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公开(公告)号:US10241912B2
公开(公告)日:2019-03-26
申请号:US15457847
申请日:2017-03-13
Applicant: Intel Corporation
Inventor: Raj K. Ramanujan , Rajat Agarwal , Kai Cheng , Taarinya Polepeddi , Camille C. Raad , David J. Zimmerman , Muthukumar P. Swaminathan , Dimitrios Ziakas , Mohan J. Kumar , Bassam N. Coury , Glenn J. Hinton
IPC: G06F13/12 , G06F13/38 , G06F12/0811 , G06F12/0897 , G11C11/406 , G11C14/00 , G06F12/0895
Abstract: A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as “far memory.” Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as “near memory.”
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公开(公告)号:US10025737B2
公开(公告)日:2018-07-17
申请号:US14731183
申请日:2015-06-04
Applicant: Intel Corporation
Inventor: Shekoufeh Qawami , Rajesh Sundaram , David J. Zimmerman , Robert W. Faber
IPC: G06F13/28 , G06F13/16 , G06F12/02 , G06F13/42 , G11C7/22 , G06F1/12 , G06F13/40 , G06F13/38 , H04L5/00 , H04L7/00
Abstract: A nonvolatile storage or memory device is accessed over a memory bus. The memory bus has an electrical interface typically used for volatile memory devices. A controller coupled to the bus sends synchronous data access commands to the nonvolatile memory device, and reads the response from the device bus based on an expected timing of a reply from the nonvolatile memory device. The controller determines the expected timing based on when the command was sent, and characteristics of the nonvolatile memory device. The controller may not need all the electrical signal lines available on the memory bus, and could issue data access commands to different groups of nonvolatile memory devices over different groups of electrical signal lines. The memory bus may be available and configured for either use with a memory controller and volatile memory devices, or a storage controller and nonvolatile memory devices.
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公开(公告)号:US09564245B2
公开(公告)日:2017-02-07
申请号:US14141239
申请日:2013-12-26
Applicant: INTEL CORPORATION
Inventor: Bruce Querbach , Theodore Z. Schoenborn , David J. Zimmerman , David G. Ellis , Christopher W. Hampson , Ifar Wan , Yulan Zhang , Ramakrishna Mallela , William K. Lui
IPC: G06F11/263 , G06F11/27 , G11C11/406 , G11C29/00 , G11C29/36 , G11C29/44 , G11C29/10
CPC classification number: G11C29/36 , G06F11/263 , G06F11/27 , G11C11/406 , G11C29/10 , G11C29/4401 , G11C29/72 , G11C29/78 , G11C2029/4402
Abstract: In accordance with the present description, a device includes an internal defect detection and repair circuit which includes a self-test logic circuit built in within the device and a self-repair logic circuit also built in within the device. In one embodiment, the built in self-test logic circuit may be configured to automatically identify defective memory cells in a memory. Upon identifying one or more defective memory cells, the built in self-repair logic circuit may be configured to automatically repair the defective memory cells by replacing defective cells with spare cells within the memory.
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公开(公告)号:US09476940B2
公开(公告)日:2016-10-25
申请号:US14145478
申请日:2013-12-31
Applicant: Intel Corporation
Inventor: David J. Zimmerman
IPC: G11C5/04 , G11C29/32 , G01R31/3185 , G01R31/3177
CPC classification number: G11C29/32 , G01R31/3177 , G01R31/318513 , G01R31/318558 , G01R31/318572 , G11C5/04 , G11C11/4087 , H01L2924/0002 , H01L2924/00
Abstract: A boundary scan chain for stacked memory. An embodiment of a memory device includes a system element and a memory stack including one or more memory die layers, each memory die layer including input-output (I/O) cells and a boundary scan chain for the I/O cells. A boundary scan chain of a memory die layer includes a scan chain portion for each of the I/O cells, the scan chain portion for an I/O cell including a first scan logic multiplexer a scan logic latch, an input of the scan logic latch being coupled with an output of the first scan logic multiplexer, and a decoder to provide command signals to the boundary scan chain.
