公开(公告)号：US11522048B2

公开(公告)日：2022-12-06

申请号：US16361861

申请日：2019-03-22

申请人： Intel Corporation

发明人： Cory Bomberger ,  Anand Murthy ,  Mark T. Bohr ,  Tahir Ghani ,  Biswajeet Guha

IPC分类号： H01L29/08 ,  H01L29/66 ,  H01L29/423 ,  H01L29/78 ,  H01L29/417

摘要： Gate-all-around integrated circuit structures having source or drain structures with epitaxial nubs, and methods of fabricating gate-all-around integrated circuit structures having source or drain structures with epitaxial nubs, are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires and a second vertical arrangement of horizontal nanowires. A first pair of epitaxial source or drain structures includes vertically discrete portions aligned with the first vertical arrangement of horizontal nanowires. A second pair of epitaxial source or drain structures includes vertically discrete portions aligned with the second vertical arrangement of horizontal nanowires. A conductive contact structure is laterally between and in contact with the one of the first pair of epitaxial source or drain structures and the one of the second pair of epitaxial source or drain structures.

公开(公告)号：US11257804B2

公开(公告)日：2022-02-22

申请号：US16902123

申请日：2020-06-15

申请人： INTEL CORPORATION

发明人： Wilfred Gomes ,  Mark T. Bohr ,  Rajesh Kumar ,  Robert L. Sankman ,  Ravindranath V. Mahajan ,  Wesley D. Mc Cullough

IPC分类号： H01L25/18 ,  H01L23/48 ,  H01L25/00 ,  H01L23/00 ,  H01L23/538 ,  H01L23/522 ,  H01L25/16 ,  H01L25/065 ,  H01L23/498

摘要： The present disclosure is directed to systems and methods of conductively coupling a plurality of relatively physically small core dies to a relatively physically larger base die using an electrical mesh network that is formed in whole or in part in, on, across, or about all or a portion of the base die. Electrical mesh networks beneficially permit the positioning of the cores in close proximity to support circuitry carried by the base die. The minimal separation between the core circuitry and the support circuitry advantageously improves communication bandwidth while reducing power consumption. Each of the cores may include functionally dedicated circuitry such as processor core circuitry, field programmable logic, memory, or graphics processing circuitry. The use of core dies beneficially and advantageously permits the use of a wide variety of cores, each having a common or similar interface to the electrical mesh network.

公开(公告)号：US10892215B2

公开(公告)日：2021-01-12

申请号：US16408314

申请日：2019-05-09

申请人： Intel Corporation

发明人： Donald W. Nelson ,  Mark T. Bohr ,  Patrick Morrow

IPC分类号： H01L23/52 ,  H01L23/498 ,  H01L23/528 ,  H01L49/02

摘要： An apparatus including a circuit structure including a device stratum; and a contact coupled to a supply line and routed through the device stratum and coupled to at least one device on a first side. A method including providing a supply from a package substrate to at least one transistor in a device stratum of a circuit structure; and distributing the supply to the at least one transistor using a supply line on an underside of the device stratum and contacting the at least one transistor on a device side by routing a contact from the supply line through the device stratum. A system including a package substrate, and a die including at least one supply line disposed on an underside of a device stratum and routed through the device stratum and coupled to at least one of a plurality of transistor devices on the device side.

公开(公告)号：US20190312023A1

公开(公告)日：2019-10-10

申请号：US16348105

申请日：2016-12-07

申请人： Intel Corporation

发明人： Patrick Morrow ,  Mauro J. Kobrinsky ,  Mark T. Bohr ,  Tahir Ghani ,  Rishabh Mehandru ,  Ranjith Kumar

IPC分类号： H01L27/02 ,  H01L27/088 ,  H01L29/417 ,  H01L21/768

摘要： Integrated circuit (IC) cell architectures including a crenellated interconnect trace layout. A crenellated trace layout may be employed where an IC cell includes transistor having a source/drain terminal interconnected through a back-side (3D) routing scheme that reduces front-side routing density for a given transistor footprint. In the crenellated layout, adjacent interconnect traces or tracks may have their ends staggered according to a crenellation phase for the cell. Crenellated tracks may intersect one cell boundary with adjacent tracks intersecting an opposite cell boundary. Track ends may be offset by at least the width of an underlying orthogonal interconnect trace. Crenellated track ends may be offset by the width of an underlying orthogonal interconnect trace and half a spacing between adjacent orthogonal interconnect traces.

