LIGHT EMITTING DEVICE
    22.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号:US20100102295A1

    公开(公告)日:2010-04-29

    申请号:US12603929

    申请日:2009-10-22

    IPC分类号: H01L33/00

    CPC分类号: H01L33/06 H01L33/025

    摘要: This invention discloses a light-emitting device comprising a semiconductor stack layer having an active layer of a multiple quantum well (MQW) structure comprising alternate stack layers of quantum well layers and barrier layers, wherein the barrier layers comprise at least one doped barrier layer and one undoped barrier layer. The doped barrier layer can improve the carrier mobility of the electron holes and increase the light-emitting area and the internal quantum efficiency of the active layer.

    摘要翻译: 本发明公开了一种发光器件,其包括具有多量子阱(MQW)结构的有源层的半导体叠层层,其包括量子阱层和阻挡层的交替层叠层,其中阻挡层包括至少一个掺杂阻挡层和 一个未掺杂的阻挡层。 掺杂阻挡层可以改善电子空穴的载流子迁移率,增加有源层的发光面积和内部量子效率。

    Logged-based flash memory system and logged-based method for recovering a flash memory system
    23.
    发明申请
    Logged-based flash memory system and logged-based method for recovering a flash memory system 有权
    基于日志的闪存系统和基于日志的方法来恢复闪存系统

    公开(公告)号:US20100061150A1

    公开(公告)日:2010-03-11

    申请号:US12318872

    申请日:2009-01-12

    IPC分类号: G11C16/04 G11C16/06 G11C5/14

    CPC分类号: G11C16/349

    摘要: A flash memory system includes a path selector to determine to write to a non-volatile memory, a volatile memory or both the non-volatile memory and the volatile memory when the flash memory system is to write data. A record is stored in the non-volatile memory which is updated the status of the non-volatile memory after each one or more writing operations. When the flash memory system is powered on after a power loss, it could be recovered to a command executed prior to the power loss or to any checkpoint prior to the power loss by using the record.

    摘要翻译: 闪速存储器系统包括路径选择器,用于在闪存系统要写入数据时确定写入非易失性存储器,易失性存储器或非易失性存储器和易失性存储器。 一个记录被存储在非易失性存储器中,在每个一个或多个写入操作之后更新非易失性存储器的状态。 当闪存系统在掉电后上电时,可以将其恢复到在掉电前执行的命令,或者通过使用该记录恢复到断电前的任何检查点。

    Method and apparatus for treating waste gas containing PFC and/or HFC
    24.
    发明授权
    Method and apparatus for treating waste gas containing PFC and/or HFC 失效
    用于处理含有PFC和/或HFC的废气的方法和设备

    公开(公告)号:US06838065B2

    公开(公告)日:2005-01-04

    申请号:US10425601

    申请日:2003-04-30

    IPC分类号: B01D53/86 B01J23/745 A62D3/00

    摘要: A method for treating waste gas containing PFC and/or HFC, comprising contacting a mixture of gas waste containing PFC and/or HFC, ozone, and water with an iron oxide catalyst at a temperature between 50 and 300° C. by gas-solid contact to perform an oxidation reaction for reducing the amount of PFC and/or HFC. An apparatus for treating waste gas containing PFC or HFC is also provided. The operational temperature in the present invention is much lower than the prior art, and thus provides lower energy consumption and little risk of fire. The present invention is suitable for the treatment of waste gas containing PFC and/or HFC, especially for the removal of perfluorocompounds from the waste gas generated by semiconductor and photoelectrical product manufacturing plants.

    摘要翻译: 一种用于处理含有PFC和/或HFC的废气的方法,包括在50至300℃的温度下,通过气固固体将含PFC和/或HFC,臭氧和水的废气混合物与氧化铁催化剂接触 接触以进行氧化反应以减少PFC和/或HFC的量。 还提供了一种用于处理含有PFC或HFC的废气的设备。 本发明的操作温度远低于现有技术,因此提供了较低的能量消耗和较小的火灾风险。 本发明适用于处理含有PFC和/或HFC的废气,特别是用于从半导体和光电产品制造厂产生的废气中除去全氟化合物。

    OPTIMIZING LIGHT EXTRACTION EFFICIENCY FOR AN LED WAFER
    26.
    发明申请
    OPTIMIZING LIGHT EXTRACTION EFFICIENCY FOR AN LED WAFER 有权
    优化LED散热的光提取效率

    公开(公告)号:US20130260484A1

    公开(公告)日:2013-10-03

    申请号:US13431165

    申请日:2012-03-27

    IPC分类号: H01L21/66

    摘要: The present disclosure involves a method of fabricating a light-emitting diode (LED) wafer. The method first determines a target surface morphology for the LED wafer. The target surface morphology yields a maximum light output for LEDs on the LED wafer. The LED wafer is etched to form a roughened wafer surface. Thereafter, using a laser scanning microscope, the method investigates an actual surface morphology of the LED wafer. Afterwards, if the actual surface morphology differs from the target surface morphology beyond an acceptable limit, the method repeats the etching step one or more times. The etching is repeated by adjusting one or more etching parameters.

    摘要翻译: 本发明涉及一种制造发光二极管(LED)晶片的方法。 该方法首先确定LED晶片的目标表面形态。 目标表面形态为LED晶圆上的LED产生最大的光输出。 蚀刻LED晶片以形成粗糙的晶片表面。 此后,使用激光扫描显微镜,该方法研究了LED晶片的实际表面形态。 此后,如果实际的表面形态与目标表面形态不同,超过可接受的极限,则该方法重复一次或多次蚀刻步骤。 通过调整一个或多个蚀刻参数重复蚀刻。

    Multi-zone temperature control for semiconductor wafer
    28.
    发明授权
    Multi-zone temperature control for semiconductor wafer 有权
    半导体晶圆的多区域温度控制

    公开(公告)号:US08404572B2

    公开(公告)日:2013-03-26

    申请号:US12370746

    申请日:2009-02-13

    IPC分类号: H01L21/425

    摘要: An apparatus includes a process chamber configured to perform an ion implantation process. A cooling platen or electrostatic chuck is provided within the process chamber. The cooling platen or electrostatic chuck is configured to support a semiconductor wafer. The cooling platen or electrostatic chuck has a plurality of temperature zones. Each temperature zone includes at least one fluid conduit within or adjacent to the cooling platen or electrostatic chuck. At least two coolant sources are provided, each fluidly coupled to a respective one of the fluid conduits and configured to supply a respectively different coolant to a respective one of the plurality of temperature zones during the ion implantation process. The coolant sources include respectively different chilling or refrigeration units.

    摘要翻译: 一种装置包括被配置为执行离子注入工艺的处理室。 在处理室内设有冷却台板或静电吸盘。 冷却台板或静电卡盘构造成支撑半导体晶片。 冷却台板或静电卡盘具有多个温度区域。 每个温度区域包括在冷却压板或静电卡盘内或附近的至少一个流体导管。 提供至少两个冷却剂源,每个冷却剂源流体耦合到相应的一个流体导管,并且构造成在离子注入过程期间将分别不同的冷却剂供应到多个温度区中的相应的一个温度区。 冷却剂源分别包括不同的冷却或制冷装置。