能够形成具有降低的反射率的下层膜（即，具有最佳n值和k值作为抗反射膜的下层膜）的三层抗蚀剂工艺的下层膜组合物， 特别是在60nm以上的高方位线上，特别是在蚀刻后，不会引起线下落或翘曲，以及使用其的图案化处理。

公开(公告)号：US08592956B2

公开(公告)日：2013-11-26

申请号：US13292696

申请日：2011-11-09

申请人： Tsutomu Ogihara ,  Daisuke Kori ,  Yusuke Biyajima ,  Takeru Watanabe ,  Toshihiko Fujii ,  Takeshi Kinsho

发明人： Tsutomu Ogihara ,  Daisuke Kori ,  Yusuke Biyajima ,  Takeru Watanabe ,  Toshihiko Fujii ,  Takeshi Kinsho

IPC分类号： H01L23/58 ,  H01L21/469

CPC分类号： G03F7/11 ,  G03F7/091 ,  G03F7/095

摘要： There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formula (1-1) and/or general formula (1-2), and one or more kinds of compounds and/or equivalent bodies thereof represented by the following general formula (2). There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.

摘要翻译： 公开了一种抗蚀剂下层膜组合物，其中组合物含有通过至少一种或多种下列通式（1-1）和/或通式（1-2）表示的化合物的缩合得到的聚合物，和 一种或多种由以下通式（2）表示的化合物和/或其等同体。 可以提供能够形成具有降低的反射率的下层膜（即，具有最佳n值和k值的下层膜）的三层抗蚀剂工艺的下层膜组合物，优异的填充性，高 图案抗菌性，特别是在薄于60nm的高纵横线上，特别是在蚀刻后不会引起线下落或摆动，以及使用其的图案化处理。

公开(公告)号：US08450048B2

公开(公告)日：2013-05-28

申请号：US12585387

申请日：2009-09-14

申请人： Jun Hatakeyama ,  Toshihiko Fujii ,  Tsutomu Ogihara

发明人： Jun Hatakeyama ,  Toshihiko Fujii ,  Tsutomu Ogihara

IPC分类号： G03F7/40 ,  G03F7/11

CPC分类号： G03F7/091 ,  G03F7/095

摘要： There is disclosed a method for forming a resist underlayer film of a multilayer resist film having at least three layers used in a lithography, comprising at least; a step of coating a composition for resist underlayer film containing a novolak resin represented by the following general formula (1) obtained by treating a compound having a bisnaphthol group on a substrate; and a step of curing the coated composition for the resist underlayer film by a heat treatment at a temperature above 300° C. and 600° C. or lower for 10 to 600 seconds. There can be provided a method for forming a resist underlayer film, and a patterning process using the method to form a resist underlayer film in a multilayer resist film having at least three layers used in a lithography, gives a resist underlayer film having a lowered reflectance, a high etching resistance, and a high heat and solvent resistances, especially without wiggling during substrate etching.

摘要翻译： 公开了一种形成多层抗蚀剂膜的抗蚀剂下层膜的方法，所述多层抗蚀剂膜具有至少三层，其至​​少包括： 涂布含有下述通式（1）表示的酚醛清漆树脂的抗蚀剂下层膜用组合物的工序，所述酚醛清漆树脂通过在基材上处理具有双萘酚基的化合物而得到; 以及通过在高于300℃和600℃或更低的温度下热处理10至600秒来固化抗蚀剂下层膜的涂覆组合物的步骤。 可以提供一种形成抗蚀剂下层膜的方法，并且使用在具有至少三层的平版印刷用的多层抗蚀剂膜中形成抗蚀剂下层膜的方法的图案化工艺，得到具有降低的反射率的抗蚀剂下层膜 ，耐腐蚀性高，耐热和耐溶剂性高，特别是在基板蚀刻期间无晃动。