公开(公告)号：US07550247B2

公开(公告)日：2009-06-23

申请号：US11205980

申请日：2005-08-18

申请人： Mutsuo Nakashima ,  Yoshitaka Hamada ,  Katsuya Takemura ,  Kazumi Noda ,  Toshihiko Fujii

发明人： Mutsuo Nakashima ,  Yoshitaka Hamada ,  Katsuya Takemura ,  Kazumi Noda ,  Toshihiko Fujii

IPC分类号： G03C1/73 ,  G03F7/039 ,  G03F7/20 ,  G03F7/36

CPC分类号： G03F7/0757 ,  G03F7/0045 ,  Y10S430/108

摘要： A resist composition is provided comprising a silicone resin, a photoacid generator, a nitrogen-containing organic compound, and a solvent. The silicone resin is obtained through cohydrolytic condensation of a mixture of three silane monomers containing an organic group having a hydroxyl group and having at least 3 fluorine atoms, in total, on a proximate carbon atom, an organic group having a carboxyl group protected with an acid labile group, and a lactone ring-bearing organic group, respectively. The resist composition has satisfactory resolution and overcomes the problem of a low selective etching ratio between resist film and organic film during oxygen reactive etching.

摘要翻译： 提供了包含有机硅树脂，光酸产生剂，含氮有机化合物和溶剂的抗蚀剂组合物。 有机硅树脂通过在近邻碳原子上含有具有羟基并且具有至少3个氟原子的有机基团的三种硅烷单体的混合物的共水解缩合获得，所述有机基团具有羧基被保护的有机基团 酸不稳定基团和含内酯环的有机基团。 抗蚀剂组合物具有令人满意的分辨率，并且克服了在氧反应蚀刻期间抗蚀剂膜和有机膜之间的选择性蚀刻比低的问题。

公开(公告)号：US20060040206A1

公开(公告)日：2006-02-23

申请号：US11205980

申请日：2005-11-04

申请人： Mutsuo Nakashima ,  Yoshitaka Hamada ,  Katsuya Takemura ,  Kazumi Noda ,  Toshihiko Fujii

发明人： Mutsuo Nakashima ,  Yoshitaka Hamada ,  Katsuya Takemura ,  Kazumi Noda ,  Toshihiko Fujii

IPC分类号： G03C1/76

CPC分类号： G03F7/0757 ,  G03F7/0045 ,  Y10S430/108

摘要： A resist composition is provided comprising a silicone resin, a photoacid generator, a nitrogen-containing organic compound, and a solvent. The silicone resin is obtained through cohydrolytic condensation of a mixture of three silane monomers containing an organic group having a hydroxyl group and having at least 3 fluorine atoms, in total, on a proximate carbon atom, an organic group having a carboxyl group protected with an acid labile group, and a lactone ring-bearing organic group, respectively. The resist composition has satisfactory resolution and overcomes the problem of a low selective etching ratio between resist film and organic film during oxygen reactive etching.

公开(公告)号：US08603732B2

公开(公告)日：2013-12-10

申请号：US12978978

申请日：2010-12-27

申请人： Tsutomu Ogihara ,  Takeru Watanabe ,  Takeshi Kinsho ,  Katsuya Takemura ,  Toshihiko Fujii ,  Daisuke Kori

发明人： Tsutomu Ogihara ,  Takeru Watanabe ,  Takeshi Kinsho ,  Katsuya Takemura ,  Toshihiko Fujii ,  Daisuke Kori

IPC分类号： G03F7/09 ,  G03F7/11 ,  G03F7/20 ,  G03F7/30 ,  G03F7/36

CPC分类号： G03F7/11 ,  B82Y10/00 ,  C08G61/02 ,  C08G2261/3424 ,  G03F7/0752 ,  H01L21/0332 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/31144

摘要： There is disclosed a resist underlayer film-forming composition comprising, at least: a resin (A) obtained by condensing a compound represented by the following general formula (1) with a compound represented by the following general formula (2) by the aid of an acid catalyst; a compound (B) represented by the general formula (1); a fullerene compound (C); and an organic solvent. There can be a resist underlayer film composition in a multi-layer resist film to be used in lithography, which underlayer film is excellent in property for filling up a height difference of a substrate, possesses a solvent resistance, and is not only capable of preventing occurrence of twisting during etching of a substrate, but also capable of providing an excellently decreased pattern roughness; a process for forming a resist underlayer film by using the composition; and a patterning process.