Abstract translation: 堆叠式存储器的边界扫描链。 存储器件的实施例包括系统元件和包括一个或多个存储管芯层的存储器堆叠,每个存储器管芯层包括用于I / O单元的输入输出(I / O)单元和边界扫描链。 存储芯片层的边界扫描链包括用于每个I / O单元的扫描链部分,用于I / O单元的扫描链部分包括第一扫描逻辑多路复用器,扫描逻辑锁存器,扫描逻辑的输入 锁存器与第一扫描逻辑多路复用器的输出耦合,以及解码器,用于向边界扫描链提供命令信号。
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公开(公告)号:US10541009B2
公开(公告)日:2020-01-21
申请号:US15857349
申请日:2017-12-28
Applicant: Intel Corporation
Inventor: David J. Zimmerman , Robert M. Ellis , Rajesh Sundaram
Abstract: Devices, systems, and methods having increased efficiency selective writing to memory are disclosed and described. A memory controller, upon receiving a dirty data segment, performs a read-modify-write to retrieve a corresponding data line from memory, saves a copy of the data line, merges the dirty data segment into the appropriate location in the data line to create a modified data line, and generates a write mask from the modified data line and the copy of the data line.
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公开(公告)号:US10347354B2
公开(公告)日:2019-07-09
申请号:US15293123
申请日:2016-10-13
Applicant: Intel Corporation
Inventor: David J. Zimmerman
IPC: G11C5/04 , G11C29/32 , G11C11/408 , G01R31/3177 , G01R31/3185
Abstract: A boundary scan chain for stacked memory. An embodiment of a memory device includes a system element and a memory stack including one or more memory die layers, each memory die layer including input-output (I/O) cells and a boundary scan chain for the I/O cells. A boundary scan chain of a memory die layer includes a scan chain portion for each of the I/O cells, the scan chain portion for an I/O cell including a first scan logic multiplexer a scan logic latch, an input of the scan logic latch being coupled with an output of the first scan logic multiplexer, and a decoder to provide command signals to the boundary scan chain.
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公开(公告)号:US09922725B2
公开(公告)日:2018-03-20
申请号:US15368402
申请日:2016-12-02
Applicant: INTEL CORPORATION
Inventor: Bruce Querbach , William K. Lui , David G. Ellis , David J. Zimmerman , Theodore Z. Schoenborn , Christopher W. Hampson , Ifar Wan , Yulan Zhang
IPC: G11C29/44 , G11C29/36 , G11C29/18 , G11C29/16 , G11C29/12 , G11C29/00 , G06F11/27 , G06F11/263 , G11C29/38 , G11C29/10 , G11C29/20 , G11C11/406
CPC classification number: G11C29/38 , G06F11/263 , G06F11/27 , G11C11/406 , G11C29/10 , G11C29/1201 , G11C29/16 , G11C29/18 , G11C29/20 , G11C29/36 , G11C29/4401 , G11C29/72 , G11C29/78 , G11C29/783 , G11C2029/1202 , G11C2029/1204 , G11C2029/1206 , G11C2029/1208 , G11C2029/3602 , G11C2029/4402
Abstract: In accordance with the present description, a device includes an internal defect detection and repair circuit which includes a self-test logic circuit built in within the device and a self-repair logic circuit also built in within the device. In one embodiment, the built in self-test logic circuit may be configured to automatically identify defective memory cells in a memory. Upon identifying one or more defective memory cells, the built in self-repair logic circuit may be configured to automatically repair the defective memory cells by replacing defective cells with spare cells within the memory. In one embodiment, data patterns are generated as a function of memory addresses and periodic address offsets.
