公开(公告)号：US08092937B2

公开(公告)日：2012-01-10

申请号：US12100952

申请日：2008-04-10

申请人： Kazuhito Hatta ,  Masato Sato ,  Hiroyuki Yamada ,  Takehiko Suwa ,  Toshio Koishikawa

发明人： Kazuhito Hatta ,  Masato Sato ,  Hiroyuki Yamada ,  Takehiko Suwa ,  Toshio Koishikawa

IPC分类号： H01M2/02 ,  H01M2/10

CPC分类号： H01M2/021 ,  H01M2/0212 ,  H01M2/0217 ,  H01M2/0275 ,  H01M2/0287 ,  H01M2/1061 ,  H01M10/052

摘要： A battery pack includes a non-aqueous electrolyte secondary battery, a rigid covering member, and a protection circuit board. The secondary battery includes a battery element and a flexible covering member formed of a first laminated film composed of a first heat-bonding layer, a first metal layer, and a first outer covering layer laminated successively. The flexible covering member is sealed along around the battery element while leaving electrode terminals of the positive and negative electrodes extended outside the battery element. The rigid covering member is formed of a second laminated film composed of a second heat-bonding layer, a second metal layer, and a second outer covering layer laminated successively. The flexible covering member and the rigid covering member are bonded with an adhesive strength equal to or higher than atmospheric pressure and with a peel strength equal to or lower than a breaking strength of the flexible covering member.

摘要翻译： 电池组包括非水电解质二次电池，刚性覆盖件和保护电路板。 二次电池包括电池元件和由第一层叠膜形成的柔性覆盖部件，第一层压膜由相继层压的第一热粘合层，第一金属层和第一外覆盖层构成。 柔性覆盖件围绕电池元件密封，同时使正极和负极的电极端子延伸到电池元件外部。 刚性覆盖部件由依次层叠的第二热粘合层，第二金属层和第二外覆层构成的第二层叠膜形成。 柔性覆盖构件和刚性覆盖构件以等于或大于大气压力的粘合强度并且具有等于或低于柔性覆盖构件的断裂强度的剥离强度粘合。

公开(公告)号：US20110253109A1

公开(公告)日：2011-10-20

申请号：US13125106

申请日：2009-10-29

申请人： Satoshi Usui ,  Shingo Tamura ,  Katsumi Miyazaki ,  Hiroyuki Yamada

发明人： Satoshi Usui ,  Shingo Tamura ,  Katsumi Miyazaki ,  Hiroyuki Yamada

IPC分类号： F02M37/04

CPC分类号： F02M59/44 ,  F02M39/02 ,  F02M59/102 ,  F02M59/366 ,  F02M2200/02 ,  F02M2200/85 ,  F04B1/0404 ,  F04B1/0408 ,  F04B1/0421 ,  F04B1/0439 ,  F04B53/168

摘要： It is an object of the present invention to accurately position a cylinder of a high-pressure fuel pump with respect to an attachment fitting hole provided in an engine block of an internal combustion engine in mounting the pump on the engine block.The high-pressure fuel pump of the invention is provided with a holder including: an outer cylindrical surface portion fitted to a high-pressure fuel pump attachment fitting hole installed on an engine block of the internal combustion engine; and a cylindrical fitting portion fitted to an outer circumference of the cylinder of the pump. The holder is configured such that the outer cylindrical surface portion and the cylindrical fitting portion are formed in a single piece resulting from machining one and the same member. Such a configuration can achieve the above-mentioned object. The central axis of an insertion hole of the piston plunger installed in the cylinder easily provides coaxiality with respect to the central axis of the attachment fitting hole installed in the engine block of the internal combustion engine. Biting and wear between the cylinder and the piston plunger, which are caused by the side force applied to the piston plunger by a drive mechanism, can be reduced.