摘要翻译： 公开了一种抗蚀剂下层膜形成组合物，其至少包括：通过以下通式（1）表示的化合物与下列通式（2）表示的化合物缩合得到的树脂（A）：通过 酸催化剂; 由通式（1）表示的化合物（B）; 富勒烯化合物（C）; 和有机溶剂。 在光刻中使用的多层抗蚀剂膜中可以存在抗蚀剂下层膜组合物，该下层膜具有优异的填充基板的高度差的性能，具有耐溶剂性，并且不仅能够防止 在蚀刻基板期间发生扭曲，而且能够提供优异的图案粗糙度; 通过使用该组合物形成抗蚀剂下层膜的方法; 和图案化过程。

公开(公告)号：US08835092B2

公开(公告)日：2014-09-16

申请号：US13015094

申请日：2011-01-27

申请人： Takeru Watanabe ,  Takeshi Kinsho ,  Tsutomu Ogihara ,  Katsuya Takemura ,  Toshihiko Fujii ,  Daisuke Kori

发明人： Takeru Watanabe ,  Takeshi Kinsho ,  Tsutomu Ogihara ,  Katsuya Takemura ,  Toshihiko Fujii ,  Daisuke Kori

IPC分类号： G03F7/095 ,  G03F7/11 ,  G03F7/40 ,  G03F7/09 ,  C07C69/753 ,  C08L61/06

CPC分类号： C07C69/753 ,  C07C2604/00 ,  C08L61/06 ,  G03F7/094 ,  G03F7/40

摘要： There is disclosed a resist underlayer film composition of a multilayer resist film used in lithography including (A) a fullerene derivative having a carboxyl group protected by a thermally labile group and (B) an organic solvent. There can be a resist underlayer film composition of a multilayer resist film used in lithography for forming a resist underlayer in which generation of wiggling in substrate etching can be highly suppressed and the poisoning problem in forming an upper layer pattern using a chemically amplified resist can be avoided, a process for forming the resist underlayer film, a patterning process and a fullerene derivative.

摘要翻译： 公开了用于光刻的多层抗蚀剂膜的抗蚀剂下层膜组合物，其包含（A）具有由热不稳定基团保护的羧基的富勒烯衍生物和（B）有机溶剂。 可以存在用于形成抗蚀剂底层的光刻用的多层抗蚀剂膜的抗蚀剂下层膜组合物，其中可以高度抑制基板蚀刻中的摆动的产生，并且可以使用化学放大抗蚀剂形成上层图案的中毒问题 避免形成抗蚀剂下层膜的方法，图案化工艺和富勒烯衍生物。

公开(公告)号：US20110195362A1

公开(公告)日：2011-08-11

申请号：US13015094

申请日：2011-01-27

申请人： Takeru Watanabe ,  Takeshi Kinsho ,  Tsutomu Ogihara ,  Katsuya Takemura ,  Toshihiko Fujii ,  Daisuke Kori

发明人： Takeru Watanabe ,  Takeshi Kinsho ,  Tsutomu Ogihara ,  Katsuya Takemura ,  Toshihiko Fujii ,  Daisuke Kori

IPC分类号： G03F7/20 ,  C07C69/753 ,  C09D7/12 ,  C08L61/02 ,  B05D3/02 ,  B05D7/24 ,  B82Y20/00

CPC分类号： C07C69/753 ,  C07C2604/00 ,  C08L61/06 ,  G03F7/094 ,  G03F7/40

摘要： There is disclosed a resist underlayer film composition of a multilayer resist film used in lithography including (A) a fullerene derivative having a carboxyl group protected by a thermally labile group and (B) an organic solvent. There can be a resist underlayer film composition of a multilayer resist film used in lithography for forming a resist underlayer in which generation of wiggling in substrate etching can be highly suppressed and the poisoning problem in forming an upper layer pattern using a chemically amplified resist can be avoided, a process for forming the resist underlayer film, a patterning process and a fullerene derivative.

