Extended platform with additional memory module slots per CPU socket

    公开(公告)号:US10242717B2

    公开(公告)日:2019-03-26

    申请号:US15808390

    申请日:2017-11-09

    Abstract: Electronic devices and methods including a printed circuit board configured to accept CPUs and memory modules are described. One apparatus includes a printed circuit board that includes a first row of elements including a first CPU positioned between first and second groups of dual in-line memory modules (DIMMs). The printed circuit board also includes a second row of elements including a second CPU positioned between third and fourth groups of DIMMs. The apparatus also includes a third row of elements including a fifth group of DIMMs, wherein the second row of elements is positioned between the first row of elements and the third row of elements. Other embodiments are described and claimed.

    Selective performance level modes of operation in a non-volatile memory

    公开(公告)号:US10163502B2

    公开(公告)日:2018-12-25

    申请号:US15396251

    申请日:2016-12-30

    Abstract: In one embodiment, a non-volatile memory is controlled in a selectable read mode in response to commands from a processor. Selectable read modes may include a default read memory mode, for example, and a performance read memory mode having a shorter read pulse and a reduced read latency than the default read memory mode, for example. In one embodiment, the performance read memory mode may also have refresh operations at an increased frequency compared to that of the default read mode. Other aspects and advantages are described.

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