公开(公告)号：US20190206834A1

公开(公告)日：2019-07-04

申请号：US15857731

申请日：2017-12-29

申请人： Intel Corporation

发明人： Wilfred Gomes ,  Mark T. Bohr ,  Udi Sherel ,  Leonard M. Neiberg ,  Nevine Nassif ,  Wesley D. Mc Cullough

IPC分类号： H01L25/065 ,  H01L25/18 ,  H01L25/00

CPC分类号： H01L25/0652 ,  H01L25/18 ,  H01L25/50 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527

摘要： Systems and methods of providing redundant functionality in a semiconductor die and package are provided. A three-dimensional electrical mesh network conductively couples smaller semiconductor dies, each including circuitry to provide a first functionality, to a larger base die that includes circuitry to provide a redundant first functionality to the semiconductor die circuitry. The semiconductor die circuitry and the base die circuitry selectively conductively couple to a common conductive structure such that either the semiconductor die circuitry or the base die circuitry is able to provide the first functionality at the conductive structure. Driver circuitry may autonomously or manually, reversibly or irreversibly, cause the semiconductor die circuitry and the base die circuitry couple to the conductive structure. The redundant first functionality circuitry improves the operational flexibility and reliability of the semiconductor die and package.

公开(公告)号：US10325840B2

公开(公告)日：2019-06-18

申请号：US15747988

申请日：2015-09-25

申请人： Intel Corporation

发明人： Donald W. Nelson ,  Mark T. Bohr ,  Patrick Morrow

IPC分类号： H01L23/50 ,  H01L23/498 ,  H01L23/528 ,  H01L49/02

摘要： An apparatus including a circuit structure including a device stratum; and a contact coupled to a supply line and routed through the device stratum and coupled to at least one device on a first side. A method including providing a supply from a package substrate to at least one transistor in a device stratum of a circuit structure; and distributing the supply to the at least one transistor using a supply line on an underside of the device stratum and contacting the at least one transistor on a device side by routing a contact from the supply line through the device stratum. A system including a package substrate, and a die including at least one supply line disposed on an underside of a device stratum and routed through the device stratum and coupled to at least one of a plurality of transistor devices on the device side.

公开(公告)号：US09391013B2

公开(公告)日：2016-07-12

申请号：US14813014

申请日：2015-07-29

申请人： Intel Corporation

发明人： Debendra Mallik ,  Ram S. Viswanath ,  Sriram Srinivasan ,  Mark T. Bohr ,  Andrew W. Yeoh ,  Sairam Agraharam

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L23/13 ,  H01L25/065

CPC分类号： H01L23/49838 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/00

摘要： 3D integrated circuit packages with window interposers and methods to form such semiconductor packages are described. For example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer having a window is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in the window of the interposer and interconnected to the top semiconductor die. In another example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in a same plane as the interposer and interconnected to the top semiconductor die.