摘要翻译： 本发明的目的在于，将设置在内燃机的发动机缸体中的安装配合孔相对于高压燃料泵的缸体精确地定位在发动机缸体上。 本发明的高压燃油泵设置有一个保持器，该保持器包括：一个安装在内燃机的发动机缸体上的高压燃油泵附件安装孔的外圆筒表面部分; 以及装配到所述泵的所述气缸的外周的圆筒形配合部。 保持器构造成使得外圆筒形表面部分和圆柱形装配部分形成为通过加工同一构件而形成的单件。 这样的结构可以实现上述目的。 安装在气缸中的活塞柱塞的插入孔的中心轴容易地提供相对于安装在内燃机的发动机缸体中的安装配件孔的中心轴的同轴度。 可以减少由驱动机构施加到活塞柱塞的侧向力引起的气缸和活塞柱塞之间的咬合和磨损。

公开(公告)号：US20110243759A1

公开(公告)日：2011-10-06

申请号：US13133471

申请日：2009-11-10

申请人： Takayoshi Ozaki ,  Hiroyuki Yamada ,  Kenichi Suzuki ,  Ken Sugiura

发明人： Takayoshi Ozaki ,  Hiroyuki Yamada ,  Kenichi Suzuki ,  Ken Sugiura

IPC分类号： F04B49/00 ,  F04D29/54

CPC分类号： A61M1/101 ,  A61M1/1015 ,  A61M1/1017 ,  A61M1/1031 ,  A61M1/1086 ,  A61M1/122 ,  F04D13/0666 ,  F04D29/0413 ,  F04D29/048 ,  F16C32/0402 ,  F16C33/107 ,  F16C2316/18 ,  H02K5/1282 ,  H02K7/14 ,  H02K21/24

摘要： A centrifugal blood pump apparatus includes an impeller provided in a blood chamber, a permanent magnet provided in one surface of the impeller, a permanent magnet provided in an inner wall of the blood chamber, a permanent magnet provided in the other surface of the impeller, and a magnetic material and a coil provided in a motor chamber for driving the impeller to rotate via a diaphragm. Grooves for hydrodynamic bearing are formed in the diaphragm facing the impeller, and in the inner wall of the blood chamber, respectively. As a result, the impeller can be smoothly activated to drive by controlling a coil current.

摘要翻译： 离心式血液泵装置包括设置在血液室中的叶轮，设置在叶轮的一个表面中的永磁体，设置在血液室的内壁中的永磁体，设置在叶轮的另一个表面中的永磁体， 以及设置在电动机室中的磁性材料和线圈，用于驱动叶轮经由隔膜旋转。 用于流体动力轴承的槽形成在面向叶轮的隔膜中，并分别形成在血液室的内壁中。 结果，可以通过控制线圈电流来平稳地启动叶轮来驱动叶轮。

公开(公告)号：US07939923B2

公开(公告)日：2011-05-10

申请号：US12160954

申请日：2007-01-31

申请人： Hidenobu Nishikawa ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Atsunobu Iwamoto

发明人： Hidenobu Nishikawa ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Atsunobu Iwamoto

IPC分类号： H01L23/02

CPC分类号： G06K19/077 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/5388 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L24/95 ,  H01L25/0655 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A memory card includes a circuit board, a first semiconductor chip mounted on the circuit board with a bump sandwiched between the first semiconductor chip and the circuit board, a second semiconductor chip mounted on the circuit board with a bump sandwiched between the second semiconductor chip and the circuit board with a clearance not greater than 1 mm between the first semiconductor chip and the second semiconductor chip, a first sealing resin layer surrounding the bump and existing between the first semiconductor chip and the circuit board, and a second sealing resin layer surrounding the bump and existing between the second semiconductor chip and the circuit board, and a cover covering the first semiconductor chip, the second semiconductor chip on a principal face of the circuit board.

