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公开(公告)号：US10685919B2
公开(公告)日：2020-06-16
申请号：US15426083
申请日：2017-02-07
Applicant: International Business Machines Corporation
Inventor： Mark C. Lamorey , Shidong Li , Janak G. Patel , Douglas O. Powell , David J. Russell , Peter Slota, Jr. , David B. Stone
Abstract: A laminate structure includes a conductive layer and a dielectric layer in contact with the conductive layer, the dielectric layer comprises a selectively patterned high-modulus dielectric material that balances a differential stress between the conductive layer and the dielectric layer to mechanically stiffen the laminate structure and reduce warpage.
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公开(公告)号：US10172243B2
公开(公告)日：2019-01-01
申请号：US15351066
申请日：2016-11-14
Applicant: International Business Machines Corporation
Inventor： Bruce J. Chamberlin , Scott B. King , Joseph Kuczynski , David J. Russell
Abstract: In some embodiments, methods include drilling one or a plurality of PTHs with any industrial grade drill to fabricate holes with positive etch back, flooding the PTHs with a dilute solution of an acrylate monomer/oligomer containing an appropriate level of peroxide initiator, polymerizing the acrylate, and then rising the PTHs with the solvent used in the formulation of the acrylate material. In one embodiment, the printed circuit board may include a substrate comprising a plurality of metal layers separated by a plurality of insulating layers; a plurality of plated through holes formed in the substrate, each plated through hole comprising: recesses formed at each insulating layer, copper lands between the recesses, a polymer coating in each recess, and a metal layer lining the plated through hole.
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公开(公告)号：US10108753B2
公开(公告)日：2018-10-23
申请号：US15176101
申请日：2016-06-07
Applicant: International Business Machines Corporation
Inventor： Anson J. Call , Vijayeshwar D. Khanna , David J. Russell , Krishna R. Tunga
IPC: G06F17/50
Abstract: Method of designing a laminate substrate having upper laminate layers and an equal plurality of lower laminate layers including: dividing the laminate substrate into regions having corresponding laminate layer pairs consisting of an upper laminate layer and a lower laminate layer; calculating a net stretching value for each corresponding laminate layer pair in each region to result in net stretching values in each region; summing the net stretching values in each region to result in a net stretching value for each region proportional to a curvature of each local region; calculating a relative out-of-plane displacement for the laminate substrate from the curvature of each local region; calculating a predicted thermal warpage for the laminate substrate; and finalizing a design of the laminate substrate when the predicted thermal warpage is within a predetermined acceptable range.
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公开(公告)号：US09913405B2
公开(公告)日：2018-03-06
申请号：US14668017
申请日：2015-03-25
Applicant: International Business Machines Corporation
Inventor： Jeffrey P. Gambino , Richard S. Graf , Sudeep Mandal , David J. Russell
CPC classification number: H05K7/2039 , H01L23/13 , H01L23/15 , H01L23/38 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L35/34 , H01L2224/13099 , H01L2224/16225 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H05K1/0306 , H05K2201/10219 , H05K2201/10378 , H01L2924/014 , H01L2924/00014 , H01L2924/00012
Abstract: The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having one or more embedded peltier devices, alongside electrically conductive vias, to help dissipate heat from one or more IC chips in a multi-dimensional chip package through the glass interposer and into an organic carrier, where it can be dissipated into an underlying substrate.
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公开(公告)号：US20180023225A1
公开(公告)日：2018-01-25
申请号：US15216195
申请日：2016-07-21
Applicant: International Business Machines Corporation
Inventor： Bruce J. Chamberlin , Scott B. King , Joseph Kuczynski , David J. Russell
IPC: D03D15/00
Abstract: A glass fiber cloth includes a first warp glass fiber, a second warp glass fiber, and a weft glass fiber. The second warp glass fiber is adjacent to the first warp glass fiber. The weft glass fiber is overlaid over the first warp glass fiber and the second warp glass fiber. The weft glass fiber is attached to the first warp glass fiber.
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Patent Agency Ranking
公开(公告)号：US09613915B2
公开(公告)日：2017-04-04
申请号：US14557795
申请日：2014-12-02
Applicant: International Business Machines Corporation
Inventor： Mark C. Lamorey , Shidong Li , Janak G. Patel , Douglas O. Powell , David J. Russell , Peter Slota, Jr. , David B. Stone
IPC: H01L23/00 , H01L23/498 , H01L21/48 , H05K3/10 , H05K1/02
CPC classification number: H01L23/562 , H01L21/4846 , H01L21/4857 , H01L23/04 , H01L23/49805 , H01L23/49816 , H01L23/49822 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/3511 , H05K1/0271 , H05K3/10 , Y10T29/49155 , H01L2924/00012 , H01L2924/00
Abstract: A laminate structure includes a conductive layer and a dielectric layer in contact with the conductive layer, the dielectric layer comprises a selectively patterned high-modulus dielectric material that balances a differential stress between the conductive layer and the dielectric layer to mechanically stiffen the laminate structure and reduce warpage.