摘要翻译： 公开了用于光刻的多层抗蚀剂膜的抗蚀剂下层膜组合物，其包含（A）具有由热不稳定基团保护的羧基的富勒烯衍生物和（B）有机溶剂。 可以存在用于形成抗蚀剂底层的光刻用的多层抗蚀剂膜的抗蚀剂下层膜组合物，其中可以高度抑制基板蚀刻中的摆动的产生，并且可以使用化学放大抗蚀剂形成上层图案的中毒问题 避免形成抗蚀剂下层膜的方法，图案化工艺和富勒烯衍生物。

公开(公告)号：US06899991B2

公开(公告)日：2005-05-31

申请号：US10266566

申请日：2002-10-09

申请人： Hideto Kato ,  Kazumi Noda ,  Toshihiko Fujii ,  Kazuhiro Arai ,  Satoshi Asai

发明人： Hideto Kato ,  Kazumi Noda ,  Toshihiko Fujii ,  Kazuhiro Arai ,  Satoshi Asai

IPC分类号： B05D7/24 ,  C08F2/46 ,  C08G59/62 ,  C08J5/18 ,  C08K5/13 ,  C08K5/5415 ,  C08L83/04 ,  C08L83/14 ,  C09D183/14 ,  G03F7/004 ,  G03F7/038 ,  G03F7/075 ,  G03F7/40 ,  H01L21/027

CPC分类号： G03F7/0757 ,  C09D183/14 ,  G03F7/0382 ,  Y10S430/128 ,  C08L2666/14

摘要： A photo-curable resin composition comprising (A) an organosiloxane-bearing polymer comprising recurring units of formula (1): wherein R1 to R4 are monovalent C1-C8 hydrocarbon, n is an integer of 1-1,000, and X is and having a Mw of 500-200,000, (B) a formalin-modified or formalin-alcohol-modified amino condensate, a phenol compound having on the average at least two methylol or alkoxymethylol radicals, or an epoxy compound having on the average at least two epoxy radicals, (C) a photoacid generator, and (D) a silicon compound of the formula: (R11)mSi(OR12)4−m wherein R11 is monovalent C1-C9 hydrocarbon, R12 is C1-C4 alkyl, m is 0-2, forms cured pattern films having dry etch resistance and improved adhesion to substrates.

摘要翻译： 一种光固化树脂组合物，其包含（A）含有机硅氧烷的聚合物，其包含式（1）的重复单元：其中R 1至R 4为单价C 1〜8个碳原子，n为1-1000的整数，X为Mw为500-200,000，（B）福尔马林改性或福尔马林醇 - 改性氨基缩合物，平均具有至少两个羟甲基或烷氧基羟甲基的苯酚化合物或平均具有至少两个环氧基的环氧化合物，（C）光酸产生剂，和（D）式 （R 11）其中R 11是（OR 12）其中R 11是（OR 12） SUP>是一价C 1 -C 9烃，R 12是C 1 -C 4烃基 烷基，m为0-2，形成具有耐干蚀刻性和改善对基材的粘合性的固化图案膜。

公开(公告)号：US08338078B2

公开(公告)日：2012-12-25

申请号：US12581625

申请日：2009-10-19

申请人： Jun Hatakeyama ,  Toshihiko Fujii ,  Takeru Watanabe ,  Youichi Ohsawa

发明人： Jun Hatakeyama ,  Toshihiko Fujii ,  Takeru Watanabe ,  Youichi Ohsawa

IPC分类号： G03F7/09 ,  G03F7/20 ,  G03F7/30 ,  G03F7/36 ,  G03C1/76

CPC分类号： G03F7/091 ,  C08G61/02 ,  C09D161/04 ,  G03F7/40

摘要： A material comprising a novolac resin having a C6-C30 aromatic hydrocarbon group substituted with a sulfo group or an amine salt thereof is useful in forming a photoresist undercoat. The undercoat-forming material has an extinction coefficient sufficient to provide an antireflective effect at a thickness of at least 200 nm, and a high etching resistance as demonstrated by slow etching rates with CF4/CHF3 gas for substrate processing.

