公开(公告)号：US11137807B2

公开(公告)日：2021-10-05

申请号：US15938291

申请日：2018-03-28

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Nikhil Gupta ,  Vasudevan Srinivasan

IPC: G06F1/20 ,  G06F1/32 ,  G06F1/324 ,  G06F1/3296

Abstract: In one embodiment, a processor includes a non-volatile storage to store a plurality of configurations for the processor, the non-volatile storage including a plurality of entries to store configuration information for the processor for one of the plurality of configurations, the configuration information including at least one of a guaranteed operating frequency and a core count, at least one of the entries to store the core count. The processor further includes a power controller to control the processor to operate at one of the plurality of configurations based at least in part on a selected thermal set point of a plurality of thermal set points of the processor, each of the plurality of thermal set points associated with one of the configurations. Other embodiments are described and claimed.

公开(公告)号：US20190204885A1

公开(公告)日：2019-07-04

申请号：US16353083

申请日：2019-03-14

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Jeremy Ridge ,  Michael Berktold

IPC: G06F1/20 ,  G06F1/3203

CPC classification number: G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3243 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/152 ,  Y02D10/16 ,  Y02D10/172 ,  Y02D50/20

Abstract: In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.

公开(公告)号：US20180270993A1

公开(公告)日：2018-09-20

申请号：US15462261

申请日：2017-03-17

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Sandeep Ahuja

IPC: H05K7/20 ,  F28D15/04

CPC classification number: H05K7/20336 ,  F28D1/0477 ,  F28D15/046 ,  H01L23/3672 ,  H01L23/427 ,  H05K7/20809

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide an evaporator including a chamber to receive condensate flow from an input end and output a vapor outflow at an output end with a wick, heated by a surface of the chamber, having variable thickness within the chamber to receive condensate, where the thickness of the wick proximate to the condensate inflow is greater than the thickness of the wick proximate to the vapor outflow. Other embodiments may be described and/or claimed.

公开(公告)号：US20160155682A1

公开(公告)日：2016-06-02

申请号：US15019931

申请日：2016-02-09

Applicant: INTEL CORPORATION

Inventor： Sandeep Ahuja ,  Eric W. Buddrius ,  Roger D. Flynn ,  Rajat Agarwal

IPC: H01L23/36 ,  H01L25/00 ,  H01L25/065 ,  H01L23/433 ,  H01L21/48

CPC classification number: H01L23/36 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/433 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K7/20445 ,  Y10T29/49002 ,  H01L2924/00

Abstract: In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.

Abstract translation: 在至少一些实施例中，使热传递最大化的电子封装包括在基板上的多个部件。 组件上安装有加强板。 加强板具有露出部件的开口。 多个单独的集成散热器安装在部件的开口内。 第一热界面材料层（TIM1）沉积在组件和多个单独的集成散热器之间。 在至少一些实施例中，对于部件，TIM1的厚度最小化。

公开(公告)号：US11842943B2

公开(公告)日：2023-12-12

申请号：US16986122

申请日：2020-08-05

Applicant: Intel Corporation

Inventor： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L. Smalley ,  Minh T. D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Fernando Gonzalez Lenero ,  Carlos Alvizo Flores

IPC: H01L23/367 ,  H05K7/20 ,  H05K7/14 ,  G11C5/06

CPC classification number: H01L23/3677 ,  G11C5/06 ,  H05K7/1422 ,  H05K7/20509

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

公开(公告)号：US20230253288A1

公开(公告)日：2023-08-10

申请号：US17668236

申请日：2022-02-09

Applicant: Intel Corporation

Inventor： Abdulafeez Adebiyi ,  Je-Young Chang ,  Devdatta Kulkarni ,  Sandeep Ahuja

IPC: H01L23/373 ,  H01L23/427 ,  H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29

CPC classification number: H01L23/3733 ,  H01L23/427 ,  H01L25/0655 ,  H01L21/4871 ,  H01L21/56 ,  H01L23/291 ,  H01L23/29 ,  H01L23/3732 ,  H01L24/13

Abstract: An integrated circuit device may include an integrated circuit die coupled to a substrate, and a porous material on the die or a thermal interface material and extending beyond the edges of the die and over the substrate. An integrated circuit system may include a substrate with a power supply and an integrated circuit die, such that a porous material on the die extends over the substrate beyond a footprint of the die. A porous material may be formed on and beyond an edge of a received integrated circuit die coupled to a substrate or a thermal interface material on the die.

公开(公告)号：US10908660B2

公开(公告)日：2021-02-02

申请号：US16353083

申请日：2019-03-14

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Jeremy Ridge ,  Michael Berktold

IPC: G06F1/32 ,  G06F1/20 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3296 ,  G06F1/3234 ,  G01K3/08

Abstract: In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.

公开(公告)号：US10667438B2

公开(公告)日：2020-05-26

申请号：US13728174

申请日：2012-12-27

Applicant: INTEL CORPORATION

Inventor： Robin A. Steinbrecher ,  Nishi Ahuja ,  Sandeep Ahuja

IPC: G06F11/30 ,  G21C17/00 ,  G01K1/08 ,  H05K7/20 ,  G05B23/02

Abstract: A method for determining whether to perform maintenance for an electronic device includes generating a baseline characterization of thermal performance for a heat-generating component of the electronic device at a baseline date. The method also includes generating an assessment characterization of the thermal performance at an assessment date after the baseline date. The method further includes generating a historical trend that includes the baseline characterization and the assessment characterization. Additionally, the method includes determining whether to perform maintenance for the heat-generating component based on the historical trend and a specified maintenance parameter.

公开(公告)号：US10248173B2

公开(公告)日：2019-04-02

申请号：US15086387

申请日：2016-03-31

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Jeremy Ridge ,  Michael Berktold

IPC: G06F1/20 ,  G06F1/32 ,  G06F1/3203 ,  G01K3/08

Abstract: In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.

公开(公告)号：US20190041925A1

公开(公告)日：2019-02-07

申请号：US15938291

申请日：2018-03-28

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Nikhil Gupta ,  Vasudevan Srinivasan

IPC: G06F1/20 ,  G06F1/32

Abstract: In one embodiment, a processor includes a non-volatile storage to store a plurality of configurations for the processor, the non-volatile storage including a plurality of entries to store configuration information for the processor for one of the plurality of configurations, the configuration information including at least one of a guaranteed operating frequency and a core count, at least one of the entries to store the core count. The processor further includes a power controller to control the processor to operate at one of the plurality of configurations based at least in part on a selected thermal set point of a plurality of thermal set points of the processor, each of the plurality of thermal set points associated with one of the configurations. Other embodiments are described and claimed.