摘要翻译： 存储卡包括电路板，安装在电路板上的第一半导体芯片，其中夹在第一半导体芯片和电路板之间的凸块;第二半导体芯片，安装在电路板上，凸块夹在第二半导体芯片和 在第一半导体芯片和第二半导体芯片之间具有不大于1mm的间隙的电路板，围绕凸块并存在于第一半导体芯片和电路板之间的第一密封树脂层和围绕第一半导体芯片的电路板的第二密封树脂层 并且存在于第二半导体芯片和电路板之间的凸起，以及覆盖第一半导体芯片的盖，电路板的主面上的第二半导体芯片。

公开(公告)号：US07933127B2

公开(公告)日：2011-04-26

申请号：US12160960

申请日：2007-01-24

申请人： Hidenobu Nishikawa ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Atsunobu Iwamoto

发明人： Hidenobu Nishikawa ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Atsunobu Iwamoto

IPC分类号： H05K7/02

CPC分类号： H05K1/141 ,  H01L23/5388 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/181 ,  H05K1/182 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/1316 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A memory card includes a first circuit board, a first semiconductor chip mounted to a top face of the first circuit board with a part of its under face confronting the first circuit board, a second circuit board of which a top face is bonded to a under face of the first circuit board, a second semiconductor chip mounted to the top face of the second circuit board with at least a part of the second semiconductor chip confronting a part of another part other than the part of the under face of the first semiconductor chip, and a cover disposed over the top face of the second circuit board for covering the first semiconductor chip, the first circuit board and the second semiconductor chip.

摘要翻译： 存储卡包括第一电路板，第一半导体芯片，其安装到第一电路板的顶面，其第一电路板的下表面的一部分，第二电路板，其顶面接合到下部 第一电路板的表面，安装到第二电路板的顶面的第二半导体芯片，其中第二半导体芯片的至少一部分面对除了第一半导体芯片的下表面的一部分之外的另一部分的一部分 以及设置在所述第二电路板的顶面上的覆盖所述第一半导体芯片，所述第一电路板和所述第二半导体芯片的盖。

公开(公告)号：US07757667B2

公开(公告)日：2010-07-20

申请号：US12426586

申请日：2009-04-20

申请人： Takashi Okamoto ,  Hiroyuki Yamada ,  Kousaku Shimada ,  Koji Matsufuji

发明人： Takashi Okamoto ,  Hiroyuki Yamada ,  Kousaku Shimada ,  Koji Matsufuji

IPC分类号： F02M37/04 ,  F02M37/06

CPC分类号： F02D41/3845 ,  F02D41/1401 ,  F02D2041/2027 ,  F02D2200/0602 ,  F02D2200/503 ,  F02D2250/31 ,  F02M59/20 ,  F02M59/366 ,  F02M63/0225 ,  F04B49/243

摘要： A high-pressure fuel pump of an internal combustion engine has a fuel injection valve provided on a cylinder. The high-pressure fuel pump is for pumping fuel to the fuel injection valve, and has a pressure chamber, a plunger for pressurizing the fuel in the pressure chamber, a fuel valve provided in the pressure chamber, and an actuator for operating the fuel valve. A control device has means for calculating the drive signal of the actuator so as to realize the variable discharge of the high-pressure fuel pump. The end timing of the drive signal is limited or restricted so that an attraction force of a solenoid coil is not maintained at the bottom dead center of the plunger in case that the required discharge to the fuel pump is less than the total discharge.

