公开(公告)号：US20140264652A1

公开(公告)日：2014-09-18

申请号：US13950240

申请日：2013-07-24

Applicant: Invensense, Inc.

Inventor： Baris Cagdaser ,  Martin Lim ,  Fariborz Assaderaghi

IPC: B81B3/00

CPC classification number: H04R19/04 ,  H04R19/005 ,  H04R2201/003

Abstract: An integrated MEMS acoustic sensor has a MEMS transducer and a programmable electronic interface. The programmable electronic interface includes non-volatile memory and is coupled to the MEMS transducer. Using programmable electrical functions, the programmable electronic interface is operable to sense variations in the MEMS transducer caused by application of an acoustic pressure to the MEMS transducer.

Abstract translation: 集成的MEMS声学传感器具有MEMS传感器和可编程电子接口。 可编程电子接口包括非易失性存储器并耦合到MEMS换能器。 使用可编程电气功能，可编程电子接口可操作以感测通过向MEMS换能器施加声压而引起的MEMS换能器中的变化。

公开(公告)号：US10532926B2

公开(公告)日：2020-01-14

申请号：US15358956

申请日：2016-11-22

Applicant: INVENSENSE, INC.

Inventor： Michael Daneman ,  Martin Lim ,  Kegang Huang ,  Igor Tchertkov

IPC: B81B7/02 ,  B81C1/00

Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.

公开(公告)号：US20180336390A1

公开(公告)日：2018-11-22

申请号：US15601934

申请日：2017-05-22

Applicant: INVENSENSE, INC.

Inventor： Fang Liu ,  Peter Hartwell ,  Martin Lim

IPC: G06K9/00

CPC classification number: G06K9/0002 ,  G06K9/00107 ,  G06K9/00906 ,  G06K9/2018 ,  G06K9/6293

Abstract: Facilitating live fingerprint detection utilizing an integrated ultrasound and infrared (IR) sensor is presented herein. A fingerprint sensor can comprise a first substrate comprising the IR sensor, and a second substrate comprising an ultrasonic transducer. The second substrate is attached to a top portion of the first substrate, and a temperature output of the IR sensor facilitates a determination that a fingerprint output of the ultrasonic transducer corresponds to a finger. The IR sensor can comprise polysilicon comprising a thermopile and an array of photonic crystals thermally coupled to the thermopile.

公开(公告)号：US10093533B2

公开(公告)日：2018-10-09

申请号：US15711890

申请日：2017-09-21

Applicant: InvenSense, Inc.

Inventor： Peter Smeys ,  Martin Lim

IPC: B81B7/00

Abstract: A sensor chip includes a first substrate with a first surface and a second surface including at least one CMOS circuit, a first MEMS substrate with a first surface and a second surface on opposing sides of the first MEMS substrate, a second substrate, a second MEMS substrate, and a third substrate including at least one CMOS circuit. The first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the first MEMS substrate. The second surface of the first MEMS substrate is attached to the second substrate. The first substrate, the first MEMS substrate, the second substrate and the packaging substrate are provided with electrical inter-connects.

公开(公告)号：US09731963B2

公开(公告)日：2017-08-15

申请号：US15265668

申请日：2016-09-14

Applicant: InvenSense, Inc.

Inventor： Cerina Zhang ,  Martin Lim ,  Jongwoo Shin ,  Joseph Seeger

IPC: H01L23/02 ,  B81C1/00 ,  B81B7/02 ,  B81B7/00

CPC classification number: B81C1/00301 ,  B81B7/007 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/0023 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00269 ,  B81C2201/0104 ,  B81C2201/0132 ,  B81C2203/0145 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/0792

Abstract: Semiconductor manufacturing processes include providing a first substrate having a first passivation layer disposed above a patterned top-level metal layer, and further having a second passivation layer disposed over the first passivation layer; the second passivation layer has a top surface. The processes further include forming an opening in a first portion of the second passivation layer, and the opening exposes a portion of a surface of the first passivation layer. The processes further include patterning the second and first passivation layers to expose portions of the patterned top-level metal layer and bonding a second substrate and the first substrate to each other. The bonding occurs within a temperature range in which at least the exposed portion of the first passivation layer undergoes outgassing.

公开(公告)号：US09621975B2

公开(公告)日：2017-04-11

申请号：US14558911

申请日：2014-12-03

Applicant: INVENSENSE, INC.

Inventor： Fang Liu ,  Martin Lim

IPC: H04R3/00 ,  H04R1/08 ,  H04R19/00

CPC classification number: H04R1/08 ,  H04R19/005 ,  H04R2201/003

Abstract: A micro electro-mechanical system (MEMS) device is provided. The MEMS device includes: a first substrate having a first surface and a second surface, and a port disposed through the first substrate, wherein the port is configured to receive acoustic waves and wherein the first surface is exposed to an environment outside the MEMS device; and a diaphragm coupled to and facing the second surface and configured to deflect in response to pressure differential at the diaphragm in response to the received acoustic waves. The MEMS device also includes a second substrate coupled to and facing the diaphragm, and including circuitry, wherein the second substrate includes a recess region forming an integrated back cavity in the MEMS device. The MEMS device also includes an electrical connection electrically coupling the first substrate and the second substrate and configured to transmit an electrical signal indicative of the deflection of the diaphragm.

公开(公告)号：US09556019B2

公开(公告)日：2017-01-31

申请号：US14705630

申请日：2015-05-06

Applicant: InvenSense, Inc.

