Abstract:
A connector fixation structure includes: a connector having a rectangular connector body, protrusions protruding from facing sides in a wing like manner, and a terminal embedded in and protruding from the connector body; a heat sink having a plate shape body, a through hole and columnar convexities; and a printed board. The bottom of the connector is inserted into the through hole of the heat sink. Each columnar convexity is disposed on the plate shape body at a predetermined position corresponding to the protrusion. The top of the connector contacts a first surface of the printed board, and each columnar convexity is fixed to the printed board via the corresponding protrusion with a first screw.
Abstract:
An interconnection is provided with a dummy interconnection connected to an interconnection body, and the dummy interconnection is provided with a stress concentration portion in which tensile stress higher than that of the interconnection body is generated. In proximity to the stress concentration portion, an insulating film formed by high-density plasma CVD is provided, and the tensile stress is generated in the stress concentration portion by the insulating film. With this structure, the occurrence of a void can be prevented at any position in the interconnection body.
Abstract:
A design-change-target-circuit detecting unit inputs circuit information including an element model describing an electronic circuit to detect an electronic circuit using a changed element model. A determining unit compares a characteristic of an element model before change and that of the element model after change. An analysis-necessity deciding unit decides whether waveform analysis is necessary, and when determining that waveform analysis is necessary, makes an instruction for waveform analysis of the electronic circuit using the element model after change. Furthermore, after the determination-necessity deciding unit determines that waveform analysis of the electronic circuit using the element model after change is not necessary and design requirement conditions of the electronic circuit including the element model after change are changed from those before change, an instruction for pass/fail determination as to whether existing waveform analysis results satisfy the design requirement conditions after change is made to cause the instruction to be executed.
Abstract:
A switching device for controlling a large amount of current includes a circuit board carrying electronic components thereon, a power-switching element electrically connected to the circuit board, and a housing disposed underneath the circuit board and containing the power-switching element therein. The housing made of a heat-conductive material includes a heat-sink block having a sloped surface on which the power-switching element is mounted. Connecting leads extending from the power-switching element are positioned at an upper portion of the sloped surface which is close to the circuit board. In this manner, the length of connecting leads is shortened and heat and noises generated therein are suppressed.
Abstract:
A bus-bar integrated plate and outer frame section, arranged into a double-deck structure and having numerous bus bars molded with a resin molding plate portion, is provided as a wiring for connecting power switching elements and a smoothing capacitor, fixed on an outer surface of a cylindrical wall of a motor housing, to a printed circuit board serving as a control circuit.
Abstract:
A method of manufacturing a semiconductor device is provided, which prevents a polyimide film from coming unstuck from a film to be subjected to isotropic etching, and further prevents deposits adhered to respective side faces of the films from coming off, during a heat treatment for imidizing the polyimide film. Isotropic etching is performed on a silicon nitride film 4 using, as a mask, a polyimide film 5 having a predetermined pattern formed therein. Next, a heat treatment is carried out to imidize the polyimide film 5 prior to performing anisotropic etching on a silicon oxide film 3. During the heat treatment for imidizing the polyimide film 5, since deposits, which are to be generated by anisotropic etching, are not yet adhered to the respective side faces of the films, the polyimide film 5 does not come unstuck from the silicon nitride film 4. Further, the deposits which are adhered to the respective side face of the films after the heat treatment will not come off.
Abstract:
A suspension control system for controlling a suspension having a shock absorber provided for a wheel of a vehicle includes a damping force change rate detector which detects a damping force change rate indicating a rate of change of a damping force of the shock absorber, and a damping force controller which alters the setting of the damping force on the basis of the relationship between the damping force change rate and an adjustment reference value. The system also includes a road surface condition detector which detects, for every first period, the condition of a road surface on which the vehicle is running on the basis of a change of the damping force of the shock absorber, and a damping force adjustment correcting unit which corrects the adjustment reference value by learning, for every second period, the adjustment reference value on the basis of a parameter related to the damping force of the shock absorber which reflects the condition of the road surface. Further, the system includes a period adjustment unit which adjusts the first period on the basis of a vehicle speed.
Abstract:
High strength steel sheet which secures tensile maximum strength 900 MPa or more high strength while having excellent shapeability, which high strength steel sheet which is excellent in shapeability characterized by having a predetermined composition of ingredients, by the steel sheet structure including a ferrite phase and martensite phase, by the ratio of Cu particles incoherent with the bcc iron being 15% or more with respect to the Cu particles as a whole, by a density of Cu particles in the ferrite phase being 1.0×1018/m3 or more, and by an average particle size of Cu particles in the ferrite phase being 2.0 nm or more.
Abstract:
The present invention provides a high-strength galvanized steel sheet with maximum tensile strength of 900 MPa or more. The high-strength galvanized steel sheet has an alloyed galvanized layer formed on a surface of a base steel sheet containing predetermined amounts of C, Si, Mn, P, S, Al, N, O with a balance being constituted of iron and inevitable impurities, in which in a structure of the base steel sheet, retained austenite is limited to 8% or less in volume fraction, kurtosis K* of the hardness distribution between 2% hardness and 98% hardness is −0.30 or less, a ratio between Vickers hardness of surface layer of the base steel sheet and Vickers hardness of ¼ thickness of the base steel sheet is 0.35 to 0.70, and a content of iron in the alloyed galvanized layer is 8 to 12% in mass %.
Abstract:
In a motor drive apparatus for driving a three-phase AC motor, a first mounting part of a heat sink is formed along an end. A second mounting part is formed in a direction perpendicular to the first mounting part and includes a first column part and a second column part. Three motor relay FETs are mounted on the first mounting part. Six inverter FETs and two power relay FETs are mounted on the second mounting part. Leads of the FETs are electrically connected to an electric circuit substrate. Heat generated by the FETs is radiated to the heat sink through an insulating and heat radiating sheet. By thus arranging the FETs, the motor drive apparatus is reduced in size.