摘要翻译： 内燃机的高压燃料泵具有设置在气缸上的燃料喷射阀。 高压燃料泵用于将燃料泵送到燃料喷射阀，并具有压力室，用于对压力室中的燃料加压的柱塞，设置在压力室中的燃料阀，以及用于操作燃料阀的致动器 。 控制装置具有用于计算致动器的驱动信号的装置，以便实现高压燃料泵的可变排放。 驱动信号的结束时机被限制或限制，使得在对燃料泵的所需放电小于总放电的情况下，螺线管线圈的吸引力不会保持在柱塞的下死点。

公开(公告)号：US07757663B2

公开(公告)日：2010-07-20

申请号：US12138044

申请日：2008-06-12

申请人： Satoshi Usui ,  Kenichiro Tokuo ,  Hiroyuki Yamada ,  Masami Abe ,  Hiroshi Odakura

发明人： Satoshi Usui ,  Kenichiro Tokuo ,  Hiroyuki Yamada ,  Masami Abe ,  Hiroshi Odakura

IPC分类号： F02M59/46 ,  F02M37/04 ,  F04B11/00

CPC分类号： F02D41/20 ,  F02D2041/2027 ,  F02D2041/2058 ,  F02M59/102 ,  F02M59/367 ,  F02M63/0017 ,  F02M63/0035 ,  F02M63/0225 ,  F02M63/024 ,  F02M2200/09 ,  F02M2200/315

摘要： The objective of the present invention is to dampen operating sounds of an electromagnetic drive mechanism used for a variable displacement to reduce an individual difference depending on apparatus due to the control mechanism in a high-pressure fuel supply pump change over time or installation tolerance.To achieve the above objective, the present invention is configured such that before the electromagnetic drive mechanism supplies a drive force to a plunger which is electromagnetically driven by the electromagnetic drive mechanism, another displacement force situates the plunger in a specific position. When compared to an occasion where the plunger is displaced all strokes by a magnetic biasing force, the above configuration is able to reduce the force of impact on a member (for example, valve body) mounted to the plunger and a restricting member, thereby damping the collision noise. Furthermore, since an extra member, such as a damping member, is not required, individual difference depending on apparatus do not easily occur.

摘要翻译： 本发明的目的是抑制用于可变排量的电磁驱动机构的操作声音，以减少由于高压燃料供应泵随时间的变化或安装公差的控制机构而导致的装置的个体差异。 为了实现上述目的，本发明被构造成使得在电磁驱动机构向由电磁驱动机构进行电磁驱动的柱塞供给驱动力之前，另一个位移力使柱塞位于特定位置。 当与柱塞通过磁偏置力移动所有冲程的情况相比，上述构造能够减小对安装到柱塞和限制构件的构件（例如，阀体）的冲击力，从而阻尼 碰撞噪音。 此外，由于不需要诸如阻尼构件的额外构件，因此不容易发生根据装置的个体差异。

公开(公告)号：US20100157550A1

公开(公告)日：2010-06-24

申请号：US12160960

申请日：2007-01-24

申请人： Hidenobu Nishikawa ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Atsunobu Iwamoto

发明人： Hidenobu Nishikawa ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Atsunobu Iwamoto

IPC分类号： H05K5/00 ,  H05K3/30

CPC分类号： H05K1/141 ,  H01L23/5388 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/181 ,  H05K1/182 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/1316 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A memory card includes a first circuit board, a first semiconductor chip mounted to a top face of the first circuit board with a part of its under face confronting the first circuit board, a second circuit board of which a top face is bonded to a under face of the first circuit board, a second semiconductor chip mounted to the top face of the second circuit board with at least a part of the second semiconductor chip confronting a part of another part other than the part of the under face of the first semiconductor chip, and a cover disposed over the top face of the second circuit board for covering the first semiconductor chip, the first circuit board and the second semiconductor chip.

摘要翻译： 存储卡包括第一电路板，第一半导体芯片，其安装到第一电路板的顶面，其第一电路板的下表面的一部分，第二电路板，其顶面接合到下部 第一电路板的表面，安装到第二电路板的顶面的第二半导体芯片，其中第二半导体芯片的至少一部分面对除了第一半导体芯片的下表面的一部分之外的另一部分的一部分 以及设置在所述第二电路板的顶面上的覆盖所述第一半导体芯片，所述第一电路板和所述第二半导体芯片的盖。

