Crystal formation on non-lattice matched substrates
    22.
    发明授权
    Crystal formation on non-lattice matched substrates 有权
    非晶格匹配基底上的晶体形成

    公开(公告)号:US09349591B2

    公开(公告)日:2016-05-24

    申请号:US14525594

    申请日:2014-10-28

    IPC分类号: H01L21/02 H01L29/267

    摘要: A semiconductor structure can be created by forming an insulator layer over a surface of a substrate. An intermediate layer can be formed on top of the insulator layer, wherein openings in the intermediate layer may expose regions of the insulator. Openings may be formed in the exposed regions of the insulator layer to create exposed areas of the substrate. A first element of a multi-element semiconductor can be deposited onto the exposed regions of the insulator layer, into the openings in the exposed regions of the insulator layer, and onto the exposed areas of the substrate. A capping layer can be formed over the first element of the multi-element semiconductor. The first element can be melted. A liquid solution can be created by dissolving a second element of the multi-element semiconductor into first element. A multi-element semiconductor, seeded off the substrate, can be formed from the liquid solution.

    摘要翻译: 可以通过在衬底的表面上形成绝缘体层来形成半导体结构。 可以在绝缘体层的顶部上形成中间层,其中中间层中的开口可以暴露绝缘体的区域。 可以在绝缘体层的暴露区域中形成开口,以形成衬底的暴露区域。 可以将多元素半导体的第一元素沉积到绝缘体层的暴露区域上,进入绝缘体层的暴露区域中的开口中以及衬底的暴露区域上。 可以在多元件半导体的第一元件上形成覆盖层。 第一个元素可以融化。 可以通过将多元素半导体的第二元素溶解在第一元素中来产生液体溶液。 可以从液体溶液形成从衬底上撒下的多元素半导体。

    GENERATION OF MULTIPLE DIAMETER NANOWIRE FIELD EFFECT TRANSISTORS
    23.
    发明申请
    GENERATION OF MULTIPLE DIAMETER NANOWIRE FIELD EFFECT TRANSISTORS 审中-公开
    多直径纳米场效应晶体管的生成

    公开(公告)号:US20140239254A1

    公开(公告)日:2014-08-28

    申请号:US13864798

    申请日:2013-04-17

    IPC分类号: H01L29/06 H01L29/775

    摘要: A system is provided and includes a wafer and a mask. The wafer includes a silicon-on-insulator (SOI) structure disposed on a buried oxide (BOX) layer and has a first region with a first SOI thickness and a second region with a second SOI thickness, the first and second SOI thicknesses being different from one another and sufficiently large such that respective pairs of SOI pads connected via respective nanowires with different thicknesses are formable therein. The mask covers one of the first and second regions and prevents a thickness change of the other of the first and second regions from having effect at the one of the first and second regions.

    摘要翻译: 提供了一种系统,其包括晶片和掩模。 晶片包括设置在掩埋氧化物(BOX)层上的绝缘体上硅(SOI)结构,并且具有第一SOI厚度的第一区域和具有第二SOI厚度的第二区域,第一和第二SOI厚度不同 并且足够大,使得通过具有不同厚度的相应纳米线连接的各对SOI焊盘成为可能。 掩模覆盖第一和第二区域中的一个并且防止第一和第二区域中的另一个区域的厚度变化在第一和第二区域中的一个区域具有效果。

    Medication dispenser system with exact personal dosing

    公开(公告)号:US12094583B2

    公开(公告)日:2024-09-17

    申请号:US17516362

    申请日:2021-11-01

    IPC分类号: G16H20/13 B65B3/00 G16H10/60

    摘要: A medication dispenser system and use thereof for providing exact personal dosing for a patient are provided. In one aspect, a method for dispensing medications is provided. The method includes the steps of: obtaining patient information and a list of the medications for the patient; calculating a personal dose of each of the medications for the patient using the patient and cross-medication interaction information; and preparing treatments each containing the personal dose of each of the medications in a single treatment. In another aspect a system for dispensing medications includes: a patient information component for obtaining patient information and a list of the medications for the patient; a dosage calculator component for calculating a personal dose of each of the medications for the patient using the patient information; and a medication dispenser component for preparing treatments each containing the personal dose of each of the medications in a single treatment.

    NONVOLATILE PHASE CHANGE MATERIAL LOGIC DEVICE

    公开(公告)号:US20230083308A1

    公开(公告)日:2023-03-16

    申请号:US17472836

    申请日:2021-09-13

    IPC分类号: G11C13/00 H01L45/00 H01L27/24

    摘要: A method for forming a nonvolatile PCM logic device may include providing a PCM film component having a first end contact distally opposed from a second end contact, positing a first proximity adjacent to a first surface of the PCM film component, positing a second proximity heater adjacent to a second surface of the PCM film component, wherein the first proximity heater and the second proximity heater are electrically isolated from the PCM film component. The method may further include applying a combination of pulses to one or more of the first proximity heater and the second proximity heater to change a resistance value of the PCM film component corresponding to a logic truth table. Further, the method may include simultaneously applying a first combination of reset pulses to program, or set pulses to initialize, the PCM film component, to the first proximity heater and the second proximity heater.