摘要翻译： 包含具有被磺基取代的C6-C30芳族烃基的酚醛清漆树脂或其胺盐的材料可用于形成光致抗蚀剂底涂层。 底涂层材料的消光系数足以在至少200nm的厚度下提供抗反射效果，并且具有高的耐蚀刻性，如通过用于基板处理的CF 4 / CHF 3气体的缓慢蚀刻速率所证明的。

公开(公告)号：US07308999B2

公开(公告)日：2007-12-18

申请号：US10739211

申请日：2003-12-19

申请人： Toshihiko Fujii ,  Takashi Ohta ,  Shinichi Sugiura ,  Toshimasa Akamatsu ,  Katsufumi Morimune

发明人： Toshihiko Fujii ,  Takashi Ohta ,  Shinichi Sugiura ,  Toshimasa Akamatsu ,  Katsufumi Morimune

IPC分类号： B23K37/04

CPC分类号： H01L24/83 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/32 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/8319 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15763 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in which the solder disposed on the surface of the first member to be die bonded is interposed therebetween, and a base portion for mounting the first member thereon in a predetermined position, wherein the base portion has a temperature distribution so that a temperature of a vicinity of a central portion in a predetermined direction of the base portion is higher than that of a vicinity of an end portion of the base portion in a state in which heating is effected in the heat treatment furnace to, so that it is possible to suppress the occurrence of bubbles in the solder.

摘要翻译： 一种芯片接合装置，用于在至少两个在热处理炉中加热的构件进行芯片接合的模具接合装置，包括：第一构件，其具有待焊接的表面，焊料放置在其上;以及第二构件，其以状态设置为面对第一构件 其中设置在待接合的第一构件的表面上的焊料插入其间，并且用于将第一构件安装在预定位置的基部，其中基部具有使得附近的温度的温度分布 在热处理炉中进行加热的状态下，在基部的预定方向上的中心部分的高度大于基部的端部附近的中心部分，从而可以抑制 在焊料中发生气泡。

公开(公告)号：US5739970A

公开(公告)日：1998-04-14

申请号：US503200

申请日：1995-07-17

申请人： Masayoshi Kobayashi ,  Keisuke Hoshino ,  Masaru Ohshita ,  Akira Takano ,  Makoto Sasaki ,  Makoto Matsuda ,  Toshihiko Fujii

发明人： Masayoshi Kobayashi ,  Keisuke Hoshino ,  Masaru Ohshita ,  Akira Takano ,  Makoto Sasaki ,  Makoto Matsuda ,  Toshihiko Fujii

IPC分类号： G11B15/20 ,  G11B15/48 ,  G11B15/62 ,  G11B15/67 ,  G11B33/14 ,  G11B15/18 ,  G11B15/43

CPC分类号： G11B15/48 ,  G11B15/20 ,  G11B15/62 ,  G11B15/67 ,  G11B33/144

摘要： Disclosed herein is a magnetic tape unit having a magnetic head for reading and writing data from and onto a magnetic tape. The magnetic tape is traveled in contact with the magnetic head during a read/write operation of the magnetic head. During a rest period where the read/write operation of the magnetic head is not performed, a reciprocating motion of the magnetic tape by a small distance is performed with a predetermined period. A temperature in the vicinity of the magnetic head is detected by a temperature sensor. The predetermined period is changed according to the temperature detected by the temperature sensor. Accordingly, the adhesion of the magnetic tape to the magnetic head can be well prevented irrespective of the temperature inside the tape unit.

公开(公告)号：US4242172A

公开(公告)日：1980-12-30

申请号：US941741

申请日：1978-09-12

申请人： Toshihiko Fujii

发明人： Toshihiko Fujii

IPC分类号： B31F1/00 ,  B32B3/28 ,  B60R13/02 ,  B32B31/00

CPC分类号： B32B3/28 ,  B31F1/0077 ,  B60R13/0225 ,  Y10T156/1048 ,  Y10T156/1749 ,  Y10T156/1761

摘要： In a method of press-forming a planer board of corrugated paperboard into a curved board which serves as the substrate of, for example, an automobile roof trim board by utilizing a thermoplastic adhesive in the production of the corrugated paperboard and applying heat to the planer board through dies in a hot-press, the liners of the corrugated paperboard are prevented from wrinkling by preheating the planer board so as to soften the thermoplastic adhesive therein immediately before placement between the dies. An apparatus to perform this method comprises a board carrier which has heaters and can carry the planer board into the hot-press with continued heating of the board.

摘要翻译： 在将瓦楞纸板的平面板压制成弯曲板的方法中，所述弯曲板用作例如汽车车顶装饰板的基板，在制造瓦楞纸板中使用热塑性粘合剂并向刨床施加热量 通过热压机中的模具板，通过预热刨床来防止瓦楞纸板的衬垫起皱，以便在放置在模具之前立即软化其中的热塑性粘合剂。 执行该方法的装置包括具有加热器的板载体，并且可以在板的持续加热的情况下将刨床携带到热压机中。