公开(公告)号：US07633723B2

公开(公告)日：2009-12-15

申请号：US10569089

申请日：2004-06-04

申请人： Yoshinori Tokura ,  Masashi Kawasaki ,  Hiroyuki Yamada ,  Yoshihiro Ogawa ,  Yoshio Kaneko

发明人： Yoshinori Tokura ,  Masashi Kawasaki ,  Hiroyuki Yamada ,  Yoshihiro Ogawa ,  Yoshio Kaneko

IPC分类号： G11B5/39 ,  G11C11/00

CPC分类号： B82Y25/00 ,  G01R33/06 ,  G11B5/3903 ,  H01F10/3254 ,  H01L43/08

摘要： To provide a tunnel junction device having a high MR ratio even at room temperature, a tunneling film as a nonmagnetic layer of three-layer structure of LaMnO3/SrTiO3/LaMnO3 is arranged between a ferromagnetic metal material La0.6Sr0.4MnO3 (12) and a ferromagnetic metal film material La0.6Sr0.4MnO3 (14). The tunneling film comprises two unit layers of LaMnO3 (13A) arranged on the ferromagnetic metal material La0.6Sr0.4MnO3 (12); five unit layers of SrTiO3 (13B); and two unit layers of LaMnO3 (13C) arranged at the interface between the SrTiO3 (13B) and the ferromagnetic metal film material La0.6Sr0.4MnO3 (14).

摘要翻译： 为了提供即使在室温下也具有高MR比的隧道结装置，作为LaMnO 3 / SrTiO 3 / LaMnO 3的三层结构的非磁性层的隧道膜设置在强磁性金属材料La0.6Sr0.4MnO3（12）和 铁磁金属膜材料La0.6Sr0.4MnO3（14）。 隧道膜包括布置在强磁性金属材料La0.6Sr0.4MnO3（12）上的两个单位层的LaMnO3（13A）; 五个单位层的SrTiO3（13B）; 和布置在SrTiO 3（13B）和铁磁性金属膜材料La0.6Sr0.4MnO3（14）之间的界面处的LaMnO 3（13C）的两个单位层。

公开(公告)号：US07632813B2

公开(公告)日：2009-12-15

申请号：US11587557

申请日：2005-04-25

申请人： Yasuo Ochi ,  Makoto Tanaka ,  Naoki Kawada ,  Hiroyuki Yamada ,  Hiroshi Mori ,  Ryouji Kayasuga

发明人： Yasuo Ochi ,  Makoto Tanaka ,  Naoki Kawada ,  Hiroyuki Yamada ,  Hiroshi Mori ,  Ryouji Kayasuga

IPC分类号： A61K31/70 ,  A61K31/425

CPC分类号： A61K45/06 ,  A61K31/4015 ,  A61K31/426 ,  A61K31/427 ,  A61K38/29 ,  A61K2300/00

摘要： The present invention relates to an agent for increasing BMD characterized by use of a cathepsin K inhibitor as a bone resorption inhibitor in combination with a type of PTH as a bone formation stimulator. This agent for increasing BMD is useful for the treatment of osteoporosis, bone fracture, arthritis, rheumatoid arthritis, osteoarthritis, hypercalcemia, osteometastasis of carcinoma, periodontal disease, bone Paget's disease and other bone metabolic diseases. For example, as the cathepsin K inhibitor, there can be mentioned a compound of formula (W) and a salt thereof, etc.

摘要翻译： 本发明涉及用于增加BMD的试剂，其特征在于使用组织蛋白酶K抑制剂作为骨吸收抑制剂与一种PTH作为骨形成刺激剂的组合。 用于增加BMD的该药物可用于治疗骨质疏松症，骨折，关节炎，类风湿性关节炎，骨关节炎，高钙血症，癌的骨转移，牙周病，骨佩吉特氏病和其他骨代谢疾病。 例如，作为组织蛋白酶K抑制剂，可以举出式（W）的化合物及其盐等。