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公开(公告)号:US09548137B2
公开(公告)日:2017-01-17
申请号:US14320164
申请日:2014-06-30
Applicant: INTEL CORPORATION
Inventor: Bruce Querbach , William K. Lui , David G. Ellis , David J. Zimmerman , Theodore Z. Schoenborn , Christopher W. Hampson , Ifar Wan , Yulan Zhang
IPC: G11C29/44 , G11C29/36 , G11C29/10 , G11C29/00 , G11C11/406 , G06F11/27 , G06F11/263
CPC classification number: G11C29/38 , G06F11/263 , G06F11/27 , G11C11/406 , G11C29/10 , G11C29/1201 , G11C29/16 , G11C29/18 , G11C29/20 , G11C29/36 , G11C29/4401 , G11C29/72 , G11C29/78 , G11C29/783 , G11C2029/1202 , G11C2029/1204 , G11C2029/1206 , G11C2029/1208 , G11C2029/3602 , G11C2029/4402
Abstract: In accordance with the present description, a device includes an internal defect detection and repair circuit which includes a self-test logic circuit built in within the device and a self-repair logic circuit also built in within the device. In one embodiment, the built in self-test logic circuit may be configured to automatically identify defective memory cells in a memory. Upon identifying one or more defective memory cells, the built in self-repair logic circuit may be configured to automatically repair the defective memory cells by replacing defective cells with spare cells within the memory.
Abstract translation: 根据本说明书,装置包括内部缺陷检测和修复电路,其包括内置于装置内的自检逻辑电路和内置在装置内的自修复逻辑电路。 在一个实施例中,内置自检逻辑电路可以被配置为自动识别存储器中的有缺陷的存储器单元。 在识别一个或多个有缺陷的存储器单元时,内置的自修复逻辑电路可以被配置为通过用存储器内的备用单元替换有缺陷的单元来自动修复有缺陷的存储器单元。
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公开(公告)号:US10719443B2
公开(公告)日:2020-07-21
申请号:US16363992
申请日:2019-03-25
Applicant: Intel Corporation
Inventor: Raj K. Ramanujan , Rajat Agarwal , Kai Cheng , Taarinya Polepeddi , Camille C. Raad , David J. Zimmerman , Muthukumar P. Swaminathan , Dimitrios Ziakas , Mohan J. Kumar , Bassam N. Coury , Glenn J. Hinton
IPC: G11C11/406 , G06F12/0811 , G06F12/0895 , G06F12/0897 , G11C14/00
Abstract: A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as “far memory.” Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as “near memory.”
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公开(公告)号:US09064560B2
公开(公告)日:2015-06-23
申请号:US14075765
申请日:2013-11-08
Applicant: Intel Corporation
Inventor: Shekoufeh Qawami , Rajesh Sundaram , David J. Zimmerman , Robert W. Faber
CPC classification number: G06F13/28 , G06F1/12 , G06F12/0246 , G06F13/1689 , G06F13/1694 , G06F13/385 , G06F13/409 , G06F13/42 , G06F2212/7201 , G06F2212/7203 , G11C7/222 , H04L5/00 , H04L7/00 , Y02D10/14 , Y02D10/151
Abstract: A nonvolatile storage or memory device is accessed over a memory bus. The memory bus has an electrical interface typically used for volatile memory devices. A controller coupled to the bus sends synchronous data access commands to the nonvolatile memory device, and reads the response from the device bus based on an expected timing of a reply from the nonvolatile memory device. The controller determines the expected timing based on when the command was sent, and characteristics of the nonvolatile memory device. The controller may not need all the electrical signal lines available on the memory bus, and could issue data access commands to different groups of nonvolatile memory devices over different groups of electrical signal lines. The memory bus may be available and configured for either use with a memory controller and volatile memory devices, or a storage controller and nonvolatile memory devices.
Abstract translation: 通过存储器总线访问非易失性存储器或存储器件。 存储器总线具有通常用于易失性存储器件的电接口。 耦合到总线的控制器向非易失性存储器件发送同步数据访问命令,并且基于来自非易失性存储器件的回复的期望定时从设备总线读取响应。 控制器基于何时发送命令和非易失性存储器件的特性来确定预期时序。 控制器可能不需要存储器总线上可用的所有电信号线,并且可以通过不同的电信号线组向不同组的非易失性存储器件发出数据访问命令。 存储器总线可以可用并且被配置用于与存储器控制器和易失性存储器设备或存储控制器和非易失性存储器设备一起使用。
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