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公开(公告)号：US09563732B1
公开(公告)日：2017-02-07
申请号：US15006567
申请日：2016-01-26
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Anson J. Call , Vijayeshwar D. Khanna , David J. Russell , Krishna R. Tunga
CPC classification number: G06F17/5068 , G06F2217/44 , H05K1/0271 , H05K3/0005
Abstract: A method of predicting warpage of a laminate is disclosed in which in-plane copper imbalance is calculated. A method of designing an organic build-up laminate is provided in which in-plane copper imbalance is calculated and imbalances are corrected.
Abstract translation: 公开了一种预测层压板的翘曲的方法，其中计算了平面内的不平衡。 提供一种设计有机积层叠板的方法，其中计算面内铜不平衡并校正不平衡。
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公开(公告)号：US20160286686A1
公开(公告)日：2016-09-29
申请号：US14668017
申请日：2015-03-25
Applicant: International Business Machines Corporation
Inventor： Jeffrey P. Gambino , Richard S. Graf , Sudeep Mandal , David J. Russell
CPC classification number: H05K7/2039 , H01L23/13 , H01L23/15 , H01L23/38 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L35/34 , H01L2224/13099 , H01L2224/16225 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H05K1/0306 , H05K2201/10219 , H05K2201/10378 , H01L2924/014 , H01L2924/00014 , H01L2924/00012
Abstract: The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having one or more embedded peltier devices, alongside electrically conductive vias, to help dissipate heat from one or more IC chips in a multi-dimensional chip package through the glass interposer and into an organic carrier, where it can be dissipated into an underlying substrate.
Abstract translation: 本发明一般涉及集成电路（IC）芯片封装，更具体地，涉及一种形成具有一个或多个嵌入式珀耳帖器件的玻璃插入件以及导电通孔的结构和方法，以帮助从一个或多个IC散发热量 通过玻璃插入件将芯片封装在多维芯片封装中，并进入有机载体，在其中可将其分散到下面的基板中。
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公开(公告)号：US20140339699A1
公开(公告)日：2014-11-20
申请号：US14447908
申请日：2014-07-31
Applicant: International Business Machines Corporation
Inventor： Charles L. Arvin , Minhua Lu , Eric D. Perfecto , David J. Russell , Wolfgang Sauter , Krystyna W. Semkow , Thomas A. Wassick
IPC: H01L23/498 , H01L21/768
CPC classification number: H01L23/49816 , H01L21/76843 , H01L21/76885 , H01L23/49866 , H01L2224/11 , H05K1/09 , H05K3/3478 , H05K3/4007 , H05K2201/0338 , H05K2201/0341 , H05K2201/0344 , H05K2201/09745 , H05K2203/041
Abstract: An interconnect structure that includes a substrate having an electrical component present therein, and a under-bump metallurgy (UBM) stack that is present in contact with a contact pad to the electrical component that is present in the substrate. The UBM stack includes a metallic adhesion layer that is direct contact with the contact pad to the electrical component, a copper (Cu) seed layer that is in direct contact with the metallic adhesion layer layer, a first nickel (Ni) barrier layer that is present in direct contact with copper (Cu) seed layer, and a layered structure of at least one copper (Cu) conductor layer and at least one second nickel (Ni) barrier layer present on the first nickel (Ni) barrier layer. A solder ball may be present on second nickel (Ni) barrier layer.
Abstract translation: 一种互连结构，其包括其中存在电气部件的基板以及与接触焊盘接触的凸起下冶金（UBM）堆叠，所述凸块冶金（UBM）堆叠存在于所述基板中的所述电气部件。 UBM堆叠包括与接触焊盘直接接触电气部件的金属粘合层，与金属粘附层层直接接触的铜（Cu）种子层，第一镍（Ni）阻挡层， 存在于铜（Cu）种子层的直接接触中，以及存在于第一镍（Ni）阻挡层上的至少一个铜（Cu）导体层和至少一个第二镍（Ni）阻挡层的层状结构。 第二镍（Ni）阻挡层上可能存在焊球。
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公开(公告)号：US10801137B2
公开(公告)日：2020-10-13
申请号：US15216195
申请日：2016-07-21
Applicant: International Business Machines Corporation
Inventor： Bruce J. Chamberlin , Scott B. King , Joseph Kuczynski , David J. Russell
Abstract: A glass fiber cloth includes a first warp glass fiber, a second warp glass fiber, and a weft glass fiber. The second warp glass fiber is adjacent to the first warp glass fiber. The weft glass fiber is overlaid over the first warp glass fiber and the second warp glass fiber. The weft glass fiber is attached to the first warp glass fiber.
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