Inventor： Michael Dueweke ,  Martin Lim

IPC: H01L29/84 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81B7/0038 ,  B81B7/02 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00285 ,  B81C1/00293 ,  B81C2201/0161 ,  B81C2203/0785

Abstract: A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by the at least two substrates. In a second aspect, the system comprises a MEMS device that includes a first substrate, a second substrate bonded to the first substrate, wherein at least one enclosure is located between the first and the second substrates, a metal layer within one of the first substrate and the second substrate, and a material vertically oriented over the metal layer, wherein when the material is heated the material changes a pressure within the at least one enclosure.

Abstract translation: 公开了一种用于改变MEMS装置中的至少一个外壳内的压力的方法和系统。 在第一方面，所述方法包括将激光通过所述至少两个基板之一施加到当暴露于所述激光器时改变至少一个外壳内的压力的材料，其中所述至少一个外壳由所述至少两个基板形成 底物。 在第二方面，该系统包括MEMS器件，其包括第一衬底，与第一衬底结合的第二衬底，其中至少一个外壳位于第一和第二衬底之间，第一衬底之一内的金属层 和第二基底以及垂直取向在金属层上的材料，其中当材料被加热时，材料改变至少一个外壳内的压力。

公开(公告)号：US09227842B2

公开(公告)日：2016-01-05

申请号：US14084569

申请日：2013-11-19

Applicant: Invensense, Inc.

Inventor： Michael Julian Daneman ,  Mei-Lin Chan ,  Martin Lim ,  Fariboz Assaderaghi ,  Erhan Polatkan Ata

IPC: H01L21/00 ,  B81C1/00

CPC classification number: B81C1/00246 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00158 ,  B81C2201/112 ,  B81C2203/0118 ,  B81C2203/0742 ,  B81C2203/0792 ,  H01L2224/83805

Abstract: A method for fabricating a MEMS device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate. Further, a second sacrificial layer is formed on top of the conductive structure layer. Patterning and etching of the silicon substrate is performed stopping at the second sacrificial layer. Additionally, the MEMS substrate is bonded to a CMOS wafer, the CMOS wafer having formed thereupon a metal layer. An electrical connection is formed between the MEMS substrate and the metal layer.

Abstract translation: 一种用于制造MEMS器件的方法包括将第一牺牲层沉积并图案化到硅衬底上，第一牺牲层被部分去除留下第一剩余氧化物。 此外，该方法包括在硅衬底上沉积导电结构层，导电结构层与硅衬底的至少一部分进行物理接触。 此外，在导电结构层的顶部上形成第二牺牲层。 在第二牺牲层停止硅衬底的图案化和蚀刻。 此外，MEMS衬底被结合到CMOS晶片，其上形成有金属层的CMOS晶片。 在MEMS衬底和金属层之间形成电连接。

公开(公告)号：US09114977B2

公开(公告)日：2015-08-25

申请号：US13687304

申请日：2012-11-28

Applicant: InvenSense, Inc.

Inventor： Michael J. Daneman ,  Martin Lim ,  Xiang Li ,  Li-Wen Hung

IPC: H01L29/87 ,  B81C3/00 ,  B81B3/00

CPC classification number: B81B3/0086 ,  B81B2207/07 ,  B81C3/001 ,  B81C2201/019

Abstract: MEMS device for low resistance applications are disclosed. In a first aspect, the MEMS device comprises a MEMS wafer including a handle wafer with one or more cavities containing a first surface and a second surface and an insulating layer deposited on the second surface of the handle wafer. The MEMS device also includes a device layer having a third and fourth surface, the third surface bonded to the insulating layer of the second surface of handle wafer; and a metal conductive layer on the fourth surface. The MEMS device also includes CMOS wafer bonded to the MEMS wafer. The CMOS wafer includes at least one metal electrode, such that an electrical connection is formed between the at least one metal electrode and at least a portion of the metal conductive layer.

Abstract translation: 公开了用于低电阻应用的MEMS器件。 在第一方面，MEMS器件包括MEMS晶片，其包括具有包含第一表面和第二表面的一个或多个腔的手柄晶片和沉积在手柄晶片的第二表面上的绝缘层。 MEMS器件还包括具有第三和第四表面的器件层，第三表面结合到处理晶片的第二表面的绝缘层; 和在第四表面上的金属导电层。 MEMS器件还包括结合到MEMS晶片的CMOS晶片。 CMOS晶片包括至少一个金属电极，使得在至少一个金属电极和金属导电层的至少一部分之间形成电连接。

公开(公告)号：US08692340B1

公开(公告)日：2014-04-08

申请号：US13800061

申请日：2013-03-13

Applicant: InvenSense, Inc.

Inventor： Erhan Polatkan Ata ,  Martin Lim ,  Xiang Li ,  Stephen Lloyd ,  Michael Julian Daneman

IPC: H01L29/82

CPC classification number: B81B7/0061 ,  B81B3/001 ,  B81B2201/0257 ,  B81B2203/053 ,  B81B2203/058 ,  B81B2207/012 ,  H04R19/005

Abstract: A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.

Abstract translation: 公开了MEMS器件。 MEMS器件包括具有第一表面和第二表面的第一板; 以及附接到第一基板的锚。 MEMS器件还包括具有附接到第一板的第三表面和第四表面的第二板。 连杆将锚固件连接到第一板，其中第一板和第二板在第一板的第一和第二表面之间存在声压差的情况下移位。 第一板，第二板，连杆和锚固件都包含在由第一基板和第二基板形成的外壳中，其中第一和第二基板中的一个包含通孔，以将第一板的第一表面暴露于 环境。