公开(公告)号：US20150270216A1

公开(公告)日：2015-09-24

申请号：US14731363

申请日：2015-06-04

申请人： Intel Corporation

发明人： Mark T. Bohr ,  Tahir Ghani ,  Nadia M. Rahhai-Orabi ,  Subhash M. Joshi ,  Joseph M. Steigerwald ,  Jason W. Klaus ,  Jack Hwang ,  Ryan Mackiewicz

IPC分类号： H01L23/522 ,  H01L29/423 ,  H01L29/08 ,  H01L29/51 ,  H01L23/528 ,  H01L21/28 ,  H01L21/283 ,  H01L21/311 ,  H01L21/768 ,  H01L29/78 ,  H01L29/66

CPC分类号： H01L21/76897 ,  H01L21/28123 ,  H01L21/28229 ,  H01L21/28255 ,  H01L21/283 ,  H01L21/28562 ,  H01L21/31105 ,  H01L21/76802 ,  H01L21/76831 ,  H01L21/76849 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/535 ,  H01L29/0847 ,  H01L29/16 ,  H01L29/42364 ,  H01L29/456 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/512 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66477 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/78 ,  H01L29/785 ,  H01L2029/7858 ,  H01L2924/0002 ,  H01L2924/00

摘要： A transistor comprises a substrate, a pair of spacers on the substrate, a gate dielectric layer on the substrate and between the pair of spacers, a gate electrode layer on the gate dielectric layer and between the pair of spacers, an insulating cap layer on the gate electrode layer and between the pair of spacers, and a pair of diffusion regions adjacent to the pair of spacers. The insulating cap layer forms an etch stop structure that is self aligned to the gate and prevents the contact etch from exposing the gate electrode, thereby preventing a short between the gate and contact. The insulator-cap layer enables self-aligned contacts, allowing initial patterning of wider contacts that are more robust to patterning limitations.

摘要翻译： 晶体管包括衬底，衬底上的一对间隔物，衬底上的栅介质层和一对间隔物之间​​，栅极电介质层上的栅电极层和一对衬垫之间的绝缘帽层 栅极电极层和一对间隔物之间​​，以及与该对间隔物相邻的一对扩散区域。 绝缘盖层形成了与栅极自对准的防蚀结构，并防止接触蚀刻暴露栅电极，从而防止栅极和接触之间的短路。 绝缘体盖层能够进行自对准触点，允许对图案化限制更坚固的较宽触点的初始图案化。

公开(公告)号：US11737253B2

公开(公告)日：2023-08-22

申请号：US16605903

申请日：2017-06-22

申请人： Intel Corporation

发明人： Zheng Guo ,  Clifford L. Ong ,  Eric A. Karl ,  Mark T. Bohr

IPC分类号： H10B10/00 ,  H01L23/528 ,  H01L27/02 ,  H01L27/092

CPC分类号： H10B10/12 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/0924

摘要： Uniform layouts for SRAM and register file bit cells are described. In an example, an integrated circuit structure includes a six transistor (6T) static random access memory (SRAM) bit cell on a substrate. The 6T SRAM bit cell includes first and second active regions parallel along a first direction of the substrate. First, second, third and fourth gate lines are over the first and second active regions, the first, second, third and fourth gate lines parallel along a second direction of the substrate, the second direction perpendicular to the first direction.

公开(公告)号：US11437514B2

公开(公告)日：2022-09-06

申请号：US16918314

申请日：2020-07-01

申请人： INTEL CORPORATION

发明人： Mark T. Bohr

IPC分类号： H01L29/78 ,  H01L29/04 ,  H01L29/06 ,  H01L29/08 ,  H01L29/737 ,  H01L21/84 ,  H01L29/165 ,  H01L29/66 ,  H01L29/161 ,  H01L29/167

摘要： A semiconductor device having tipless epitaxial source/drain regions and a method for its formation are described. In an embodiment, the semiconductor device comprises a gate stack on a substrate. The gate stack is comprised of a gate electrode above a gate dielectric layer and is above a channel region in the substrate. The semiconductor device also comprises a pair of source/drain regions in the substrate on either side of the channel region. The pair of source/drain regions is in direct contact with the gate dielectric layer and the lattice constant of the pair of source/drain regions is different than the lattice constant of the channel region. In one embodiment, the semiconductor device is formed by using a dielectric gate stack placeholder.